Avago Technologies Fiber IP (singapore) Pte. Ltd

Avago Technologies General IP (singapore) Pte. Ltd.

Robert H Yi

Robert E Wilson

Brenton Arthur Baugh

James Howard Williams

Richard A Ruh

Paul Yu

Tanya Jegeris Snyder

Kendra J Gallup

In an optical communication module, a fiber submount is mated with an optics assembly to optically align an optical fiber retained in a groove in the fiber submount with an optics element of the optics assembly. The fiber submount has a resiliently biased latch portion that engages the optics assembly to provide a resilient retaining force between the optics assembly and the fiber submount. The force retains the optics element in optical alignment with the fiber optical axis.

Optical communication module with fiber submount and latching optics assembly

A data communication module tab is sufficiently compliant in off-axis directions that it resists damage from forces in such off-axis directions, yet is sufficiently rigid in the direction of its longitudinal axis that a person can insert the data communication module into a cage and withdraw it from a cage by pushing and pulling the tab, respectively.

Pluggable data communication module with compliant push-pull tab

A delatch mechanism for disengaging a data communication module from a cage includes an actuator handle and a T-shaped crank connected at a wrist pivot to the handle and connected at a crank pivot to the module housing. The crank pivots to lift a pin out of engagement with the cage when a user pulls on the actuator handle, causing it to slide relative to the housing.

Pluggable data communication module with slider-crank delatch mechanism

An optoelectronic module is provided that has an adapter that interacts with the tongue actuator of a module removal tool to actuate the cage tongue. Actuation of the cage tongue causes the latch disposed on the optoelectronic module to retract from the opening formed in the tongue to allow the optoelectronic module to be removed from the cage by the module removal tool. The adapter enables the module removal tool to be used to remove the module from the cage despite the fact that the distance between the optical reference plane and the mechanical actuation plane and the distance between the optical reference plane and the bottom surface of the cage may differ.

Optoelectronic module having an adapter for use in extracting the module from a cage

An opto-electronic communication module includes a housing, an electro-optical assembly, and a retainer that helps maintain alignment of an optical port. The electro-optical assembly includes a circuit substrate, an opto-electronic communication device mounted on the circuit substrate, and an optics module having an optical connection portion extending into the opening of the housing to define the optical port. The retainer can be, for example, a clip that contacts the housing and fits over the optical connection portion of the optics module to maintain the optical connection portion in alignment with the opening of the housing.

Opto-electronic communication module having retainer for aligning optical ports

A heat dissipation solution is provided that includes a heat sink structure that has a very high thermal conductivity and includes elements or features that can be deformed to increase the contact surface areas between the heat sink structure and the module casing, thereby decreasing thermal resistance. By increasing the thermal conductivity and the sizes of the surface areas that are used for transferring heat, the temperature difference between the temperature of the light source and the temperature of the module casing can be decreased to enable the light source to be operated at higher data rates. Furthermore, deformation of the deformable features also removes space between the optical subassembly and the module body caused by mechanical tolerance differences that occur during manufacturing.

Optical transceiver module having a deformable heat sink structure

Systems and methods for balanced cooling of electrical systems, including electrical systems containing transceivers used in electrical and optical communication. An electrical system includes a cage, where the cage has a top, front and bottom. The cage contains a plurality of upper bays disposed in the front of the cage. Each of the plurality of upper bays is configured to receive a transceiver. The cage also contains a plurality of lower bays disposed in the front of the cage. Each of the lower bays is configured to receive a transceiver. Additionally, each of the plurality of upper bays is stacked on one of the plurality of lower bays. An upper heat sink extends from the outer surface of the top of the cage and a lower heat sink extends from the outer surface of the bottom of the cage.

Balanced cooling system and method for high-density stacked cages

An optical transceiver module is provided with a delatch device that is configured for pushing and pulling an optical transceiver module into and out of a cage. The delatch device includes an elongated handle having at least one strength member integrally formed therein or secured thereto that provides the handle with a sufficient moment of inertia to prevent the handle from bending or buckling when a force is being applied to the elongated handle to push an optical transceiver module into a cage. The elongated handle allows a module to easily be inserted into a cage by a user without the user having to directly access the front face of the module.

Delatch device having both push and pull operability for use with an optical transceiver module, and a method

In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.

Passive alignment using elastic averaging in optoelectronics applications

An optoelectronic module is seated onto a substrate connector by guiding the module along an initial path portion that is misaligned with respect to the mating direction defined by the substrate connector and further includes providing a positive pressure drive along an end path portion with sufficient force to secure the optoelectronic module to the substrate connector. Where the mating is via a pin-and-socket arrangement, the positive pressure drive requires sufficient force to push the main body of the module to ensure entry of the pins into the sockets. Typically, there is a conversion from force applied in one direction to module motion in the orthogonal direction. However, a rocking cam embodiment is also described.

Axis translation installation mechanism for optoelectronics modules and method

Axis translation installation mechanism for optoelectronic modules

An optoelectronic assembly includes an optical lens element (OLE) coupled to a substrate. The substrate includes a transducer, a standing structure on the transducer, a transducer lens supported by the standing structure over the transducer, and alignment features. The OLE includes an OLE lens and co-alignment features that couple with the alignment features on the optoelectronic assembly. When the substrate is coupled to the OLE, the transducer lens is aligned with the OLE lens.

Optoelectronic assembly with coupling features for alignment

A method for forming device packages includes forming a perimeter with a reactive foil and a bonding material interposed between a first wafer and a second wafer, pressing the first and the second wafers against the reactive foil and the bonding material, initiating the reactive foil, wherein the reactive foil heats the bonding material to create a bond between the first and the second wafers, and singulating the first and the second wafers into the device packages.

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Palo Alto, CA, United States of America

Robert H Yi