Advanced Micro Devices Corporation

Globalfoundries Inc.

Other

Robert J Chong

Alexander James Pasadyn

Eric Omar Green

Richard J Markle

Christopher Allen Bode

Thomas J Sonderman

Matthew A Purdy

Jin Wang

Elfido Coss, Jr

Brian K Cusson

Gregory A Cherry

Howard Ernest Castle

Michael Lee Miller

Si-Zhao J Qin

Ernest Dean Adams, Iii

J Broc Stirton

Douglas C Kimbrough

A method and an apparatus are provided for parallel fault detection. The method comprises receiving data associated with processing of a workpiece by a first processing tool, receiving data associated with processing of a workpiece by a second processing tool and comparing at least a portion of the received data to a common fault model to determine if a fault associated with at least one of the processing of the workpiece by the first processing tool and processing of the workpiece by the second processing tool occurred.

Parallel fault detection

A method includes retrieving a group test parameter determined based on test results associated with a plurality of integrated circuit devices. A particular integrated circuit device is tested using a test program and the group test parameter.

Method and apparatus for dynamically determining tester recipes

A method includes defining a plurality of objectives for a film formation process and employing a control equation incorporating the plurality of objectives to generate at least one operating recipe parameter for the film formation process. A system includes a film formation unit and a process control unit. The film formation unit is adapted to perform a film formation process in accordance with an operating recipe. The process control unit is adapted to define a plurality of objectives for the film formation process and employ a control equation incorporating the plurality of objectives to generate at least one operating recipe parameter for the film formation process.

Method and apparatus for controlling a film formation process with multiple objectives

A method and an apparatus are provided for applying a self-adaptive filter to a drifting process. The method includes processing a workpiece, measuring an output characteristic of the processed workpiece and modifying a previous estimated process state based at least on the measured output characteristic. The method further includes estimating a next process state based at least on the modified previous estimated process state.

Applying a self-adaptive filter to a drifting process

The present invention is generally directed to various methods of controlling exposure processes by monitoring photon levels, and various systems for accomplishing same. In one embodiment, the method comprises performing an exposure process by generating light comprised of a number of photons from a light source to expose at least a portion of a layer of photo-sensitive material, counting a number of photons incident on at least a portion of the layer of photo-sensitive material, and controlling at least one of a duration of the exposure process and an irradiance of the light source based upon the counted number of photons. In another illustrative embodiment, the method comprises performing an exposure process by generating light comprised of a number of photons from a light source to expose at least a portion of a layer of photo-sensitive material, determining a rate at which the photons impact at least a portion of the layer of photo-sensitive material, and controlling at least one of a duration of the exposure process and an irradiance of the light source based upon the determined rate of the photons impacting the layer of photo-sensitive material.

Method of controlling exposure processes by monitoring photon levels, and system for accomplishing same

A method and an apparatus for characterizing an uncertainty factor relating to processing workpieces. A first processing step is performed upon a workpiece. A first uncertainty factor associated with the first processing step is calculated. A final uncertainty factor associated with an end-of-line parameter relating to the workpiece is calculated based upon the first uncertainty factor. A process control function based upon the final uncertainty factor is performed.

Determining transmission of error effects for improving parametric performance

A method includes receiving a current residual vector. The current residual vector is compared to a plurality of historical residual vectors. Each historical residual vector has an associated fault classification code. At least one of the historical residual vectors is selected responsive to determining that the current residual vector matches at least one of the historical residual vectors. A fault condition is classified based on the fault classification code associated with the selected historical residual vector.

Method and apparatus for fault classification based on residual vectors

A method includes defining a design window for a manufacturing process performed by a tool and a process window within the design window. A workpiece likely to have a characteristic outside the process window is identified. The characteristic of the identified workpiece is measured. A control model for controlling the tool is updated using the measured characteristic. A system includes a tool, a process controller, a metrology tool, and a sampling controller. The tool is adapted to process workpieces in accordance with a manufacturing process. The manufacturing process has an associated design window and a process window defined within the design window. The process controller is adapted to control the tool using a control model. The sampling controller is adapted to identify a workpiece likely to have a characteristic outside the process window and direct the metrology tool to measure the characteristic of the identified workpiece. The process controller is further adapted to update the control model using the measured characteristic.

Method and apparatus for providing excitation for a process controller

A method includes processing a plurality of workpieces in accordance with an operating recipe. Metrology data associated with the processing is collected. A control model including at least one tuning parameter having a default value is provided. A plurality of perturbations is introduced to shift the tuning parameter from its default value. Control actions are generated based on the metrology data and the perturbations to the tuning parameter in the control model to modify the operating recipe. An error signal associated with each of the perturbations is generated. The default value of the tuning parameter is modified based on the error signals.

Method and apparatus for dynamically monitoring controller tuning parameters

The present invention is generally directed to an advanced process control of the manufacture of memory devices, and a system for accomplishing same. In one illustrative embodiment, the method comprises performing at least one process operation to form at least one layer of an oxide-nitride-oxide stack of a memory cell, the stack being comprised of a first layer of oxide positioned above a first layer of polysilicon, a layer of silicon nitride positioned above the first layer of oxide, and a second layer of oxide positioned above the layer of silicon nitride. The method further comprises measuring at least one characteristic of at least one of the first layer of polysilicon, the first oxide layer, the layer of silicon nitride, and the second layer of oxide and adjusting at least one parameter of at least one process operation used to form at least one of the first oxide layer, the layer of silicon nitride and the second oxide layer if the measured at least one characteristic is not within acceptable limits.

Advanced process control of the manufacture of an oxide-nitride-oxide stack of a memory device, and system for accomplishing same

A method and apparatus are provided for determining a next tool state based on fault detection information. The method comprises receiving operational data associated with processing of a workpiece by a processing tool, determining at least a portion of noise associated with the processing of the workpiece based on analyzing the operational data and estimating a next state of the processing tool based on at least the determined portion of the noise.

Determining a next tool state based on fault detection information

A method includes performing at least one process for forming a feature of a semiconductor device in accordance with an operating recipe. An electrical performance characteristic of the feature is measured. The measured electrical performance characteristic is compared to a target value for the electrical performance characteristic. At least one parameter of the operating recipe is determined based on the comparison. A system includes a process tool, a metrology tool, and a controller. The process tool is configured to perform at least one process for forming a feature of a semiconductor device in accordance with an operating recipe. The metrology tool is configured to measure an electrical performance characteristic of the feature. The controller is configured to compare the measured electrical performance characteristic to a target value for the electrical performance characteristic and determine at least one parameter of the operating recipe based on the comparison.

Method and apparatus for controlling a fabrication process based on a measured electrical characteristic

A method for modifying design constraints based on observed performance includes measuring a characteristic of a plurality of devices manufactured in a process flow. A design constraint associated with the characteristic is defined. A performance metric relating the performance of the devices as a function of the measured characteristic and the design constraint is generated. The design constraint is modified based on the performance metric. A manufacturing system includes a metrology tool and a design rule monitor. The metrology tool is configured to measure a characteristic of a plurality of devices manufactured in a process flow. The design rule monitor is configured to receive a design constraint associated with the characteristic, generate a performance metric relating the performance of the devices as a function of the measured characteristic and the design constraint, and modify the design constraint based on the performance metric.

Method and apparatus for modifying design constraints based on observed performance

A method and an apparatus for adjusting a process controller based upon a fault detection analysis. A process step upon a workpiece is performed using a processing tool. Manufacturing data relating to processing of the workpiece is acquired. The manufacturing data may include metrology data relating to the processed workpiece and/or tool state data relating to the tool state of a processing tool. A metrology/tool state data integration process is performed based upon the acquired manufacturing data. The metrology/tool state data integration process includes performing an assessment of a tool health related to the processing tool and adjusting an emphasis of the metrology data based upon the assessment of the tool health.

Updating process controller based upon fault detection analysis

A method and an apparatus for performing process control at an interconnect level. A process step upon a workpiece is performed. Manufacturing data relating to an interconnect location on the workpiece is acquired. An interconnect characteristic control process is performed based upon the manufacturing data. The interconnect characteristic control process includes controlling a process relating to a structure associated with the interconnect location on the workpiece to control a characteristic relating to the interconnect location.

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Austin, TX, United States of America

Robert J Chong