Schott Ag

Robert Hettler

Frank Gindele

Wee Kiat Chai

Rainer Graf

Georg Mittermeier

Edgar Pawlowski

Jens Ulrich Thomas

Christian Rakobrandt

Artit Aowudomsuk

Karsten Droegemueller

Matthias Rindt

Kenneth Tan

Helena Blümel

Yutaka Onezawa

Alexander Neumeier

Thomas Zetterer

Michelle Fang

Helmut Hartl

Thomas Pfeiffer

Kurt Nattermann

Dietrich Mund

Reinhard Ranftl

Amy Soon Li Ping

Christoph Stangl

Antti Määttänen

Christian Ott

Ong Wai Li

Susumu Nishiwaki

Martin Wittmann

Rohit Bhosale

Jan Philipp Steigleder

Julia Weisshuhn

Shaifullah Bin Mohamed Kamari

Ondrej Rousek

Fritz Wintersteller

Takahisa Uchida

Kazuhito Miyawaki

Josef Gabler

Christoph Kiesl

Helena Haslbeck

Martin Lindner-Stettenfeld

Markus Maier

Edeltraud Sausenthaler

Klaus Schachtelbauer

Bernd Hammer

Lea-Li Chew

Josef Kiermeier

René Nauthe

Chris Wanless

Reinhard Ecker

Jochen Herzberg

Markus Mayer

Saravanan Natarajan

Jacky Xu

Daobing Chen

Martin Walter

A multilaser arrangement includes: a housing including a base plate, a housing cap fastened on the base plate, and a transparent element, the base plate including a bottom face, the housing cap including an opening with the transparent element assigned to the opening for the passage of electromagnetic radiation; lasers, each being arranged inside the housing at a distance from the bottom face of the base plate, the housing cap including an upper wall and a side wall, which includes a lower edge and a surface, is formed integrally with the upper wall, and ends with the lower edge fastened on the base plate, the side wall having a first thickness and a second thickness, the first thickness being measured in a direction perpendicular to the surface, the second thickness being measured at the lower edge and being less than or equal to the first thickness.

Multilaser arrangement and housing cap for a multilaser arrangement

A composite element includes: an outer holder; and an inner component which is held in the outer holder under a compressive stress, the outer holder and the inner component adjoining one another along a contour line which is closed, the contour line including two linear portions and two connecting portions, the two linear portions opposing one another and extending in a straight line, the two connecting portions connecting the two linear portions to form the contour line as closed, at least one of the two connecting portions having an arcuately extending curved region.

Composite element

A method for providing a plurality of hermetically sealed packages, including the steps of: providing at least two substrates including a first substrate and a second substrate, at least one of the at least two substrates being a transparent substrate, the two substrates being arranged directly adjoining each other or on top of one another, the transparent substrate defining a circumferential rim and an upper side of each package, the bottom of the package being defined by the second substrate, a respective contact area being defined at contact surfaces between the two substrates; sealing each functional area in a hermetically tight manner by bonding the two substrates along the contact area of each package; and dicing each package by a cutting step or a separating step, a particle jet being used to abrasively remove a material from the transparent substrate by the particle jet.

Hermetically sealed transparent cavity and package for same

A stable, hermetically sealed, partially optically transparent package for use to protect optoelectronic components is provided. The package has good cooling for the installed circuit elements and is as stable in relation to temperature and UV. The package has a cap with a frame made of a nitride ceramic and a glass element. The frame has an opening and the glass element hermetically closes the opening. The glass is fused onto the nitride ceramic and is fixed in contact with the nitride ceramic of the frame.

Packaged optoelectric modules with nitride ceramic frames and glass element hermetically closing the frames

A multi-fiber light guide includes: light guiding fibers, each fiber including an elongated glass core; a glass cladding, the cores being surrounded by the cladding to form a rigid and continuous glass element, the cores having a higher refractive index than the cladding such that light can be guided by a total reflection along the cores, which end in two abutting faces of the glass element such that light can be guided along the cores from one abutting face to the other abutting face; and an ion exchange layer at each of the abutting faces, the glass of the cores and the glass of the cladding including alkali ions, which are at least partly exchanged by alkali ions of a higher atomic number within the ion exchange layer at the abutting faces, the exchanged alkali ions within the ion exchange layer imparting a compressive stress at the abutting faces.

Multi-fiber light guide, device with a multi-fiber light guide and method for producing the same

A metal fixing material leadthrough for igniters of airbags and/or belt tighteners includes at least one metal pin fused into a glass or glass-ceramic fixing material in a through-opening of a main body. The metal is present in a post-heated state, with an interface between the fixing material and the metal pin and an additional interface between the fixing material and an inner surface of the through-opening. The at least one metal pin, at least in its core region, consists of stainless steel, such as a chromium-containing stainless steel, the stainless steel having a thermal expansion coefficient.

Metal fixing material leadthrough having low susceptibility to faults

A method is provided for producing a patterned glass wafer for packaging electronic devices in a wafer assembly. The method includes placing a glass sheet between two mold halves and heating until the glass sheet softens, while the mold halves are pressed against one another so that the glass sheet is reshaped and forms a patterned glass wafer. The first mold half has an array of projections and the second mold half has an array of recesses. The mold halves are arranged and shaped so that the recesses and projections oppose each other. The projections introduce cavities into the glass sheet during the reshaping and with the glass flowing into the recesses of the second mold half during the reshaping. The recesses are deep enough for the glass to at least partially not come in contact therewith and to form a convexly shaped glass surface in each recess.

Method for producing glass wafers for packaging electronic devices, and electronic component produced according to the method

A hermetically sealed package includes: a base substrate and a cover substrate which define at least part of the package, the base substrate and the cover substrate being hermetically sealed to one another by at least one laser bonding line, the at least one laser bonding line having a height perpendicular to its bonding plane, at least the cover substrate including a toughened layer at its surface, at least on a side opposite the at least one laser bonding line; and at least one functional area enclosed in the package.

Hermetically sealed, toughened glass package and method for producing same

A hermetically sealed package includes: at least one cover substrate and a substrate arranged so as to adjoin the at least one cover substrate, which together define at least part of the package, the at least one cover substrate being in a thermally prestressed state and bonded to the substrate adjoining the at least one cover substrate in a hermetically sealing manner by at least one laser bonding line, the at least one cover substrate being made of a material which has a different characteristic value of a coefficient of thermal expansion than the adjoining substrate and a thermal prestress is established in the package; and at least one functional area enclosed in the package.

An optoelectronic module is provided that has a carrier element, an optoelectronic element on the carrier element, a cover, and a cavity. The cover has a frame surrounding the optoelectronic element and connected to the carrier element. A glass element is on the frame lying substantially opposite the carrier element for the input and/or output of electromagnetic radiation. The cavity is inside a volume that is delimited by an inner surface of the cover and a surface of the carrier element. The optoelectronic element is arranged in the cavity and enclosed by the cover hermetically and/or in an autoclavable fashion. A filler material is in the cavity to compensate for an expansion of a volume occupied by the filler material and has a first deformable compensation volume, which is arranged adjacent to a subregion of the cover and/or of the carrier element.

Hermetically sealed optoelectronic module having increased output of electromagnetic radiation

A multi-laser arrangement, in particular an RGB laser module, having a housing with a housing cap having at least one opening formed therein and a transparent element associated therewith for the passing of electromagnetic radiation. The housing cap coupled to a base plate. A first laser emitting in the red spectral range, a second laser emitting in the green spectral range, and a third laser emitting in the blue spectral range are arranged in the housing. An electrical connection line is routed through the housing to each respective laser. During operation of a laser, a majority of its emitted light passes through the transparent element. Each laser is arranged on a pedestal; spaced apart from the lower surface of the base plate; and is aligned with one another. The main direction of laser emission is substantially parallel to the base plate of the housing.

Multi-laser arrangement, in particular an RGB laser module device

A supporting device for an image capturing device on a bioreactor, a bioreactor, and a method of use are provided. The supporting device for an image capturing device includes a window and a holder. The window has a transparent element that is transparent to electromagnetic radiation. The holder is configured to hold the image capturing device. The supporting device is held at least partially in a through-opening of a feedthrough of a container for holding fluid media containing biological material. The window seals the through-opening.

Device for supporting an image capturing device on a bioreactor, bioreactor with device for supporting an image capturing device, and method for propagation or cultivation of biological material

An electronic device is provided which can be worn on the body or implanted into the body, such as in the form of a pulse watch and/or a smartwatch and/or an implant. The electronic device includes a photoplethysmographic measuring device. A transmitter diode and a receiver diode are arranged under a window made of glass or glass ceramics. The window is implemented as a compression glass seal and/or as a fiber-optic plate.

Electronic device that can be worn on the body and method for producing same

A glass-metal feedthrough includes: an external conductor having a coefficient of expansion &#x3b1;, and having an opening formed therein; an internal conductor disposed in the opening, the internal conductor including iron and having a coefficient of expansion &#x3b1;, the external conductor and the internal conductor being configured to not release nickel when in contact with a human or animal body or biological cells of a cell culture; and a glass material surrounding the internal conductor within the opening and having a coefficient of expansion &#x3b1;, the coefficient of expansion of the internal conductor &#x3b1;and the coefficient of expansion of the external conductor &#x3b1;are such that a joint pressure on the internal conductor of at least 30 MPa is generated in a temperature range of 20&#xb0; C. to a glass transformation temperature of the glass material.

Glass-metal feedthrough

An autoclavable medical device is provided that includes a metal housing having an electrical conductor embedded in an inorganic fixing material. The conductor and fixing material define an electrical feedthrough that extends from an interior of the housing through at least a portion of the fixing material. The electrical feedthrough forms part of a sensor of an actuation means for the autoclavable medical device.

Autoclavable medical device and actuation means for an autoclavable medical device

Growing community of inventors

Kumhausen, Germany

Robert Hettler