Hewlett-packard Development Company, L.p.

Samsung Electronics Co., Ltd.

Hewlett-packard Company

Hewlett Packard Enterprise Development LP

Robert G Walmsley

Peter George Hartwell

Huei Pei Kuo

Michael Renne Ty Tan

Shih-Yuan Wang

Paul Kessler Rosenberg

Wenhua Zhang

Richard Stanley Williams

Donald J Milligan

Rodney L Alley

David A Fattal

Marco Fiorentino

Kent D Vincent

Charles Santori

Janice H Nickel

Duncan R Stewart

Xiao-An Zhang

Jennifer Wu

Lennie K Kiyama

Manuj Bhattacharyya

Steven J Simske

Raymond G Beausoleil

Ning Ge

Frederick A Perner

Yong Qin Chen

Thomas C Anthony

Sagi Varghese Mathai

Henryk Birecki

Gary A Gibson

Eric C Peterson

Wei E Wu

Viktor Shkolnikov

Anita Rogacs

Silam J Choy

Steven Louis Naberhuis

Paul W Poorman

Helen Ann Holder

Heon Ju Lee

Mithra Vankipuram

Mike Alan Holmberg

Qianfan Xu

Bangalore Ramaswamiengar Natarajan

Dennis M Lazaroff

Shih-Yuan (sy) Wang

Victor W Hesterman

James Walter Pearson

Jobst Brandt

Sagi Mathal

Brian D Homeijer

Zhuqing Zhang

Sheldon A Bernard

Sara Jensen Homeijer

An example system is provided in according with one implementation of the present disclosure. The system includes a first sensor positioned at a storage structure displaying an item, where the first sensor is to capture vibration data in proximity to the item. The system further includes a location analysis engine to perform a location analysis of a user, an identity analysis engine to perform an identity analysis of the user, a user interaction engine to perform an interaction analysis of the user's interaction with the item based on the vibration data from the first sensor, and a collaboration engine to perform a collaboration analysis related to the item based on the location analysis of the user, the identity analysis of the user, and the user interaction analysis with the item.

Interaction analysis

A gas conduit directs a flow of gas from a gas flow source. A surface enhanced luminescence (SEL) stage is within the conduit and includes a substrate and nano fingers projecting from the substrate. A heater heats the nano fingers to a temperature so as to soften the nano fingers such that the nano fingers collapse towards each other to capture molecules entrained in the gas therebetween.

Heated NANO finger collapse for capture of molecules in gas for sensing

A sensor having a particle barrier is described. In an example, a sensor includes: first and second electrode sets respectively disposed upon a planar support surface and a proof mass that is compliantly displaceable along a first axis substantially parallel to the planar support surface; and a first barrier disposed on the planar support around the first electrode set having a height less than a gap between the planar support and the proof mass to mitigate particle migration into the first or second electrode set.

Sensor having particle barrier

A device for optically coupling two photonic elements may comprise an interposer where each photonic element is axially aligned with an optical pathway in the interposer. Also included is an optics assembly configured to direct a photonic signal along the optical pathway; and a mechanical guide assembly configured to reduce the relative tilt and rotation of photonic elements. Another such device may comprise two connectors where each connector comprises an optical pathway element in which an optics assembly is situated and a photonic element aligned with the optical pathway element. A mechanical guide assembly secures the optical pathway elements in a position so as to reduce the relative tilt and rotation of the photonic elements. A connection for optically coupling two computing units can comprise a partition situated between the computing units and on which an interposer is mounted.

Device for optically coupling photonic elements

A device including a semiconductor, a substrate, and an interposer. The interposer is attached between the semiconductor and the substrate to absorb stresses between the semiconductor and the substrate.

Device including interposer between semiconductor and substrate

The present disclosure includes structures and methods of forming structures for restricting out-of-plane travel. One example of forming such structures includes providing a first wafercomprising a bond layer of a particular thicknesson a surface of a substrate materialremoving the bond layerin a first area--to expose the surface of the substrate materialapplying a mask to at least a portion of a remaining bond layer----and a portion of the exposed surface of the substrate material in the first area---to form a second area exposed on the surface of the substrate materialetching the second area to form a cavityin the substrate materialand the bond layerand forming by the etching, in the cavitya structure--for restricting out-of-plane travel, where the structure--has a particular height from a bottom of the cavitydetermined by the particular thickness of the bond layer

Out-of plane travel restriction structures

The present disclosure includes methods of forming capacitive sensors. One method includes forming a first electrode array of the capacitive sensor on a first structure. Forming the first electrode array can include: forming a dielectric material on a substrate material; forming an electrode material on the dielectric material; removing portions of the electrode material to form a number of electrodes separated from each other; and removing at least a portion of the dielectric material from between the number of electrodes. The method can include bonding the first structure to a second structure having a second electrode array of the capacitive sensor formed thereon such that the number of electrodes of the first electrode array face a number of electrodes of the second electrode array.

Methods of forming capacitive sensors

Gyroscopes that can compensate frequency mismatch are provided. In this regard, a representative gyroscope, among others, includes a top substrate including an outermost structure, a first driving structure and a first sensing structure. The first driving structure and the first sensing structure are disposed within the outermost structure. The first driving structure and the first sensing structure include a first driving electrode and a first sensing electrode that are disposed on a bottom surface of the first driving structure and first sensing structure, respectively. A portion of the mass on the top surface of the first sensing structure is removed. The gyroscope further includes a bottom substrate that is disposed below the top substrate. The bottom substrate includes a second driving electrode and a second sensing electrode that are disposed on a top surface of the bottom substrate and below the first driving electrode and the first sensing electrode.

Compensating frequency mismatch in gyroscopes

Beam couplers and splitters are disclosed herein. An example of a beam coupler and splitter includes a first waveguide having a first waveguide bevel and a bend, the first waveguide bevel to totally internally reflect at least some light incident thereon. A second waveguide includes a second waveguide bevel complementarily shaped to the first waveguide bevel, the second waveguide being coupled to the first waveguide such that i) the first waveguide bevel is offset from the second waveguide bevel so that a first portion of the first waveguide bevel is in direct contact with a first portion of the second waveguide bevel, a second portion of the first waveguide bevel is exposed, and a second portion of the second waveguide bevel is exposed, and ii) a predetermined coupling ratio is achieved.

Optical beam couplers and splitters

A transducer head apparatus () is disclosed for concurrently transferring data relative to a plurality of tracks on a data carrier. The head apparatus comprises a body () extending longitudinally, the body supporting a plurality of longitudinally spaced transducer elements (), and adjuster apparatus () operable to adjust the relative longitudinal dispositions of at least some of the transducer elements.

Adjusting a transducer head for transferring data

Various systems and methods for sensing are provided. In one embodiment, a sensing system is provided that includes a first electrode array disposed on a proof mass, and a second electrode array disposed on a planar surface of a support structure. The proof mass is attached to the support structure via a compliant coupling such that the first electrode array is positioned substantially parallel to and faces the second electrode array and the proof mass is capable of displacement relative to the support structure. The first electrode array includes a plurality of first patterns of electrodes and the second electrode array includes a plurality of second patterns of electrodes. The sensing system further includes circuitry configured to provide an input voltage to each of the second patterns of electrodes to produce an electrical null position for the first electrode array.

Three phase capacitance-based sensing

Embodiments of the present invention relate to a family of image-rotation prisms. Each image-rotation prism has the property that as an image-rotation prism is rotated, an image passing through the image-rotation prism rotates at twice the angular rate of the image-rotation prism. Embodiments of the present invention include optical systems that can be used for board-to-board communications and employ the image-rotation prisms to compensate for arbitrary axial rotations and misalignment of optical signals and can be used to direct optical signals output from transmitters on one board to particular detectors of a detector arrangement located on an adjacent board.

Image-rotation prisms and optical interconnects employing the same

A system for bi-directional data transmission includes a first array coupled to a first subsystem and a second array coupled to a second subsystem. The first array includes a first plurality of transmitters that produce first optical signals that are transmitted through free space, and a first plurality of receivers. The second array includes a second plurality of transmitters that produce second optical signals that are transmitted through free space to the first plurality of receivers, and a second plurality of receivers that is configured to receive the first optical signals. An image-forming apparatus is operatively positioned between the first and second arrays and is configured to concurrently form an image of the first plurality of transmitters on the second plurality of receivers and an image of the second plurality of transmitters on the first plurality of receivers.

Arrays, system and method for bi-directional data transmission

A solid core, multi-channel optical coupler comprising an elongate mixer body having an input end, an output end and sidewalls forming a length of the mixer body, where the input end is configured for coupling to a plurality of input channels providing an optical signal for transmission through the mixer body, and a plurality of output tapers coupled to the output end. Each of the output tapers has a reception area adjacent the output end of the mixer body for receiving a portion of the optical signal transmitted through the mixer body. Furthermore, the reception area of each output taper is variable to vary the intensity of the optical signal received by the output taper.

Multi-channel optical coupler

Beam couplers and splitters are disclosed herein. An embodiment of a beam coupler and splitter includes a first waveguide including a bevel and a bend, and a second waveguide including a bevel complementarily shaped to the first waveguide bevel. The first waveguide bevel is configured to totally internally reflect at least some light incident thereon. The second waveguide is coupled to the first waveguide such that i) the second waveguide bevel is adjacent to at least a portion of the first waveguide bevel, and ii) a predetermined coupling ratio is achieved.

Growing community of inventors

Palo Alto, CA, United States of America

Robert G Walmsley