Texas Instruments Corporation

Robert G McKenna

R Scott Croff

Homer B Klonis

Edwin L Tom

Cecil J Davis

Lawrence D Dyer

John I Jones

Michael A Mignardi

Laurinda W Ng

Ronald A Jascott

Larry A Harmon

Don Brown

Don Hyde

David Durin

Michael G Baxter

Ronald S Croff

An improved spatial light modulator package comprising a spatial light modulator attached to a central region of a substrate , a sealing ring on said substrate around the central region thereof, a window frame attached to the sealing ring , and a window glued to the window frame . Gluing the window to the window frame avoids distortion of the glass that occurs when the window is heat bonded to the window frame, and avoids having to grind and polish the glass window after it is bonded to the window frame.

Adhesive-sealed window lid for micromechanical devices

A method and apparatus for separating a wafer into wafer portions comprising a larger wafer flex-frame ( ) supported on a support base ( ) and a smaller flex-frame ( ) positioned within the support base ( ). A wafer film transfer cylinder ( ) encompasses a wafer breaking device ( ), such as a convex dome. The transfer cylinder ( ) is slidable downwardly with respect to the dome ( ) to first stretch the wafer tape ( ) and then transfer the wafer ( ) from the larger frame ( ) to the smaller frame ( ) after dome ( ) breaks the wafer ( ) into die. The transfer cylinder ( ) is heated to facilitate removing the saw tape ( ) from the larger frame ( ) after transfer to the smaller frame ( ). The transfer cylinder ( ) is juxtaposed with the smaller frame ( ) residing within a cavity ( ) of the support base ( ). The present invention is suited for automated wafer transfer carriers which advance the broken wafer to pick and place equipment for packaging of the die.

Method and apparatus for stretching and processing saw film tape after breaking a partially sawn wafer

A method and apparatus ( ) for securing a fragile wafer ( ) to a wafer tape ( ) secured taut across a wafer frame ( ). A gentle point force ( ) is provided by a roller wheel ( ) mounted on a rotatable arm ( ) to securely adhere the wafer tape ( ) to the backside of the wafer ( ). Preferably, a spiral pattern ( ) is formed by the rotating roller ( ) to secure the wafer tape ( ) to the wafer ( ) to avoid forming air bubbles or creases between the wafer tape and wafer. The method and apparatus is especially suitable for securely adhering fragile wafers to wafer tape that are to be subsequently broken along kerfs.

Method of adhering a wafer to wafer tape

A method and apparatus (,) for breaking a wafer (,) into die (,) having a high aspect ratio. In one embodiment, a multi-radii dome (,) is utilized to controllably break the wafer in two directions. The two different dome curvatures (R1, R2) provide an even, controlled, force along the kerfs in both the X-direction and the Y-direction. In another embodiment, a cylindrical dome (,) being curved (R3) in the Y-direction and flat in the X-direction is used to break a wafer into die having exceptionally high aspect ratios. The present invention reduces the likelihood of die fracture in the long dimension during the wafer break process. The wafer (,) is mounted on stretchable wafer tape (,) during the break process to prevent the die edges from contacting and rubbing with one another after the break process. The present invention allows separation of die of exceptionally large aspect ratios such as those having a 1:25 aspect ratio.

Method of breaking and separating a wafer into die using a multi-radii dome

A method and apparatus (,) for breaking a wafer (,) into die (,) having a high aspect ratio. In one embodiment, a multi-radii dome (,) is utilized to controllably break the wafer in two directions. The two different dome curvatures (R,R,) provide an even, controlled, force along the kerfs in both the X-direction and the Y-direction. In another embodiment, a cylindrical dome (,) being curved (R,) in the Y-direction and flat in the X-direction is used to break a wafer into die having exceptionally high aspect ratios. The present invention reduces the likelihood of die fracture in the long dimension during the wafer break process. The wafer (,) is mounted on stretchable wafer tape (,) during the break process to prevent the die edges from contacting and rubbing with one another after the break process. The present invention allows separation of die of exceptionally large aspect ratios such as those having a 1:25 aspect ratio.

Method and apparatus for breaking and separating a wafer into die using a multi-radii dome

A method and apparatus (10) for securing a fragile wafer (16) to a wafer tape (26) secured taut across a wafer frame (24). A gentle point force (72) is provided by a roller wheel (36) mounted on a rotatable arm (30) to securely adhere the wafer tape (26) to the backside of the wafer (16). Preferably, a spiral pattern (70) is formed by the rotating roller (36) to secure the wafer tape (26) to the wafer (16) to avoid forming air bubbles or creases between the wafer tape and wafer. The method and apparatus is especially suitable for securely adhering fragile wafers to wafer tape that are to be subsequently broken along kerfs.

Method of adhering a wafer to a wafer tape

A gasket sealed integrated circuit package (10) including a top member (12) clamped to a bottom member (18) with a gasket seal ring (26) sealed therebetween. Seal ring (26) encompasses an active portion (30) of an integrated circuit (22) to seal an active portion (30) from the ambient without inducing warp or stress on the circuit (30). The package further includes a glass lid (16) clamped within the package. The integrated circuit (22) preferably comprises a micromechanical device (30) formed on a ceramic substrate (24), such as a DMD type spatial light modulator, but can comprise of other devices as well. The package can be easily disassembled to change out the glass lid (16) or integrated circuit substrate (24) and allows sealing of the substrate (24) without subjecting the integrated circuit die (30) to elevated temperatures. The present invention is especially suited for elongated integrated circuits (30).

Gasket sealed integrated circuit package

A method and apparatus (10) for securing a fragile wafer (14) to a wafer tape (51) secured taut across a wafer frame (50). A controlled jet of gas (46) is directed by a nozzle (45) against the backside of the wafer tape (51) to securely adhere the wafer tape (51) to the backside of the wafer (14). Preferably, a spiral pattern (70) of air is directed by the nozzle (45) to secure the wafer tape (51) to the wafer (14) without forming air bubbles or creases between the wafer tape and wafer. Such a method and apparatus is especially suitable for securely adhering fragile wafers to wafer tape that are subsequently broken along kerfs and which wafers are inverted to allow particles to drop downwardly.

Noncontact method of adhering a wafer to a wafer tape

A method of separating wafers, such as those used for semiconductor device manufacture, into die. A partly fabricated wafer is covered with a protective coating over its top surface (10). The wafer is then inscribed to define separation lines between die, with the separation lines being of a predetermined depth (12). The protective coating is then removed (14), and at least one processing step is performed at the wafer level (15, 22-24), before the inscribed wafer is separated into die. Then, the wafer is separated into die along the separation lines (17).

Separation of wafer into die with wafer-level processing

A vacuum collet (10) for picking up a semiconductor die (11). A plate (12) has a vacuum tube (15) and a downwardly extending skirt (19). Skirt (19) contacts the perimeter of die (11). The vacuum is distributed to the perimeter of the semiconductor die (10) by a baffle (16) interposed between the plate (12) and the die (11) and within the skirt (19).

Baffled collet for vacuum pick-up of a semiconductor die

An apparatus and method are disclosed that prevent the breakage of semiconductor wafers that have not been entirely sawed, during the process of removing dicing tape from the back of the wafer. In addition, an improved semiconductor demounter is disclosed that allows optimum positioning of the semiconductor wafer for removal of the dicing tape. The apparatus for preventing breakage of semiconductor wafers consists of a leveling block 32 for use with a semiconductor demounter 16 having an incline 18 leading up to a tape removal apparatus 20. The leveling block 32 comprises an declined plane 34 with an angle of declination 36 approximately equal to the angle of inclination 26 of the incline leading up to the tape removal apparatus 20. The declined plane 34 rests on top of the incline 18 leading up to the tape removal apparatus 20, thereby forming a substantially level surface leading into the tape removal apparatus 20 and allowing the dicing tape 12 to be removed from the surface of a semiconductor wafer 10 while reducing the likelihood of breaking the wafer 10. The leveling block 32 includes one or more fastening points 38 for affixing the block to a semiconductor demounter.

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Houston, TX, United States of America

Robert G McKenna