Usm Corporation

Emhart Industries, Inc.

Autoroll Machine Company, LLC

Emhart Enterprises Corp.

Robert J Duncan

Jean A McLean

William M Karlyn

Richard M Elliott

Steven M Whitman

Michael J Averill

Marc M Landman

Jean A Fleming

George H Medidge, Jr

Gerald W Cleversey

A method and apparatus for automatically adjusting the location of a screen frame holder of a silk screen printing head in the x-axis to maintain accuracy in registration of color-to-color in a multi-color printing process due to the inaccuracies in indexing of an indexing transport member.

Apparatus and method for automatically adjusting the position of a

Apparatus for performing a non-contact three-dimensional inspection of a surface-mount component prior to placement on a printed circuit board. Specifically, an arrangement to ensure acceptable alignment (i.e. coplanarity) of all component heads in the XZ or YZ plane, where XY is the plane of the component. The apparatus is embodied within a conventional pick and place machine and performs critical, in-process, lead coplanarity inspection.

Surface mount machine with lead coplanarity verifier

Method and apparatus are disclosed for analyzing an image produced by a camera focused on the leads of a component that have been inserted into a printed circuit board by a component insertion machine. The method and apparatus include the construction of arrays of information pertaining to individual leads that should be present in the image produced by the camera. Individual strings of pixel information in the form of binary encoded bits within each array are analyzed for the presence of a pattern of bits that would indicate a lead. The method and apparatus are operative with respect to a pixel resolution that may only produce a single properly encoded bit per width of inserted lead.

Lead sense system for component insertion machine

A system is disclosed for verifying the proper insertion of the leads of an electrical component. The system includes a camera mounted within a component insertion machine. The camera image is stored within the system and analyzed for the absence of any leads that should have been inserted.

Electronic components are deposited in conveyor buckets in a desired sequence to define repetitive groups of components. These components are delivered to an insertion head for insertion into a circuit board. When a component is not properly inserted, the system stops and a replacement part is delivered by a replacement mechanism to an empty bucket on the conveyor. This empty bucket follows the buckets which held the group of components for the board being loaded.

Combined sequencing and insertion machine

A variable insertion rate control system for a component insertion machine is disclosed. An insertion rate is read and retained by the control system which thereafter authorizes insertion of components at the indicated insertion rate. In order to achieve relatively high insertion rates, the downward stroke of the component insertion head is commanded before the receiving medium is registered in position for receiving the component.

Variable rate control logic for component insertion machine

A testing system is provided within a component insertion machine for testing a component immediately prior to its insertion into a printed circuit board. The insertion of the component is conditioned upon the successful passage of one or more tests that are dictated for the particular component. Each test includes the selective application of one or more test signals to predefined inputs on the component. Each test futhermore includes a limited application of a particular power condition. A successful passage of the prescribed tests will result in an authorization to insert the component into the printed circuit board.

Electrical component testing system for component insertion machine

In a hot melt adhesive dispensing gun, an electronic circuit is constructed to enable the operator to set a desired temperature to which the glue is heated. This set point is automatically raised a predetermined amount when the glue is flowing in order to compensate for the drop in temperature caused by the loss of heat to the glue and atmosphere.

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Magnolia, MA, United States of America

Robert J Duncan