L3harris Technologies, Inc.

Robert George

Pedro Rodriguez-garcia

Joshua Martin

Emily Marie Tobar

James Pierpont

Philip Clayton Weatherly

In some aspects, the techniques described herein relate to an apparatus including: a ground plane element including: a non-conductive support layer, a conductive layer arranged on the non-conductive support layer, and at least one orifice through the non-conductive support layer and the conductive laminate layer; one or more radiating elements including a feed line and a solder pad, wherein each of the one or more radiating elements is secured to and electrically connected to the ground plane element via soldering of the solder pad to the conductive laminate layer; and at least one connector arranged in the at least one orifice and electrically connected to the feed line.

Antenna structure

An antenna module comprises: stacked printed circuit boards (PCBs) (stacked PCBs) centered on an axis and including: a first PCB having a ground plane; a second PCB, spaced above the first PCB, having a first radiator pair and a second radiator pair that face the ground plane and orthogonally crisscross each other at the axis, each radiator pair having respective signal and ground connection pads adjacent to the axis to form a coincident phase center at the axis for each radiator pair; a third PCB, spaced above the second PCB, for impedance matching; and signal connectors extending through the first PCB; and support PCBs extending from the ground plane to the second PCB, the support PCBs having microstrip feeds to connect the respective signal and ground connection pads of the first radiator pair and the second radiator pair to the signal connectors and to the ground plane.

Growing community of inventors

Caddo Mills, TX, United States of America

Robert George