Dsm IP Assets B.v.

Robert H C Janssen

Pieter Gijsman

Rudy Rulkens

Wilhelmus J M Sour

Jacob Koenen

Franciscus Van Vehmendahl

Franciscus Vehmendahl Van

Ronald M A M Schellekens

Theodorus J G Zwartkruis

Non-fibrous-reinforced thermoplastic molding compositions comprising a metal powder as a heat stabilizer are provided. The metal powder has a weight average particle size (dm) of at most 1 mm and the metal in the metal powder is selected from the group consisting of elementary metals from Group VB, VIB, VIIB and VIIIB of the Periodic Table, and mixtures thereof. A thermoplastic polyamide is also provided with an Mw of at most 50,000 g/mol, or a blend of at least two thermoplastic polymers with Tmelt or Tg differing by at least 20&#xb0; C., or a second thermostabilizer. The invention also relates to the use of these compositions in high temperature applications.

Heat stabilized moulding composition

A thermostabilized thermoplastic molding composition includes a) a thermoplastic polyamide composition which consists of a blend of at least two polyamides. The at least two polyamides include a1) at least 50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a first polyamide (PA-1) selected from the group consisting of polyamide-4,6, polyamide-6,6 and semi-aromatic polyamides and mixtures thereof; and a2) an amount of 1-50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a second polyamide (PA-2) selected from the group consisting of polyamide-6 and copolymers thereof. The composition also contains b) 0.001-3 mass %, relative to the total mass of the thermoplastic polyamide composition, of a copper salt; and c) 0.01-10 mass %, relative to the total mass of the thermoplastic polyamide composition, of iron oxide. The molding composition exhibits reduced deterioration when exposed to an elevated temperature of 230&#xb0; C. for a prolonged time period of 1000 hours as compared to an identical molding composition including a Cul/KI stabilization system but not including the iron oxide.

The invention relates to a thermostabilized thermoplastic molding composition comprising (a) a thermoplastic polyamide composition, consisting of a blend of at least two polyamides comprising (a.1) at least 50% mass, relative to the total mass of the thermoplastic polyamide composition, of a first polyamide (PA-1), being a semi-crystalline polyamide having a melting point Tm-1, or being an amorphous polyamide having a glass transition point Tg-1, wherein Tm-1 and Tg-1 together are denoted as T-1 and T-1 is at least 200&#xb0; C. and (a.2) a second polyamide (PA-2), with a C/N ratio of at most 7, being a semi-crystalline polyamide having a melting point Tm-2 or an amorphous polyamide having a glass transition point Tg-2, wherein Tm-2 and Tg-2 together are denoted as T-2 and T-2 is at least 20&#xb0; C. lower than T-1, (b) a stabilizing system comprising a thermostabilizer selected from the group consisting of phenolic thermostabilizers, organic phosphites, aromatic amines, metal salts of elements from Group IB, MB, III and IV of the Periodic Table and metal halides of alkali and alkali earth metals, and combinations thereof, and (c) a metal oxide, or salt thereof, of a transition metal element from Group VB, VIIB, VIIB and VIIIB of the Periodic Table, or a mixture thereof.

Non-fibrous-reinforced thermoplastic moulding compositions comprising a metal powder as a heat stabilizer are provided. The metal powder has a weight average particle size (dm) of at most 1 mm and the metal in the metal powder is selected from the group consisting of elementary metals from Group VB, VIB, VIIB and VIIIB of the Periodic Table, and mixtures thereof. A thermoplastic polyamide is also provided with an Mw of at most 50,000 g/mol, or a blend of at least two thermoplastic polymers with Tmelt or Tg differing by at least 20&#xb0; C., or a second thermostabilizer. The invention also relates to the use of these compositions in high temperature applications.

Heat transport assemblies are provided with a first part plastic part and a second part. The heat transport assemblies have a first surface area on the first part in heat conductive contact with a second surface area on the second part, wherein the first surface area and the second surface area consist of a surface material having a heat conductivity of at least 50 W/m&#xb7;K.

Heat transport assembly

The invention relates to a halogen free flame retardant polyester composition suitable for use as a molding composition for making lampholders, comprising (A) a polymeric material consisting for at least 50 wt. %, relative to the total weight of the polymeric material, of a thermoplastic polyester; (B) a flame retardant system in an amount of 11-35 wt. %, relative to the total weight of (A), (B) and (C), and consists of: melamine cyanurate, and optionally one or more of the following flame retardant components: another phosphorus-free nitrogen based organic flame retardant compound, a phosphorus containing flame retardant excluding elementary phosphorus, in an amount of less than 1 wt. %, relative to the total weight of (A), (B) and (C); an inorganic flame retardant synergist, and an organic flame retardant synergist (C) a fibrous reinforcing agent in an amount of 5-35 wt. %, relative to the total weight of (A), (B) and (C); and (D) a mould release agent in an amount of at least 0.01 wt. %, relative to the total weight of (A), (B) and (C).

Growing community of inventors

Elsloo, Netherlands

Robert H C Janssen