International Business Machines Corporation

Robert J Foster

Lin Zhou

Roger M Young

Clemente Bottini

Shahin Zangooie

Ronald D Fiege

Shahin Zangodie

A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool including at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact.

Alignment correction system and method of use

A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool that includes at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact.

A system and method for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool comprising at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact. The method comprises measuring current on each branch of a circuit and calculating an angle of a wafer based on a difference in the current on each branch of the circuit.

A sample stage for performing measurements using an optical metrology system includes at least one sample section for retention of a sample, and components for controlling orientation of the sample section with relation to the optical metrology system. A method and a computer program product are provided.

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Robert J Foster