Methode Electronics, Incorporated

Robert F Schlacks

Vincent B Brown

Contact designs for leadless chip carrier sockets of either the surface compression or the solder type. The contact for a compression type socket employs a dual cantilever configuration mounted on a base member which mechanically isolates one portion of the contact from another. Two cooperative contact designs are used for a solder type socket in which each type is alternately arranged with respect to the other in mounted relationship on a base member. The upper chip carrier contacting portions of the two contacts for a solder type socket are disposed side-by-side along each side wall, while the terminal ends are aligned inwardly perpendicular to the upper alignment.

Contacts for chip carrier socket

a cover assembly for a leadless chip carrier socket including a spring cover and locking bracket selectively positionable on a socket body in any one of four positions. The spring cover is pivotally mounted on the socket body and is movable between an open position and a closed position at which the cover engages the locking bracket. The cover is formed with four arm members which are spring loaded and which engage the top of a chip carrier at eight pressure points. The force exerted by the spring cover in a closed position applies a downward force against the chip package to effect positive electrical contact with a plurality of contacts mounted in the socket which are adapted to be interconnected with a printed circuit board or circuit pad.

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Mount Prospect, IL, United States of America

Robert F Schlacks