Raychem Limited

Other

Life Technologies Corporation

Tyco Electronics Corporation

Arcturus Engineering, Inc.

Arcturas Bioscience, Inc.

Arturus Bioscience, Inc.

Robert H Reamey

John R Havens

Harriette Atkins

Mark F Wartenberg

Thomas Michael Baer

David F Head

Aldrich N Lau

Wayne Montoya

Akira Tomita

Paul S Drzaic

Laurence M Welsh

Janusz Wojtowicz

James Strain

Anne Gonzales

Bruce J Richardson

Frank W Mercer

Keith Moravick

Stephen S Moore

Paul G Schoenstein

Benjamin Lee Sitler

Christine Ellen Vogdes

Derrick A Richardson

Zbigniew Cichocki

Kathleen Di Zio

Kathleen DiZio

Kevin Malloy

Jinlong Cheng

David P Ching

Hundi Panduranga Kamath

Paul Becker

Viktors Jansons

Philip J Jones

Heinrich C Gors

Lanchi P Vo

Thomas L Smith

Steven T Kunitake

Ann Bennett Lossing

Sherrie L Ransom

Hala Al-Shawany

John Mazzanti

Gil Garza

Barbara J Wessen-Baer

Ali Firouzi

David Ching

Keith E Moravick

The present invention generally discloses an extraction system that provides a locale for fluid processing and extraction on a post-microcapture transfer film. The extraction system includes a transfer film carrier and an extraction device forming a reservoir. The extraction system selectively excludes regions of the transfer film from the reservoir to advantageously reduce contamination due to matter adhered to the transfer film by non-specific transfer.

Laser capture microdissection (LCM) extraction device and device carrier, and method for post-LCM fluid processing

A device and method for the temperature control, concentration, volume measurement and transport of microfluidic volumes are provided. The device includes one or more heating elements having a resistive material that varies with temperature. The heating elements are formed into a laminar body that may be formed into a variety of geometries and/or easily married to a second body including micro-well plates, micro-centrifuge tubes and microfluidic circuits.

Apparatus and method for heating microfluidic volumes and moving fluids

The present invention generally provides an improved transfer film having multiple layers for laser micro-capture of a sample. The transfer film for laser micro-capture includes distinct layers for expansion and adhesion in order to optimize the performance of the transfer film. A transfer film including a spring-back layer is also disclosed.

Transfer film for laser microcapture

A method is disclosed for making a heat dissipation arrangement for a circuit board on which are mounted bare silicon chips having an exposed face. A heat spreader has a planar portion, on whose inner face (facing the circuit board) are applied one or more pads of a gel composition. The pad(s) are positioned opposite the bare silicon chips when the heat spreader is attached to the circuit board and completely cover the exposed faces of the chips. The gel composition has a cohesive strength greater than its adhesive strength, has a compression modulus of less than 1.38 MPa, and has a thermal conductivity greater than 1.0 W/m-&deg;C., and a thickness of between about 0.08 mm and about 1.0 mm. The low compression modulus of the gel material protects the chips from the transmission of mechanical stresses thereto.

Dissipation of heat from a circuit board having bare silicon chips mounted thereon

Systems and methods are described for barriers on laser capture microdissection samples. A method of processing a biological sample for laser capture microdissection, includes: providing the biological sample; and applying a substance to the biological sample so as to provide a barrier between the biological sample and a surrounding environment. The systems and methods provide advantages because non-specific pick-up is reduced, visualization is improved, sample degradation is reduced, and contamination is reduced.

Processing technology for LCM samples

A method is disclosed for making a heat dissipation arrangement for a circuit board on which are mounted bare silicon chips having an exposed face. A heat spreader has a planar portion, on whose inner face (facing the circuit board) are applied one or more pads of a gel composition. The pad(s) are positioned opposite the bare silicon chips when the heat spreader is attached to the circuit board and completely cover the exposed faces of the chips. The gel composition has a cohesive strength greater than its adhesive strength, has a compression modulus of less than 1.38 MPa, and has a thermal conductivity greater than 1.0 W/m-.degree. C., and a thickness of between about 0.08 mm and about 1.0 mm. The low compression modulus of the gel material protects the chips from the transmission of mechanical stresses thereto.

Dissipation of heat from a circuit board having bare silicon chips

A highly thermally conductive but yet highly conformable composition is made from gel filled with alumina. The use of .alpha.-alumina in which at least 10 weight % of the .alpha.-alumina particles have a particle size of at least 74 .mu.m makes possible the high filler levels needed to attain high thermal conductivity, without causing the decrease in elongation and softness normally associated with high filler levels. Further improvements are observed if the .alpha.-alumina and the gel (or precursor thereof) are mixed with a specific energy input of at least 10 Joule/g. The input of such specific energy has the effect making the resulting composition more conformable than it otherwise would be. The composition may be internally supported by a flexible matrix such as a fabric or open-celled foam.

Highly thermally conductive yet highly conformable alumina filled

Highly thermally conductive yet highly comformable alumina filled

A liquid crystal light composite in which discrete volumes of a liquid crystal material are dispersed in a matrix material is produced by a process in which a reactive additive formulation is added and photopolymerized. The reactive additive formulation includes mono- and multifunctional compounds in specified proportions and a photoinitiator. The reactive additive formulation reduces the operating field and may also improve other electro-optical properties.

Method of making liquid crystal composite

A method is disclosed for making a liquid crystal composite in which droplets of a liquid crystal material are dispersed in a polymer matrix. At least one further material separates the liquid crystal material from the polymer matrix. This construction permits the polymer matrix to be selected on the basis of its environmental properties and the further material to be selected on the basis of its orientational interactions with liquid crystal material. Light valves made from such a composite exhibit improved electro-optical properties.

Liquid crystal composite and method of making

Method of making liquid crystal composite which has interfacial material

A liquid crystal display is made from an encapsulated liquid crystal structure comprising a liquid crystal composition dispersed in a containment medium. Selected additives may be added to the encapsulated liquid crystal structure to improve performance characteristics such as the operating field, the hysteresis, and the voltage holding ratio.

Encapsulated liquid crystal structures, apparatus containing the same,

A method is disclosed for making a liquid crystal composite including a component such as a pleochroic dye. The component is imbibed into droplets of a liquid crystal material in a containment medium.

Method of imbibing a component into a liquid crystal composite

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Palo Alto, CA, United States of America

Robert H Reamey