International Rectifier Corporation

Infineon Technologies Austria Ag

Infineon Technologies Americas Corp.

Robert J Clarke

Martin Standing

Andrew P Roberts

Marcus Pawley

Mark Pavier

Andrew Neil Sawle

Kenneth McCartney

In an embodiment, an electronic component includes a power semiconductor device embedded in a dielectric core layer and at least one contact layer protruding from a first side face of the dielectric core layer. The contact layer includes an electrically insulating layer and at least one contact pad arranged on the electrically insulating layer. The at least one contact pad is electrically coupled with the power semiconductor device.

Electronic component, system and method

In an embodiment, a method includes inserting an electronic component including a power semiconductor device embedded in a dielectric core layer into a slot in a side face of a circuit board. The inserting the electronic component causes one or more electrically conductive contacts on one or more surfaces of the electronic component to electrically couple with one or more corresponding electrical contacts arranged on one or more surfaces of the slot.

Method of inserting an electronic component into a slot in a circuit board

A power semiconductor package that includes a semiconductor die having at least two power electrodes and a conductive clip electrically and mechanically coupled to each power electrode.

Power semiconductor package with conductive clips

Power semiconductor package

A method for manufacturing a semiconductor package that includes forming a frame inside a conductive can, the frame being unwettable by liquid solder.

Conductive chip-scale package

Chip-scale package

A semiconductor package fabrication method in which drop on demand deposition of a drop on demand depositable material is used to prepare one component or a plurality of components of a semiconductor package or multi-chip module.

Growing community of inventors

Kent, United Kingdom

Robert J Clarke