Ppg Industries Ohio, Inc.

Ppg Industries, Inc.

Nissan Chemical Industries Limited

Liquid X Printed Metals, Inc.

Other

Hewlett-packard Company

Azdel, Inc.

Nissan Chemical Corporation

Robert G Swisher

Alan E Wang

Elena E Sheina

Carol L Knox

Luciano M Parrinello

James L Boyer

Peter C Gaa

Thomas V Thimons

William C Allison

James W Kasunic

Yongsheng Hou

Christianna M Petrak

Christine Gardner

Travis Swisher

Floryan De Campo

Balbhadra Das

Hendrik Theodorus Van De Grampel

Jing Wang

Louis J Nehmsmann

Richard P Beaver

Robert G Briody

Huawen Li

Sergey B Li

Dennis O Spencer

Chengeto Gwengo

Anastasia Morfesis

Johnson C Watkins

Carolyn Skillman

Marc Sims

Christine Gardenr

Described herein are molecular inks, methods for printing the molecular inks on flexible substrates, and methods for forming printed electronic elements, such as resistive heaters, force sensors, motion sensors, and devices that include these elements, such as force responsive conductive heaters. The methods include printing a molecular ink on a flexible substrate that is heated to 30° C. to 90° C. before and/or during the printing process and curing the substrate to produce a conductive pattern thereon. The molecular inks generally include a particle-fee metal-complex composition formulated from at least one metal complex and a solvent, and optionally, a conductive filler material, and/or surfactant.

Molecular ink and method for printing resistive film coatings

Dielectric coating compositions are provided. The dielectric coating compositions generally include an aqueous binder, an inorganic nanoparticle, and a solvent, and can be formulated for specific printing methods, such as inkjet printing. The dielectric coating compositions are curable to provide scratch resistant coatings useful as insulating layers.

Thermal cure dielectric ink

Described herein are methods for forming e-textiles, wherein the methods include printing a particle-free conductive ink on a textile substrate, and curing the textile substrate to produce a conductive pattern thereon. The printing may include inkjet printing and may produce a printed pattern which exhibits an ink bleed of less than 0.5 mm, such as less than 0.2 mm. During printing, the textile substrate may be heated to a temperature of 30&#xb0; C. to 90&#xb0; C. before and during the printing process. The fabric substrate may be cured using heat and/or light to produce a conductive pattern having a sheet resistance of less than 10&#x3a9;/&#x25a1;, or even less than 1&#x3a9;/&#x25a1;.

E-textiles fabricated using particle-free conductive inks

Described herein are non-aqueous ink compositions containing a polythiophene having a repeating unit complying with formula (I) described herein, a transition metal complex having at least one &#x3b2;-diketonate ligand, and a liquid carrier having one or more organic solvents. The present disclosure also concerns the uses of such non-aqueous ink compositions, for example, in organic electronic devices.

Non-aqueous ink compositions containing transition metal complexes, and uses thereof in organic electronics

Microporous materials that include thermoplastic organic polyolefin polymer (e.g., ultrahigh molecular weight polyolefin, such as polyethylene), particulate filler (e.g., precipitated silica), and a network of interconnecting pores, are described. The microporous materials of the present invention possess controlled volatile material transfer properties. The microporous materials can have a density of at least 0.8 g/cm; and a volatile material transfer rate, from the volatile material contact surface to the vapor release surface of the microporous material, of from 0.04 to 0.6 mg/(hour*cm). In addition, when volatile material is transferred from the volatile material contact surface to the vapor release surface, the vapor release surface is substantially free of volatile material in liquid form.

Microporous material

Described herein are compositions comprising hole carrier materials, typically conjugated polymers, and fluoropolymers ink compositions comprising hole carrier materials and fluoropolymers, and uses thereof, for example, in organic electronic devices.

Compositions containing hole carrier materials and fluoropolymers, and uses thereof

Described herein are non-aqueous ink compositions containing a sulfonated conjugated polymer, a polymeric acid, an optional matrix compound, and an amine compound. The present disclosure also concerns the uses of such non-aqueous ink compositions, for example, in organic electronic devices.

Non-aqueous compositions having sulfonated polythiophenes suitable for use in organic electronics

An ice fishing accessory support apparatus for supporting fishing accessories may comprise a base portion for resting upon a surface, and an upright portion mounted on the base portion. The upright portion may be movable with respect to the base portion between collapsed and deployed positions. The collapsed position may be characterized by the upright portion oriented substantially parallel to the base portion and the deployed position being characterized by the upright portion oriented substantially perpendicular to the base portion. At least one shelf portion may be mounted on the upright portion, and may be movable between a lowered position and a raised position. The raised position may be characterized by the shelf portion oriented substantially perpendicular to the upright portion and the lowered position being characterized by the shelf portion oriented substantially parallel to the upright portion.

Ice fishing accessory support apparatus

The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.

Polyurethane urea polishing pad

A polishing pad is described as comprising, (a) particulate polymer which can be chosen from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked polyurethane and/or particulate crosslinked polyepoxide) and mixtures thereof; and (b) organic polymer binder (e.g., polyurethane binder and/or polyepoxide binder), which can bind the particulate polymer together, wherein said organic polymer binder can be prepared in-situ. The particulate polymer and organic polymer binder can be distributed substantially across the work surface the polishing pad, and the pad can have a percent pore volume of from 2 percent by volume to 50 percent by volume, based on the total volume of said polishing pad.

Polishing pad

The present invention relates to a polishing pad. In particular, the polishing pad of the present invention comprises a sublayer, a middle layer, and a top layer which can function as a polishing layer. The polishing pad of the present invention is useful for polishing articles and particularly useful for chemical mechanical polishing or planarization of a microelectronic device, such as a semiconductor wafer.

Polishing pad for planarization

A polishing pad is described as comprising, (a) particulate polymer selected from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked polyurethane and/or particulate crosslinked polyepoxide) and mixtures thereof; and (b) crosslinked organic polymer binder (e.g., crosslinked polyurethane binder and/or crosslinked polyepoxide binder), which binds the particulate polymer together. The particulate polymer and crosslinked organic polymer binder are distributed substantially uniformly throughout the polishing pad, and the pad has a percent pore volume of from 2 percent by volume to 50 percent by volume, based on the total volume of said polishing pad. Polishing pad assemblies are also described.

Growing community of inventors

Pittsburgh, PA, United States of America

Robert G Swisher