Honeywell G.m.b.h.

Other

Robert G Johnson

Robert E Higashi

Philip J Bohrer

James O Holmen

Jeffrey Alan Ridley

Steven D James

Ulrich Bonne

Thomas E Hendrickson

Ernest Allen Satren

G Benjamin Hocker

M Walter Scott

Rebecca A Reed

John P Levy

Ronald B Foster

Uppili Sridhar

Mona M Abdelrahman

Ralph W Fuchs

James O Holman

John P Sumner

Joseph Mcnulty

A thermal isolation microstructure fabricated by a process which allows the ultra thinning of support legs for the microdetector.

Thermal isolation microstructure

The plate body of a hydrodynamic depressor is composed of a flat central panel flanked along its opposite longitudinal edges by side panels disposed at dihedral angles to the central panel. A housing carried by the forward portion of the body has a cylindrical crossbore receiving a cylindrical weight that can be shifted transversely of the fishing line and the fishing line and bait leader can be offset from the vertical longitudinal central plane of the depressor body to trim the depressor for traveling along a course offset to port or starboard from the course of the leading end of the fishing line. The upper and lower surfaces of the side panels are crinkled or rippled to form light-reflecting surfaces producing a glitter for attracting fish.

Tripanel hydrodynamic depressor for fishing lines

A two-level IR detector imaging array of high fill-factor design. The upper microbridge detector level is spaced above and overlies the integrated circuit and bus lines on the substrate surface below.

Thermal sensor

A sensor element that is adapted to respond to radiation, and which is adapted to the manufacture of a sensor array is manufactured into a single crystal semiconductor means such as silicon. An anisotropically etched pit is provided under the sensing surface, and the pit generally corresponds to the geometry of the sensor element. The geometry is selected to be rectangular and falls along a selected orientation of the particular crystalline structure used for manufacture of the device to thereby allow a high density of sensor elements to provide an efficient array.

Integrated micromechanical sensor element

A thermoelectric sensor element that is adapted to respond to thermal radiation is capable of manufacture into a sensor array on a single crystal semiconductor means, such as silicon. An anisotropically etched pit is provided under the sensing surface, and the pit generally corresponds to the geometry of the sensor element. The geometry is selected to be rectangular and falls along a selected orientation of the particular crystalline structure used for manufacture of the device to thereby allow for a high density of the sensor elements. The sensor elements are manufactured of two dissimilar metals in a sinuous pattern to provide the thermoelectric effect.

Micromechanical thermoelectric sensor element

The plate body of a hydrodynamic depressor is composed of a flat central panel flanked along its opposite longitudinal edges by side panels disposed at dihedral angles to the central panel. The central panel carries a guide rod extending fore and aft along which a ring connected to a fishing line slides, and ribs are engageable by the guide rod to deter displacement of the connecting ring from a rearward position to a forward position or vice versa. A housing carried by the forward portion of the body has a cylindrical crossbore receiving a cylindrical weight that can be shifted transversely of the fishing line guide rod to trim the depressor for traveling along a course offset to port or starboard from the course of the leading end of the fishing line. The upper and lower surfaces of the side panels are crinkled or rippled to form light-reflecting surfaces producing a glitter for attracting fish.

A semiconductor device comprising a semiconductor body having a depression formed into the first surface of the body. The device further comprises member means comprising a thermal-to-electric transducer or static electric element, the member means having a predetermined configuration suspended over the depression. The member means is connected to the first surface so that the predetermined configuration is cantilevered over the depression, the depression opening to the first surface around at least a portion of the predetermined configuration. The depression provides substantial physical and thermal isolation between the element and the semiconductor body. In this manner, an integrated semiconductor device provides an environment of substantial physical and thermal isolation between the transducer or element and the semiconductor body.

Cantilever semiconductor device

The marginal adhesion of platinum to silicon nitride is a serious issue in the fabrication of microbridge mass air flow sensors. High temperature stabilization anneals (500.degree.-1000.degree. C.) are necessary to develop the properties and stability necessary for effective device operation. However, the annealing process results in a significant reduction in the already poor platinum/silicon nitride adhesion. Annealing at relatively high temperatures leads to the development of numerous structural defects and the production of non-uniform and variable sensor resistance values. The use of a thin metal oxide adhesion Layvr, approximately 20 To 100 angstromw in thickness is very effective in maintaining platinum adhesion to silicon nitride, and through the high temperature anneal sequence.

Adhesion layer for platinum based sensors

A microbridge air flow sensor which has a sealed etched cavity beneath the silicon nitride diaphragm so that the cavity is not susceptible to contamination from residual films or other material accumulating within the cavity. The cavity thermally isolates the heater and detectors which are encapsulated in the diaphragm. The cavity is fabricated by front side etching of the silicon wafer. Narrow slots are made through the silicon nitride diaphragm to expose a thin film (400 angstrom) rectangle of aluminum. A first etch removes the aluminum leaving a 400 angstrom very shallow cavity under the diaphragm. Anisotropic etch is then introduced into the shallow cavity to etch the silicon pit.

Thin film orthogonal microsensor for air flow and method

Method for making thin film orthogonal microsensor for air flow

An improved connector pad stack structure for use in microstructure devices having a silicon nitride surface in which the sensor metal such as platinum or Ni-Fe is eliminated from the pad bonding site and only adhesion promoting metals are used on the Si.sub.3 N.sub.4 to provide a stronger, more durable and reliable pad stack.

Microbridge sensor bonding pad design for improved adhesion

An integrated semiconductor device includes a semiconductor body with a first surface having a predetermined orientation with respect to a crystalline structure in the semiconductor body. The semiconductor body has a depression formed into the first surface of the body. A layer of thin film material covers at least a portion of the first surface and includes an electric, thermal-to-electric, or electric-to-thermal element. The diaphragm apparatus forms a slotted diaphragm substantially covering the depression. The slotted diaphragm includes one or more slots sized and oriented so that, in the fabrication of the device, an anisotropic etch placed on the slot or slots will completely undercut the diaphragm and form the depression. The electric, thermal-to-electric, or electric-to-thermal element is substantially supported by the diaphragm and, therefore, is substantially thermally and physically isolated from the semiconductor body.

Method of making slotted diaphragm semiconductor devices

Slotted diaphragm semiconductor device

The sensors and heater of a microbridge flow sensor are each compensated for non-linear curvature of the resistance versus temperature curve by the use of a section of permalloy in series with a section of platinum thin film resistor. The platinum exhibits non-linearity in one direction and the permalloy exhibits non-linearity in the opposite direction.

Resistance with linear temperature coefficient

Disclosed is a heating system having a combustion air blower, a fuel valve for providing fuel to a burner, and an exhaust stack for exhausting combustion products. Also disclosed is flow sensor apparatus operatively associated with the stack for providing control signals to a furnace control, the control signals being related to flow conditions in the stack.

Growing community of inventors

Minnetonka, MN, United States of America

Robert G Johnson