Siemens Energy & Automation, Inc.

Asm Assembly Systems Gmbh & Co. Kg

Siemens Dematic Electronic Assembly Systems Inc.

Robert Gray

Ian Rawles

Thomas Mair

Tuan Nguyen

Anthony Peter Duck

Mathew Greer

Matthew Greer

It is described a method for changing parameters for controlling a transfer of solder paste onto a printed circuit board (). The described method comprises (a) identifying first subareas () of the printed circuit board (), which exhibit a first repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (), (b) identifying second subareas () of the printed circuit board (), which exhibit a second repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (), wherein the first repeatability is smaller than the second repeatability, (c) transferring solder paste onto the printed circuit board () at least at the second subareas () of the printed circuit board (), (d) measuring the amount of solder paste which has been transferred to the second subareas (), and (e) changing the parameters for controlling a transfer of solder paste onto the printed circuit board () in response to the measured amount of solder paste which has been transferred to the second subareas (). It is further described a corresponding processing device, a system comprising such a processing device and a computer program for controlling and/or for carrying out such a method.

Changing printing control parameters based on measured solder paste deposits in certain subareas of a printed circuit board

Methods and systems for electronics assembly system consultation and sales build upon an approach to modeling and simulation of such systems in which the system is modeled at a preselected level of abstraction, which in the preferred embodiment of the invention is the material flow level of abstraction. Models capable of producing accurate results, but that avoid predicting system events at too low a level of detail, in turn permit the generation of configuration options for a customer, along with substantiated performance predictions, within a comparatively short period of time, one that permits various assembly system configurations to be proposed and evaluated within the course of a particular customer visit.

Methods and systems for electronics assembly system consultation and sales

Methods and tools for quickly and accurately performing complex customer benefit modeling for an electronic components assembly system are disclosed. In one embodiment, predefined user interfaces allow a consultant, customers, salespersons, or line designers to input a line configuration by selecting from a list predefined objects that represent specific line components. In addition, the user inputs other line configuration data specific to the line being configured. The information contained in the user interface is extracted for use a discrete event simulator. Templates for simulation objects may be created in advance and populated with data from the input interface. A simulation is built and run. Simulation results may be exported to an output means, which may allow for custom generated reports. The reporting means may include a means for allowing customer specific information and data to be inputted.

Electronics assembly systems customer benefit modeling tools and methods

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Buford, GA, United States of America

Robert Gray