At&t Bell Laboratories

American Telephone & Telegraph Co., At&t Bell Laboratories

Robert J Gashler

Michael Gregory German

Paul A Baker

Rocco Bonanni

Dominic T Lipari

Max S Robin

William R Lambert

Howard C Schell

Kaushik S Akkapeddi

Richard M Arnold

Coleen A Drucker

Eugene C Schramm

Disclosed is a device for electrically coupling stocked circuit boards using conductive polymer interconnect material and a spacer element. In one embodiment, coaxial connection is provided by means of an array of wires within undulating metal envelopes. In another embodiment, pins are provided within holes in a plastic spacer. In a third embodiment, wires are laid on a substrate and successive laminations are built up to form the spacer element. In a fourth embodiment, wire arrays are extrusion molded within thermoplastic sheets which are laminated to form the spacer element.

High density connector for stacked circuit boards

Disclosed is a high frequency connector employing a plurality of columns of female contacts for receiving signal carriers and ground/power blades providing shielding between the columns of female contacts. The signal and ground/power blades are coupled to a circuit pack by means of a plurality of flexible circuit sheets. The connector provides full shielding of the signal carriers to the backplane.

High frequency connector

Growing community of inventors

Olathe, KS, United States of America

Robert J Gashler