Texas Instruments Corporation

Robert H Taylor

Jules D Levine

Bruce E Gnade

Kenneth G Vickers

Chi-Cheong Shen

Charles E Primm

Arthur M Wilson

Robert M Wallace

Leigh Ann Files

Lester L Hodson

Charies E Primm

An electron emitter plate (110) for an FED image display has an extraction (gate) electrode (22) spaced by an insulating layer (125) from a cathode electrode including a conductive mesh (18). Hexagonal close-packed arrays (12) of microtips (14) are located in mesh spacings (16), within apertures (26) formed in extraction electrode (22). Microtips (14) are formed on a conductive plate (17) laterally spaced from mesh structure (18) by a resistive layer (15). Insulating layer (125) is etched to connect apertures (26) and place microtips (14) in a common cavity within each mesh spacing (16).

Field emission device with close-packed microtip array

An electron emitter plate (110) for an FED image display has an extraction (gate) electrode (22) spaced by a dielectric insulating spacer (125) from a cathode electrode including a conductive mesh (18). Arrays (12) of microtips (14) are located in mesh spacings (16), within apertures (26) formed in clusters (23) in extraction electrode (22). Microtips (14) are deposited through the apertures (26). Apertures (26) are arranged in regular, periodic arrays (23, 23', 123, 123') defining lattices having occupied apertured positions and internal unapertured vacancy positions (150, 150'). The insulating spacer (125) is etched to undercut electrode (22) to connect apertured lattice positions, forming a common cavity (141) for microtips (14) within each mesh spacing (16), and leaving central posts (143) at the unapertured vacancies (150, 150'). The etch-out reduces the dielectric constant factor of gate-to-cathode capacitance in the finished structure. Placing posts at vacancy positions enables gate support over the cavity without sacrificing high microtip density.

Field emission device with lattice vacancy, post-supported gate

An electron emitter plate (10, 10') for an FED image display has a gate conductive layer (22) spaced by a dielectric insulating layer (25) from a cathode conductive layer formed into a mesh (18). Arrays (12) of microtips (14) are located within mesh spacings (16) for field emission of electrons toward a phosphor layer (34) of an anode plate (11). Cathode layer (18) is patterned into column stripes (19) separated by gaps (17). Gate layer (22) is patterned into row cross-stripes (24) separated by gaps (23) which intersect with stripes (19) at matrix addressable pixel locations (30). Resistive layer (15) is patterned into stripes (40) separated by gaps (42) which interrupt column-to-column electrical communication through resistive layer (15). Unetched strips (43) are provided to bridge gap discontinuities for deposition of gate layer (22) at crossovers of rows (24) between columns (19). In one embodiment, gate layer (22) has a mesh pattern with apertured pads (46) commonly connected along resistive gap edges by marginal buses (50) formed on borders (49) of resistive layer (15) along gaps (42). Adjacent marginal buses (50) are connected by crossover buses (52) formed over bridging strips (43).

Column-to-column isolation in fed display

A stylus location system comprises a field emission device having an anode plate 32 and an emitter plate 2, and a plurality of piezoelectric point elements 34, 42 coupled to the anode plate. The piezoelectric point elements 34, 42 are capable of transforming electrical energy into ultrasonic energy and transforming ultrasonic energy into electrical energy. A stylus 30 is also coupled to the anode plate 32 and circuitry 36, 46, 48 is coupled to the piezoelectric point elements 42 for determining the position of the stylus 30. The circuitry 36 may also send a video data signal to the emitter plate 2 in response to the position determination.

Determination of pen location on display apparatus using piezoelectric

A method for generating coordinate signals in conjunction with a surface of a field emission device having a cathode plate 2 coupled to an anode plate 32 comprises the steps of providing a first ultrasonic wave packet to the anode plate 32, receiving with a stylus 30 positioned proximate to the anode plate 32 the first ultrasonic wave packet, and then transmitting to the anode plate 32 with the stylus 30 a second ultrasonic wave packet responsive to the first ultrasonic wave packet. Next, receiving from the anode plate 32, with a plurality of piezoelectric point elements 44, the second ultrasonic wave packet, and then determining an x-position and y-position 35 of the stylus 30 responsive to the received second ultrasonic wave packet.

Method for determining pen location on display apparatus using

Field emission device with lattice vacancy post-supported gate

An interconnect for use in a field emission flat panel display device for providing an electrical interconnect between a bond pad 42 on the anode plate 10 and an electrically conductive region 44 on the emitter plate 12 comprises an electrically conductive protuberance 40 attached to region 44 which extends above the surface of region 44 to such a height that when emitter plate 12 and anode plate 10 are assembled at their intended relative positions and spaced from one another at a prescribed distance, structure 40 is forced into compression against the surface of region 42. In one embodiment, gold wire bonds 52 and 56 are attached to bonding pads 64 and 66 on opposing surfaces of anode plate 10 and emitter plate 12, respectively. Bonds 52 and 56 are compressed against one another when plates 10 and 12 are assembled, causing them to be deformed into generally spheroid shapes, the contact between them providing a reliable, low resistivity interconnect between their respective bond pads 64 and 66. Protuberance 56 may comprise a solid spherical or cylindrical structure of a compliant metal, or it may comprise a 'fuzz-button.' In another embodiment, one of the plates includes plural, closely spaced protuberances 74 and the other plate includes one protuberance 76, thus aiding in the proper alignment of the emitter and anode plates 12,10.

Interconnect for use in flat panel display

The emitter plate 60 of a field emission flat panel display device includes a layer 68 of a resistive material and a mesh-like structure 62 of an electrically conductive material. A conductive plate 78 is also formed on top of resistive coating 68 within the spacing defined by the meshes of conductor 62. Microtip emitters 70, illustratively in the shape of cones, are formed on the upper surface of conductive plate 78. With this configuration, all of the microtip emitters 70 will be at an equal potential by virtue of their electrical connection to conductive plate 78. In one embodiment, a single conductive plate 82 is positioned within each mesh spacing of conductor 80; in another embodiment, four conductive plates 92 are symmetrically positioned within each mesh spacing of conductor 90. Also described is an arrangement of emitter clusters including conductive plates 102 having a plurality of microtip emitters 104 formed thereon, or spaced thereform by a thin layer of resistive material, each cluster adjacent and laterally spaced from a stripe conductor 100 by a region 106 of a resistive material. The conductive stripes 100 are substantially parallel to each other, are spaced from one another by two conductive plates 102, and are joined by bus regions 110 outside the active area of the display.

Cluster arrangement of field emission microtips

A spacer 40 for use in a field emission device comprises a comb-like structure having a plurality of elongated filaments 42 joined to a support member 44. The filaments 42, which may be glass, are positioned longitudinally in a single layer between the facing surfaces of the anode structure 10 and the electron emitting structure 12. Support member 44 is positioned entirely outside the active regions of anode structure 10 and emitting structure 12. Spacer 40 provides voltage isolation between the anode structure 10 and the cathode structure 12, and also provides standoff of the mechanical forces of vacuum within the assembly. In a second embodiment, spacer 50 comprises elongated filaments 52 joined at each end to a support member 54a and 54b, the additional support facilitating handling, fabrication and assembly. In an additional embodiment, a filament 70 of nonuniform diameter contacts planar surfaces 74 and 76 only at the high spots 72 of filament 70, thereby reducing the shadowing of the beam on the display surface.

Spacer for flat panel display

The emitter plate 60 of a field emission flat panel display device includes a layer 68 of a resistive material and a mesh-like structure 62 of an electrically conductive material. A conductive plate 78 is also formed on top of resistive coating 68 within the spacing defined by the meshes of conductor 62. Microtip emitters 70, illustratively in the shape of cones, are formed on the upper surface of conductive plate 78. With this configuration, all of the microtip emitters 70 will be at an equal potential by virtue of their electrical connection to conductive plate 78. In one embodiment, a single conductive plate 82 is positioned within each mesh spacing of conductor 80; in another embodiment, four conductive plates 92 are symmetrically positioned within each mesh spacing of conductor 90. Also disclosed is an arrangement of emitter clusters comprising conductive plates 102 having a plurality of microtip emitters 104 formed thereon, or spaced therefrom by a thin layer of resistive material, each cluster adjacent and laterally spaced from a stripe conductor 100 by a region 106 of a resistive material. The conductive stripes 100 are substantially parallel to each other, are spaced from one another by two conductive plates 102, and are joined by bus regions 110 outside the active area of the display.

Clustered field emission microtips adjacent stripe conductors

The emitter plate 60 of a field emission flat panel display device includes a layer 68 of a resistive material and a mesh-like structure 62 of an electrically conductive material. A conductive plate 78 is also formed on top of resistive coating 68 within the spacing defined by the meshes of conductor 62. Microtip emitters 70, illustratively in the shape of cones, are formed on the upper surface of conductive plate 78. With this configuration, all of the microtip emitters 70 will be at an equal potential by virtue of their electrical connection to conductive plate 78. In one embodiment, a single conductive plate 82 is positioned within each mesh spacing of conductor 80; in another embodiment, four conductive plates 92 are symmetrically positioned within each mesh spacing of conductor 90. Also disclosed is an arrangement of emitter clusters comprising conductive plates 102 having a plurality of microtip emitters 104 formed thereon, each cluster adjacent and laterally spaced from a stripe conductor 100 by a region 106 of a resistive material. The conductive stripes 100 are substantially parallel to each other, are spaced from one another by two conductive plates 102, and are joined by bus regions 110 outside the active area of the display.

Field emission microtip clusters adjacent stripe conductors

Cluster arrangement of field emission microtips on ballast layer

The emitter plate 60 of a field emission flat panel display device includes a layer 68 of a resistive material and a mesh-like structure 62 of an electrically conductive material. A conductive plate 78 is also formed on top of resistive coating 68 within the spacing defined by the meshes of conductor 62. Microtip emitters 70; illustratively in the shape of cones, are formed on the upper surface of conductive plate 78. With this configuration, all of the microtip emitters 70 will be at an equal potential by virtue of their electrical connection to conductive plate 78. In one embodiment, a single conductive plate 82 is positioned within each mesh spacing of conductor 80; in another embodiment, four conductive plates 92 are symmetrically positioned within each mesh spacing of conductor 90. Also disclosed is an arrangement of emitter clusters comprising conductive plates 102 having a plurality of microtip emitters 104 formed thereon, or spaced therefrom by a thin layer of resistive material, each cluster adjacent and laterally spaced from a stripe conductor 100 by a region 106 of a resistive material. The conductive stripes 100 are substantially parallel to each other, are spaced from one another by two conductive plates 102, and are joined by bus regions 110 outside the active area of the display.

The emitter plate 60 of a field emission flat panel display device includes a layer 68 of a resistive material and a mesh-like structure 62 of an electrically conductive material. A conductive plate 78 is also formed on top of resistive coating 68 within the spacing defined by the meshes of conductor 62. Microtip emitters 70, illustratively in the shape of cones, are formed on the upper surface of conductive plate 78. With this configuration, all of the microtip emitters 70 will be at an equal potential by virtue of their electrical connection to conductive plate 78. In one embodiment, a single conductive plate 82 is positioned within each mesh spacing of conductor 80; in another embodiment, four conductive plates 92 are symmetrically positioned within each mesh spacing of conductor 90. Also disclosed is an arrangement of emitter clusters comprising conductive plates 102 having a plurality of microtip emitters 104 formed thereon, or spaced thereform by a thin layer of resistive material, each cluster adjacent and laterally spaced from a stripe conductor 100 by a region 106 of a resistive material. The conductive stripes 100 are substantially parallel to each other, are spaced from one another by two conductive plates 102, and are joined by bus regions 110 outside the active area of the display.

An anode plate 40 for use in a field emission flat panel display device comprises a transparent planar substrate 42 having a plurality of electrically conductive, parallel stripes 46 comprising the anode electrode of the device, which are covered by phosphors 48.sub.R, 48.sub.G and 48.sub.B, and a gettering material 52 in the interstices of the stripes 46. The gettering material 52 is preferably selected from among zirconium-vanadium-iron and barium. The getter 52 may be thermally reactivated by passing a current through it at selected times, or by electron bombardment from microtips on the emitter substrate. The getter 52 may be formed on a substantially opaque, electrically insulating material 50 affixed to substrate 42 in the spaces formed between conductors 46, which acts as a barrier to the passage of ambient light into and out of the device. Methods of fabricating the getter stripes 52 on the anode plate 40 are disclosed.

Growing community of inventors

Richardson, TX, United States of America

Robert H Taylor