Hughes Aircraft Company

Other

Thunder Creative Technologies, Inc.

Hughes Electronics Corporation

3b Technologies Ii, Inc.

Dorothy, LLC

Robert F McClanahan

Robert D Washburn

David M Lusher

Carlos H Gonzalez

Andrew A Shapiro

William J Council

Ramona G Pond

Hal D Smith

Jerry C Sze

Robert S Wedeen

Charles A Goodman

Earl H Martin

David A Head

James A Anderson, Deceased

Carol Haertling

Raymond L Brown

William B Hwang

George P Pelzman

Gerald P Chernicky

By Roger Anderson, Administrator

Robert D Washgurn

George Biner

A power delivery system utilizing an array of electric generators connected to an array of electric drive motors, which in turn are connected to loads of varying power demand, the generators configured to turn on and off to match the loads of varying power demands. The electric generators may be connected to an array of engines, each engine configured to run at peak efficiency. As load demands change, the engines turn on and off to meet the load demands. The engines and electrical generators may also connect to a battery to maintain the battery charge in response to demands on the battery by the electric drive motor array.

Efficient vehicle power systems

An improved gas-electric power delivery system is provided. The invention provides an array of internal combustion engine-powered electric generators and an array of electric drive motors wherein each electric drive motor connects to a common shaft. The common shaft of the electric drive motor array connects to a mechanical load of varying power demand. The electric drive motors draw power from a battery in response to demands on the motors by the varying power demands of the external load. The array of electric generators charges the battery and each such generator turns on and off, as needed, to maintain the battery charge in response to demands on the battery by the electric drive motor array. Each electric motor connected to a common shaft in the electric motor array also turns on and off, as needed, to meet the varying power demands of the external load.

The present system provides a method for varying the value of passive components in electronic circuits. Passive components can range from basic resistors, capacitors, and inductors to complex, structures such as transmission lines and resonant cavities. Value selection and variation can either be dynamically performed during circuit operation or as a one-time part of the manufacturing process as determined by the requirements of the specific application. A digital-to-analog converter (DAC) circuit is used to input value selection data digitally, and control value selection with value resolution dependent on the resolution of the DAC. An alternate embodiment is provided for high frequency operation.

Variable passive components with high resolution value selection and control

The present invention is a digital to analog converter circuit that provides significantly lower distortion than achieved by digital to analog converter circuits having comparable speed and resolution utilizing the present art. The present invention provides linear or higher order transitions between clock transition time points rather than step transitions used in the present art. Distortion reduction can exceed 30 dB in the embodiment with linear sample-to-sample transitions and greater in alternate embodiments with non-linear transitions. In other embodiments, the present invention can provide low distortion at resolutions from 16 to 24 bits or more at sample rates typical of high-speed 8-bit devices of the present art.

Low distortion digital to analog converter and digital signal synthesizer systems

The present invention provides termination for transmission line structures propagating common mode signals. Common mode signals typically represent noise in systems wherein information is transmitted as differential mode signals. The present invention terminates the common mode signals in a dynamically matched termination that prevents or significantly reduces reflection of said common signals without interference with differential mode transmission lines or their normal operation. Application is shown for an unshielded, twisted pair transmission line as commonly used in telephony-based systems for both voice and broadband data communication. The methods for application of the present invention to systems with large numbers of conductors are also shown.

Common mode transmission line termination

The present invention is an electronic circuit that significantly enhances timing margin in high-speed, digital memory modules. The circuit is implemented is applicable to all switching waveforms on both control and data signal lines that drive the memory bus. Implementation of the present invention also provides a significant reduction in power dissipation compared to memory modules of comparable size and speed utilizing the present art.

Enhanced timing margin memory interface

The invention is an electronic circuit designed for incorporation on computer memory modules such as DDR DIMMs. It couples control signals such as address bits, bank selects, enable and even clock signals between the module input connector and the memory devices. The circuit provides low propagation delay, fast rise and fall times with no overshoot or undershoot, and significantly improves timing control compared to memory modules of the present art. Capacitive loading on the motherboard is typically much less than that provided by a single memory device input and is independent of the number of memory devices per bank or the number of banks of memory devices on the memory module. For multiple memory modules connected to the memory bus, capacitive loading is essentially N times the equivalent loading for a single memory module.

Control signal interface circuit for computer memory modules

Electronic VHF/UHF power conversion circuitry is manufactured using the benefits of low temperature co-fired ceramic substrates to provide interconnection between the discrete components of the power conversion circuit, and integrate various non-semiconductor devices into the body of the low temperature co-fired ceramic structure, such as resistors, capacitors, inductors and transformers. Use of a low temperature co-fired ceramic structure as a substrate on and within which VHF/UHF power conversion circuitry is formed allows selection of various conductive and resistive inks to precisely form interconnection circuitry and selected non-semiconductor components which improves the stability and reduces the cost of VHF/UHF power conversion circuits.

Low temperature co-fired ceramic UHF/VHF power converters

Electronic power conversion circuitry, for frequencies not exceeding 30 MHz, is manufactured using the benefits of low temperature co-fired ceramic substrates to provide interconnection between the discrete components of the power conversion circuit, and integrate various non-semiconductor devices into the body of the low temperature co-fired ceramic structure, such as resistors, capacitors, inductors and transformers. Use of a low temperature co-fired ceramic structure as a substrate on and within which power conversion circuitry is formed allows selection of various conductive and resistive inks to precisely form interconnection circuitry and selected non-semiconductor components which improves the stability and reduces the cost of power conversion circuits.

Low temperature co-fired ceramic substrates for power converters

A ferromagnetic material (18,20) in ink or tape form is sinterable using a same firing profile as and has approximately the same thermal shrinkage characteristics as low-temperature-cofired-ceramic (LTCC) tape, and is chemically non-reactive therewith. The ferromagnetic material (18,20) is applied to the surfaces of LTCC tape sheets (12,14,16) to form desired elements such as cores for inductors (22) and transformers and magnetic shields. Ferromagnetic vertical interconnects (vias) (54) can be formed by punching holes (56) through tape sheets (46) and filling them with ferromagnetic ink. The tape sheets (12,14,16) and ferromagnetic elements (18,20) are laminated together and cofired to form an integral structure (10). Ferromagnetic and non-magnetic components (114) can be fabricated separately and inserted into cavities (104a,-106a,108a) in tape sheets (104,106,108) prior to cofiring. A multi-layer transformer (250) includes primary (254b,-256b,258b,254d,256d,258d) and secondary (254c,256c,258c) coils, each being formed of vertically aligned, arcuate conductors which are printed on separate tape sheets (254,256,258) and vertically interconnected at their ends to form continuous electrical paths therethrough.

Low-temperature-cofired-ceramic (LTCC) tape structures including cofired

Ferrimagnetic structures formed of ferrimagnetic vias in a unitized multilayer microcircuit structure that is formed of a plurality of co-fired insulating layers.

Ferrimagnetic vias within multi-layer 3-dimensional structures/substrates

Unitized multilayer circuit structures including basic substrate insulating layers and dielectric field control layers having dielectric constants different from the dielectric constant of the basic substrate insulating layers.

Field control and stability enhancement in multi-layer, 3-dimensional

A shrouded pin electrode structure including an elongated pin that extends into the volume of a gas containment structure of an RF excited gas discharge light source and is physically isolated from the discharge gas contained in the volume of the gas containment structure by a shroud structure made for example of a gas impermeable dielectric coating or closed end tube.

Growing community of inventors

Valencia, CA, United States of America

Robert F McClanahan