Amdahl Corporation

Trilogy Computer Development Partners, Ltd.

Robert J Beall

John J Zasio

John William Sliwa

James C Lee

Gene M Amdahl

Fred K Buelow

Andrzej Kucharek

Carlton G Amdahl

Anthony Matouk

A module for a semiconductor chip is disclosed. The module includes a heat sink with a flat surface to which the back face of the semiconductor chip is directly bonded. The exposed face of the chip has an array of power, ground and signal contacts. A plurality of alternating power and ground bus bars span the exposed face of the chip. A multilayer ceramic is located on the other side of the bus bar array and has a surface proximate the power and ground bus bars with an array of contacts which correspond to at least the signal contacts on the chip. Power leads connect the power bus bars to adjacent power contacts on the chip; ground leads connect the ground bus bars to adjacent ground contacts on the chip; and signal leads pass between adjacent power and ground bus bars and interconnect the signal contacts on the chip with the corresponding signal contacts on the ceramic. A plurality of connectors emanate from the ceramic and are electrically coupled by vias or traces through the ceramic to the signal contacts for the transmission of signals to and from the chip.

Module construction for semiconductor chip

Package for an LSI chip having a plurality of contact pads comprising a carrier and a cover. The carrier is formed of a base of an insulating material and has a generally planar area for receiving the chip. A cooling stud is mounted on the base and can be provided with one or more removable cooling fins. The stud is mounted on the base opposite the area for receiving the chip. Spaced leads are carried by the base and have outer extremities which extend beyond the base in a direction away from the chip and are free of the carrier and have inner extremities which are in close proximity to the area for receiving the chip. A grounding bus is carried by the carrier to facilitate electrical checking of the package.

LSI Chip package and method

A high density multilayer printed circuit card assembly having plated through holes in electrical contact with the layers of conducting metal. The card is provided with bonding pads in contact with the plated through holes whereby wiring may be selectively utilized to form interconnections for components carried by the card. Signal lines are brought to the surface so that they can be interrupted and changes be made by wiring. Components of various types are arranged in rows to facilitate cooling.

High density multilayer printed circuit card assembly and method

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San Jose, CA, United States of America

Robert J Beall