Sandisk Corporation

Other

Sandisk Technologies Inc.

Socket Communications, Inc.

Robert F Wallace

Eli Harari

Robert C Miller

Edwin J Cuellar

Hem P Takiar

Robert D Norman

Wesley G Brewer

Daniel C Guterman

Joel Bernard Jacobs

Robert Andrew Howard

Motohide Hatanaka

Matthew Q Shaw

Yosi Pinto

Yoram Cedar

Bo Eric Ericsson

Matt Peterson

Leonard L Ott

Kevin J Mills

Michael Gifford

Eliyahou Harai

Eliyahou Harari

A therapeutic delivery device comprises a layer of biodegradable material wound into a plurality of windings, the plurality of windings comprising an outermost winding defining an internal volume and winding pairs including a first winding pair and a second winding pair. A first therapeutic mass is incorporated in or on the layer the first winding pair and a second therapeutic mass is incorporated in or on the layer along the second winding pair. Perforations extend through at least selected windings.

Therapeutic delivery device

A biodegradable therapeutic carrier and implant comprises a layer of biodegradable electrospun material and floored wells formed by the layer to contain therapeutic.

Electrospun therapeutic carrier and implant

A needle shell is inserted through skin with a needle insert within the needle shell occluding an insertion end of the needle shell. The needle insert is withdrawn from the needle shell and an implant tube is inserted into the needle shell and below the skin, wherein the implant tube is slid within the needle shell while the needle shell is below the surface of the tissue. Interior surfaces of the implant tube contact and guide sliding movement of the implant. An implant insertion rod is inserted into the needle shell to implant an implant below the skin.

Implant insertion system

A therapeutic delivery device comprises a layer of biodegradable material wound into a plurality of windings, the plurality of windings comprising an outermost winding defining an internal volume and winding pairs including a first winding pair and a second winding pair. A first therapeutic mass is incorporated in or on the layer the first winding pair and a second therapeutic mass is incorporated in or on the layer along the second winding pair. In one implementation, at least one volume of gas is captured within the internal volume and occupies at least 50% of the internal volume. In one implementation, the windings include perforations.

A therapeutic implantable device comprises a biodegradable outer shell, a plurality of spaced biodegradable layers within the outer shell, a first therapeutic mass between the plurality of spaced biodegradable layers and a second therapeutic mass between the plurality of spaced biodegradable layers. The plurality of spaced biodegradable layers are arranged such that the first therapeutic mass is exposed external to the implantable device before exposure of the second therapeutic mass external to the implantable device.

Therapeutic implantable device

A mother/daughter card non-volatile memory system includes a daughter card containing the memory and a mother card containing the memory controller and host interface circuits. The daughter memory card contains as little more than the memory cell array as is practical, in order to minimize its cost, and has an interface for connecting with a variety of mother controller cards having physical attributes and host interfaces according to a number of different published or proprietary memory card standards. Different types of memory cards may be used when the operating parameters of the memory are stored within it in a protected location, the mother card controller then reading these parameters and adapting its operation accordingly. A radio frequency antenna may be included on a surface of the card along with its electrical contacts, in order to provide a radio frequency identification function.

Universal non-volatile memory card used with various different standard cards containing a memory controller

Methods for a multiple die package for integrated circuits are disclosed. An insulator layer is provided and one or more vias are formed within it. The insulator may be provided without vias, and vias formed later. At least one integrated circuit is provided and electrically coupled to at least one lead of a first leadframe overlying one surface of the insulator. At least one second integrated circuit is provided and electrically coupled to a second leadframe overlying a second surface of the insulator. Electrical connections between the two leadframes and the first and second integrated circuits are made through the insulator at selected locations, by coupling at least one lead of the first and second leadframes one to another. The leads of the first and second leadframe may be physically coupled by a welding process within vias in the insulator. A method for a removable storage card is also described.

Methods for a multiple die integrated circuit package

A flash memory card structure with an external contact structure according to a published standard, such as the USB standard, also includes a second data transmission path, such as a wireless one. A removable cap fits over the card to cover the external contacts when they are not being used as a memory data path. One of two or more different caps may be selected to be placed on the card in order to control operation of the second data transmission path, such as to select the distance of wireless transmission from one of two or more pre-set distances. Power to operate the memory card through the second path, when not connected to a host, may also be provided through the external contacts by including a battery in the caps.

Portable memory devices with removable caps that effect operation of the devices when attached

A multiple die package and removable storage card is disclosed. An insulator layer is provided and one or more vias are formed within it. The insulator may be provided without vias, and vias formed later. At least one integrated circuit is provided and electrically coupled to at least one lead of a first leadframe overlying one surface of the insulator layer. At least one second integrated circuit is provided and electrically coupled to a second leadframe overlying a second surface of the insulator layer. Electrical connections between the two leadframes and the first and second integrated circuits are made through the insulator, at selected locations, by coupling at least one lead of the first and second leadframes one to another. The leads of the first and second leadframe may be electrically coupled via anisotropically conductive areas of the leadframes.

Multiple die integrated circuit package

Enclosed re-programmable non-volatile memory cards include at least two sets of electrical contacts to which the internal memory is connected. The two sets of contacts have different patterns, preferably in accordance with two different contact standards such as a memory card standard and that of the Universal Serial Bus (USB). One memory card standard that can be followed is that of the Secure Digital (SD) card. The cards can thus be used with different hosts that are compatible with one set of contacts but not the other. A cover that is hinged to the card to normally cover one set of contacts can be manually rotated out of the way when that set of contacts is being used.

Memory card with two standard sets of contacts and a hinged contact covering mechanism

Very small non-volatile memory cards are modified to include a connector to which a connector on a separate data input-output card electrically and mechanically mates when pushed together. The input-output card transfers data directly between an external device and the non-volatile memory, without having to go through the host to which the memory card is connected. The input-output card communicates with the external device through a wired or a wireless communication channel.

Cooperative interconnection and operation of a non-volatile memory card and an input-output card

Enclosed re-programmable non-volatile memory cards include at least two sets of electrical contacts to which the internal memory is connected. The two sets of contacts have different patterns, preferably in accordance with two different contact standards such as a memory card standard and that of the Universal Serial Bus (USB). One memory card standard that can be followed is that of the Secure Digital (SD) card. The cards can thus be used with different hosts that are compatible with one set of contacts but not the other. A cover that is hinged to the card to normally cover one set of contacts can be rotated out of the way by hand when that set of contacts is being used.

Memory card with two standard sets of contacts and a contact covering mechanism

A small, flat rectangularly shaped electronic circuit card, such as one containing non-volatile memory, has a row of contacts mounted on bottom surfaces of a row of recesses extending along a short edge and an adjacent angled corner. At least one of the recesses opens to the angled corner and the remaining recesses open to the short edge. Two surface contacts are included in at least one of the recesses, while the remaining recesses each contain a single contact.

Growing community of inventors

Sunnyvale, CA, United States of America

Robert F Wallace