Corning Incorporated

National Yang Ming Chiao Tung University

University-industry Cooperation Group of Kyung Hee University

Robert George Manley

Robert Alan Bellman

Prantik Mazumder

Dana Craig Bookbinder

Kaveh Adib

Theresa Chang

Rajesh Vaddi

Mingqian He

Karan Mehrotra

Sean Matthew Garner

Jeffrey John Domey

Alan Thomas Stephens, Ii

Shandon Dee Hart

Hsiao-Wen Zan

Chandan Kumar Saha

Hsin-Fei Meng

Darwin Gene Enicks

Nikolay Zhelev Zhelev

Robert Michael Morena

Guangli Hu

Zhen Song

Timothy James Orsley

John Christopher Thomas

Lu Zhang

Jiangwei Feng

Richard Curwood Peterson

Xinyuan Liu

Shiwen Liu

Michael Lesley Sorensen

Vasudha Ravichandran

Jen-Chieh Lin

Pei-Lien Tseng

Ta-Ko Chuang

Thomas Dale Ketcham

Michael Edward Badding

Garrett Andrew Piech

Charles Andrew Paulson

Jin Hee Jang

Mark Alejandro Quesada

Aize Li

Yunfeng Gu

Paul Arthur Sachenik

James Patrick Hamilton

Benedict Yorke Johnson

Huan-Hung Sheng

Wanda Janina Walczak

Siva Venkatachalam

Gabriel Pierce Agnello

Daniel Wayne Levesque, Jr

Jonathan Michael Mis

Francis Martin Behan

Joy Banerjee

Tarun Mudgal

Heather Nicole Vanselous

Cheng-Gang Zhuang

Dae Youn Kim

Bin Zhu

Seo-Yeong Cho

Karl D Hirschman

Barry James Paddock

Seongho Seok

Xiuling Li

Alan Thomas Stephens Ii

Apparatus and method for treating a substrate, for example texturing a substrate. In some embodiments, a masking material is applied to a surface of the substrate in a predetermined pattern, the surface thereafter contacted with an etchant that removes the masking material. Contacting the surface with the etchant produces multiple co-located textures. In other embodiments, the masking step can be eliminated, and the etchant is applied in a predetermined pattern to produce multiple co-located textures. In still other embodiments, the substrate has a chemical composition, and the substrate is exposed to a leachant that leaches at least one constituent of the chemical composition to produce a substrate with a varying chemical composition at the substrate surface.

Method of treating a substrate surface, apparatus therefor, and treated glass articles

A thin-film transistor (TFT), includes: a substrate (); an organic semiconductor (OSC) layer () positioned on the substrate; a dielectric layer () positioned on the OSC layer; and a polymeric interlayer () disposed in-between the OSC layer and the dielectric layer, such that the dielectric layer is configured to exhibit a double layer capacitance effect. A method of forming a thin-film transistor, includes: providing a substrate; providing a bottom gate layer atop the substrate; disposing consecutively from the substrate, an organic semiconductor (OSC) layer, a dielectric layer, and a top gate layer; and patterning the OSC layer, the dielectric layer, and the top gate layer using a single mask.

Low-voltage operation dual-gate organic thin-film transistors and methods of manufacturing thereof

Devices include a substrate, a collector layer, and an emitter layer positively biased relative to the collector. Devices further include a semiconductor layer located between the collector and the emitter. The semiconductor layer includes an organic semiconductor polymer with a donor-acceptor structure.

High current OTFT devices with vertical designed structure and donor-acceptor based organic semiconductor materials

Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.

Systems and methods for reducing via formation impact on electronic device formation

An article includes a carrier including a carrier bonding surface, a sheet including a sheet bonding surface, and a surface modification layer disposed on at least one of the carrier bonding surface and the sheet bonding surface. The surface modification layer includes a plasma polymerized material. The plasma polymerized material planarizes the at least one of the carrier bonding surface and the sheet bonding surface. The carrier bonding surface and the sheet bonding surface are bonded with the surface modification layer so that the carrier is temporarily bonded with the sheet. A method of making an article includes depositing a surface modification layer on at least one of a carrier bonding surface and a sheet bonding surface. The method further includes bonding the carrier bonding surface and the sheet bonding surface with the surface modification layer to temporarily bond the carrier with the sheet.

Methods and articles including a sheet and a carrier

Ceramic assembly can comprise a ceramic article comprising a thickness defined between a first major surface and a second major surface. The thickness can be about 100 micrometers or less. The ceramic assembly can comprise a polymer coating deposited over at least an outer peripheral portion of the first major surface of the ceramic article. The polymer coating can comprise a thickness of about 30 micrometers or less. An edge strength of the ceramic assembly can be greater than an edge strength of the ceramic article by about 50 MegaPascals or more. Methods of forming a ceramic assembly can comprise depositing a polymer coating on an outer peripheral portion of a first major surface of a ceramic article. Methods can further comprise curing the polymer coating.

Ceramic assembly and method of forming the same

Display tiles comprising pixel elements on a first surface of a substrate connected by an electrode, a driver located opposite the first surface, and a connector wrapped around an edge surface of the substrate connecting the driver to the pixel elements. Displays comprised of display tiles and methods of manufacturing display tiles and displays are also disclosed.

Bezel-free display tile with edge-wrapped conductors and methods of manufacture

A sub-assembly includes a glass substrate, a plurality of electronic devices, and a passivation layer. The glass substrate includes a first surface, a second surface opposite to the first surface, and a third surface extending between the first surface and the second surface. The glass substrate includes a plurality of laser damaged regions extending from the first surface to the second surface. The plurality of electronic devices are on the first surface of the glass substrate. The passivation layer is on the plurality of electronic devices and the third surface of the glass substrate. The passivation layer includes an opening to each laser damaged region of the plurality of laser damaged regions.

Through glass via fabrication using a protective material

Described herein are electronics that incorporate heterocyclic organic compounds. More specifically, described herein are organic electronics systems that are combined with donor-acceptor organic semiconductors, along with methods for making such devices, and uses thereof.

Described herein are articles and methods of making articles, for example glass articles, including a sheet and a carrier, wherein the sheet and carrier are bonded together using a coating layer, which is, for example, a fluorocarbon polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on the sheet, the carrier, or both, to control the fluorine content of the coating layer and van der Waals, hydrogen and covalent bonding between the sheet and the carrier. The coating layer bonds the sheet and carrier together with sufficient bond strength to prevent delamination of the sheet and the carrier during high temperature processing to while preventing a permanent bond at during high temperature processing while at the same time maintaining a sufficient bond to prevent delamination during high temperature processing.

Methods for treating a substrate and method for making articles comprising bonded sheets

A method of fabricating microstructures of polar elastomers includes coating a substrate with a dielectric material including a polar elastomer, coating the dielectric material with a photoresist, exposing the photoresist to ultraviolet (UV) light through a photomask to define a pattern on the photoresist, developing the photoresist to form the pattern on the photoresist, etching the dielectric material to transfer the pattern from the photoresist to the dielectric material, and removing the photoresist from the patterned dielectric material.

Polar elastomer microstructures and methods for fabricating same

A method of making a device substrate article having a device modified substrate supported on a glass carrier substrate, including:

Device modified substrate article and methods for making

A method of making polycrystalline silicon (p-Si), including: depositing amorphous silicon to produce an amorphous silicon super-mesa; dehydrogenating the amorphous silicon; patterning the super-mesa to produce a patterned substrate; depositing a capping oxide layer on the amorphous silicon on the patterned substrate; heating the capped, patterned substrate to the crystallization temperature of the a-Si; and flash lamp annealing the patterned substrate with a xenon lamp to produce p-Si having at least one super-mesa, and the super-mesa having supersized grains. Also disclosed are p-Si articles and devices incorporating the articles, and an apparatus for making the p-Si articles.

Flash-lamp annealing method of making polycrystalline silicon

Growing community of inventors

Vestal, NY, United States of America

Robert George Manley