Telefonaktiebolaget Lm Ericsson (publ)

Robert Frank Brunner

Stephane Lessard

Martin Julien

Qing Xu

Neng Liu

Mehrdad Mir Shafiei

Laurent Marchand

Ludovic Beliveau

David Gordon

Luca Giorgi

Richard Joseph Brunner

Sergey Slovetskiy

David V Plant

Tommaso Catuogno

Julie Dufort

Saber Md Ghulam

Ramon Gutierrez Castrejon

Stéphane Lessard

Methods in an optical receiver, for decoding a received M-level pulse-amplitude-modulated, PAM-M, optical signal. An example method comprises, for a first interval, decoding () the received PAM-M optical signal using a standard PAM-M decoder with M-1 thresholds, using first sampling times, to obtain a first set of decoded bits, and decoding () the received PAM-M optical signal using a duobinary decoder with 2M-2 thresholds, at second sampling times offset from the first sampling times, to obtain second set of decoded bits. The method further comprises calculating () first and second error metrics corresponding to the first and second sets of decoded bits, respectively, and selecting () the standard PAM-M decoder or the duobinary decoder for subsequent decoding of the received PAM-M optical signal, based on the first and second error metrics.

Chromatic dispersion tolerant PAM-M transceiver for optical routing to extended paths

A chip carrier socket for an electronic-photonic integrated-circuit (EPIC) assembly comprises a carrier bottom and a carrier top configured to mate to the carrier bottom while enclosing the EPIC assembly within an enclosed cavity. The carrier bottom comprises one or more conductive vias passing from a first surface of the carrier bottom to an opposite second surface of the carrier bottom, each conductive via providing electrical connectivity between an electrically conductive pad on the first surface of the carrier bottom and a respective electrically conductive pad, solder ball, or electrically conductive spring on the second surface of the carrier bottom. One or both of the carrier bottom and the carrier top comprises a fluid inlet port and a fluid outlet port. Further, either or both of the carrier bottom and the bottom top comprises an optical via passing from one surface to another of the carrier bottom or carrier top.

Chip-carrier socket for microfluidic-cooled three-dimensional electronic/photonic integrated circuits

A radio-frequency three-dimensional electronic-photonic integrated circuit (RF 3D EPIC) comprises a radio-frequency (RF) photonic integrated circuit (PIC) layer, the RF PIC layer comprising, in a single integrated circuit, at least one RF antenna and at least one photonic device coupling the RF antenna to an optical interface, and further comprises an electronic-photonic integrated circuit (EPIC) assembly optically coupled to the optical interface of the RF PIC layer, the EPIC assembly comprising two or more integrated-circuit dies bonded to one another so as to form a die stack, wherein at least one of the two or more integrated-circuit dies comprises one or more integrated photonic devices and wherein each of the two or more integrated-circuit dies is electrically connected to at least one other integrated-circuit die via an electrically conductive through-wafer interconnect or an electrically conductive through-wafer via.

Radio-frequency three-dimensional electronic-photonic integrated circuit with integrated antennas and transceivers

According to an aspect, an optical system includes a laser diode configured to emit optical signals and at least two size-switchable broken racetrack ring resonators optically coupled to an optical waveguide, where each broken racetrack ring resonator is configured to exhibit a resonant wavelength. The optical system also includes a tuning arrangement associated with the broken racetrack ring resonators, where the tuning arrangement includes a micro electro-mechanical system (MEMS) or nano electro-mechanical system (NEMS) actuator mechanically coupled to a first portion of a first one of the broken racetrack ring resonators and configured to mechanically move the first portion so as to change the resonant wavelength of the first one of the broken racetrack ring resonators.

MEMS/NEMS integrated broken racetrack tunable laser diode

An electronic-photonic integrated-circuit assembly comprises a carrier substrate () and one or more integrated-circuit dies () bonded to one another so as to form a die stack with exterior surfaces corresponding to an outer surface of a first one of the integrated-circuit dies and to an outer surface of a second one of the integrated-circuit dies, where at least one of the integrated-circuit dies includes one or more integrated photonic devices. One or more channels or passages () are formed into the outer surface of the first one of the integrated-circuit dies, and a first surface of the carrier substrate () is bonded to the outer surface of the first one of the integrated-circuit dies, thereby enclosing the one or more channels or passages (), The integrated-circuit dies are electrically connected to each other via electrically conductive through-wafer interconnects or electrically conductive through-wafer vias.

Stacked microfluidic cooled 3D electronic-photonic integrated circuit

There is provided a reconfigurable optical modulator comprising a light source and a splitter operative to receive an input signal from the light source and to split the input signal into a plurality of split signals. The optical modulator comprises a plurality of optical amplifiers, each being operative to receive one of the plurality of split signals as an input and to act as a switch having a first state where the split signal is blocked and a second state where the split signal is amplified. The optical modulator comprises a plurality of modulators, each being operative to receive an amplified split signal from one of the plurality of optical amplifiers and to modulate the amplified split signal into a modulated signal. The optical modulator comprises an optical combiner operative to combine a plurality of modulated signals produced by the plurality of modulators to thereby produce a modulated output signal.

Reconfigurable optical modulator

A small form-factor pluggable (SFP) module and related method are provided to perform additional packet processing in a communication network. The SFP module is generally configured to at least partially process data packets as they transit from a first networking equipment toward a second networking equipment in order to modify or otherwise update header information of the packets as a function of the content of their data payload. Modifying header information of data packets as they transit between interconnected networking equipments allows interconnected networking equipments to perform packet processing on the modified header information.

Small form-factor pluggable module

The disclosure relates to a tunable microring resonator, comprising a primary waveguide having first and second ends, a plurality of secondary waveguides each having a different length and each having first and second ends and a Micro-Electro-Mechanical System (MEMS) adjustable to optically couple at least a first end of the primary waveguide with a first respective end of a selected secondary waveguide thereby allowing light to circulate within the tunable microring resonator.

Tunable microring resonator

The teachings herein disclose a laser assembly () that implements a 'composite cavity' formed in part in a III/V die (), in part in a silicon die (), and in part in a glass member () having a waveguide () coupling the cavity portion in the III/V die with the cavity portion in the silicon die. This arrangement capitalizes on the lasing efficiency of the III/V die, which is used as the gain medium while advantageously using the glass member to extend the lasing cavity into the silicon die. Laser-scribing the cavity waveguide in place after mounting the III/V die, the silicon die or dies, and the glass member, greatly relaxes the mounting alignment precision needed for the constituent parts of the overall assembly. Moreover, in one or more embodiments, glass member includes one or more laser-scribed waveguides operative as optical interconnects going between two or more silicon dies.

Laser apparatus having a composite laser cavity

A function-specific network interface module is provided which includes a housing and a connection interface at opposing ends of the housing configured to connect to another function-specific network interface module in a cascaded manner. The function-specific network interface module further includes one or more circuit components operable to provide a dedicated network function so that a plurality of different network functions is provided when the function-specific network interface module is connected to the other function-specific network interface module via the connection interface.

Stackable interface modules for customized network functions

Optical waveguide coupling ratios can be modified for a package by providing a substrate with a photonic circuit disposed on a first section of the substrate and a plurality of optical waveguides formed in glass disposed on a second section of the substrate, the waveguides being connected to the photonic circuit, adjacent ones of the waveguides having a fixed coupling ratio. A three-dimensional region of the glass abutting an end of one or more of the waveguides is lased to change a refractive index of the glass in each three-dimensional region, and thereby extend a length of each waveguide abutting one of the three-dimensional regions so that the coupling ratio between that waveguide and an adjacent waveguide is changed as a function of the extended length. The lasing is controlled based on feedback so that each coupling ratio changed by the lasing varies by less than a target amount.

Radiation scribed waveguide coupling for photonic circuits

A wavelength converter includes first silicon waveguides and second silicon waveguides intersecting the first silicon waveguides to form an arrayed waveguide. The arrayed waveguide receives optical data signals at the same wavelength at a first input and optical pump signals at different wavelengths at a second input. Microring resonators evanescently couple different ones of the first silicon waveguides to different ones of the second silicon waveguides. Each microring resonator is tuned to the wavelength of the optical data signals or one of the wavelengths of the optical pump signals, so that different combinations of the optical data signals and the optical pump signals are provided at an output of the arrayed waveguide. A non-linear optical media converts the wavelength of each combined optical signal at the output of the arrayed waveguide to yield wavelength converted signals each having a new dedicated wavelength.

Parallel and WDM silicon photonics integration in information and communications technology systems

Presented is a system and method for distributing a network application across a plurality of geographically dispersed network sites. The system comprises a plurality of network sites connected by a shared network and interconnected by a dedicated non-blocking communication network. The system can use different interconnecting network topologies based on the number of sites to be interconnected. The method balances the network application load and resources across the interconnected network sites based on a distribution policy implemented without burdening the shared network. The method provides redundancy capabilities by detecting the loss of a network site and redistributing the network application load to the remaining network sites.

Method and system for distributing a network application among a plurality of network sites on a shared network

An optical patch unit is adapted for mounting in or on an optical equipment rack and facilitates a migration from one optical shuffle box or topology to another. The optical patch unit simplifies the replacement of an optical shuffle box, in some cases allowing a phased migration that minimizes system down-time. The optical patch units described herein include passive optical patch panels. Chassis card and optical shuffle connections are terminated at the passive optical patch panel, making it possible to simplify the cabling between the chassis cards and the optical shuffle box. Once installed, chassis card cables do not need to be manipulated at all during subsequent optical shuffle maintenance procedures. Other optical patch units described herein include active optical patch units, which make the migration process less dependent on human intervention and can further reduce system down-time.

Fine-grained optical shuffle interconnect topology migration

An optical communications system includes a first plurality of optical components having optical ports, a second plurality of optical components having optical ports and an optical cross-connect. The optical cross-connect includes a block of a single continuous construction and material having a first side adjacent the first optical components and a second side adjacent the second optical components, and a plurality of non-intersecting, continuous waveguides formed within the block and extending from the first side of the block to the second side of the block. The refractive index of each waveguide is different than the surrounding material of the block, and each waveguide changes direction at least once within the block. The waveguides are optically aligned with the optical ports of the first optical components at the first side of the block and with the optical ports of the second optical components at the second side of the block.

Growing community of inventors

Montreal, Canada

Robert Frank Brunner