Trilogy Computer Development Partners, Ltd.

Robert F Quinn

James C Lee

Gene M Amdahl

Richard L Beck

Jerzy R Sochor

A semiconductor chip module for a semiconductor chip having an exposed front face with a two dimensional array of contacts is disclosed. A connector plate is located proximate the front face of the chip. The connector plate has a plurality of apertures which correspond to and are aligned with the contacts of the semiconductor chip. A plurality of transmission elements are located proximate the connector plate opposite from the semiconductor chip. A plurality of flexible conductors extend through the respective apertures of the connector plate. The flexible conductors are electrically coupled to the contacts of the chip and to the transmission elements.

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Cupertino, CA, United States of America

Robert F Quinn