Rensselaer Polytechnic Institute

Soliduv, Inc.

Boston University

Robert F Karlicek

James Jian-qiang Lu

Ying Li

Bassem Fahs

Anton Tkachenko

Charles Sanford Goodwin

Michael Shur

Brian C Benicewicz

Richard W Siegel

Lei Wang

Mona Mostafa Hella

Linda S Schadler

Linda S Schadler Feist

Richard J Radke

Peng Tao

Chaitanya Ullal

Charles S S Goodwin

Pankil M Butala

Li Jia

Octavio Luis Perez

Mohammed Alnaggar

Arunas Tuzikas

A disinfection system includes a first UVC radiation source and a second opposing UVC radiation source. The first and second UVC radiation sources are positioned such that a gap exists therebetween. The first UVC radiation source is configured to emit UVC radiation across the gap toward the second UVC radiation source and the second UVC radiation source is configured to emit UVC radiation across the gap toward the first UVC radiation source. A vertically-oriented conveyor system is partially positioned in the gap. The vertically-oriented conveyor system includes a plurality of upper sprockets connected by an upper track, a plurality of lower sprockets connected by a lower track, at least one vertical band connected to the upper track and the lower track, and a motor configured to simultaneously drive the upper track and the lower track such that the at least one vertical band is translated through the gap between the first and second UVC radiation sources. At least one medical garb is mounted to the at least one vertical band such that when the at least one vertical band is translated through the gap an outer surface of the at least one medical garb is exposed to UVC radiation emitted from the first UVC radiation source and an inner surface of the at least one medical garb is exposed to UVC radiation emitted from the second UVC radiation source.

UVC irradiation disinfection systems and methods

A cross-connect switch architecture is described. A cross-connect switch device includes a cross-point switch array, a plurality of photo detectors and a plurality of amplifiers. The cross-point switch array includes a plurality of switches. Each switch is coupled between a respective photo detector and a respective amplifier and is configured to couple the respective photo detector to the respective amplifier when the switch is selected.

Cross-connect switch architecture

Systems and methods for lighting an environment are disclosed. A lighting system includes at least one light source and a control system in communication with the at least one light source. The light source is configured to emit light having a plurality of emission characteristics. The control system is configured to randomly vary at least one of the emission characteristics of the light emitted by the light source. A method for lighting an environment includes emitting light from a light source, and randomly varying at least one of the emission characteristics of the emitted light.

Systems and methods for lighting an environment

Methods and devices including a light display transceiver device are disclosed. Disclosed methods and devices include a light source array including at least one pixel unit, the at least one pixel unit including one of a single pixel, a plurality of groups of cooperating single pixels, a combination of singles pixels and groups of cooperating single pixels, and a single group of cooperating single pixels. Control wires are joined with each of the at least one pixel units. A controller is joined with the control wires for controlling each of the at least one pixel unit. The light source array is configured to operate in at least one of three modes, a full-space-division-duplex (FSDD) mode, a half-space-division-duplex (HSDD) mode, and a time-division-duplex (TDD) mode. The controller causes the light source array to operate in one of the three modes.

Methods and devices for transceiving light via a display device

A mechanically-stable and thermally-conductive interface device between a semiconductor die and a package for the die, and related method of fabrication, comprising: a semiconductor die; a package for the die; a surface area-enhancing pattern on the package and/or the die; and die attach materials between the die and the package, the die attach materials attaching the die to the package through an interface provided by the die attach materials; wherein: an effective bonding area between the die attach materials and the package and/or the die is greater with the pattern than without the pattern; and the increase of the effective bonding area simultaneously increases the surface area for thermal transport between the package and/or the die, and the die attach materials; and increases the surface area for stably attaching the at least one of the package and the die to the die attach materials.

Strain-tolerant die attach with improved thermal conductivity, and method of fabrication

The present disclosure relates to a matrix-free polymer nanocomposite. The matrix-free polymer nanocomposite includes a plurality of polymer brush grafted nanoparticles, which form the nanocomposite in the absence of a polymeric matrix. The polymer brush grafted to the nanoparticles comprises a multimodal brush configuration having at least two different populations of polymer ligands of different lengths. The present disclosure also relates to an optic or optoelectronic component comprising a matrix-free polymer nanocomposite as described herein. The present disclosure further relates to a method of making a matrix-free polymer nanocomposite.

Matrix-free polymer nanocomposites and related products and methods thereof

Provided is a phosphor-functionalized nanoparticle that includes an inorganic nanoparticle core; surface polymer brushes that include a plurality of long-chain polymers bonded to the surface of the inorganic nanoparticle core, said long-chain polymers each having molecular weight greater than 500, and a plurality of short-chain polymers bonded to the surface of the inorganic nanoparticle core, said short-chain polymers each having molecular weight less than 0.5 times the average molecular weight of the long-chain polymers; and one or more organic phosphors bonded to at least one of the inorganic nanoparticle core and one or more of the plurality of short-chain polymers. Graft density of the short-chain polymers on the surface of the inorganic nanoparticle core (&#x3c3;) is greater than graft density of the long-chain polymers on the surface of the inorganic nanoparticle core (&#x3c3;). Also provided are polymer matrices, LED's, optical systems, lighting devices, and fixtures that include the inventive nanoparticle.

Organic phosphor-functionalized nanoparticles and compositions comprising the same

Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.

Light emitting diodes and a method of packaging the same

Disclosed herein is an illumination system including an array of LED light sources for emitting light encoded with a modulation pattern, an array of sensors and a space characterization unit. The array of sensors receives emitted light scattered by an object. Each sensor determines a distance between the corresponding light source and the object using the modulation pattern. The space characterization unit uses the distance from each sensor to generate an elevation map indicating a presence of the object.

Growing community of inventors

Mechanicville, NY, United States of America

Robert F Karlicek