International Business Machines Corporation

Robert F Florence, Jr

Vincent P Mulligan

Charles R Tompkins, Jr

Emanuele F Lopergolo

Budy D Notohardjono

Prabjit Singh

Joshua Monroe Cobb

Uldis Artis Ziemins

Steven C McIntosh

Howard Victor Mahaney, Jr

Michael J Domitrovits

Daniel Paul Beaman

Franz X Topolovec

Lawrence G Cook

Gordon E Johnson

Gary M Gallagher

Robert W Sargent

Frederic William Wright, Iv

Tak O Leung

Wing-Fung Yuen

An apparatus includes a large server storage frame including a base, a ceiling and supports that are supportive of the ceiling above the base and separable from one another by a variable distance, first and second brackets disposable at variable vertical positions along first and second ones of the supports, respectively, and a turnbuckle assembly including an extendible member and first and second connectors connected to first and second ends of the extendible member, respectively. The first and second connectors are rotatably connectable to the first and second brackets, respectively, and the extendible member is extendible such that the first and second connectors reach the first and second brackets with the first and second brackets respectively disposed at the variable vertical positions.

Ruggedizing large server storage frame

An electrical interconnect is provided for use within, for example, a land grid array (LGA) interposer such as a module-to-board connector. The electrical interconnect includes an electrically-conductive, compressible conductor which has a first conductor end portion and a second conductor end portion. The first and second conductor end portions physically contact in slidable relation each other with compression of the compressible conductor to facilitate inhibiting rotation of the compressible conductor. In one embodiment, the first end portion includes at least one first leg and the second end portion includes at least two second legs, and the at least one first leg and at least two second legs are interdigitated. Further, in one embodiment, the first end portion and the second end portion are each in slidable contact with an inner-facing surface of the compressible conductor.

Land grid array interposer with compressible conductors

A method of using a coil contact as an electrical interconnect includes inserting at least one coil contact into a dielectric plate or housing. The at least one coil contact includes a beryllium copper coil plated with gold and having a tapered shape such that each end has a diameter smaller than the diameter of a middle section. The housing comprises an upper half comprising a surface that slopes outwardly from a center of the housing towards a top opening, and a lower half comprising a surface that slopes outwardly from the center of the housing to a bottom opening. The sloping surfaces of the upper half and the lower half form a concave shape that captivates the middle section of the coil contact. Each end of the at least one coil contact extends to account for variations in surfaces of the processor and the circuit board.

Method of using coil contact as electrical interconnect

A system, apparatus and method for controlling temperature of an integrated circuit in a chip tester is disclosed. Embodiments include supplying a chilled fluid to a cold plate at a first flowrate, where the first flowrate is associated with a first valve setting based on at least a desired temperature setpoint and an applied power. Embodiments may determine a change in applied power and modify the chilled fluid flowrate in response to a change in testing conditions to a second flowrate associated with a second valve setting associated with at least the desired temperature setpoint and the changed testing conditions. This feed forward loop may be supplemented by a feedback loop that includes modifying the energy supplied to a cold plate heater in response to a comparison of a current temperature and the temperature setpoint. The valve may be a proportional control valve or the like.

System, apparatus and method for controlling temperature of an integrated circuit under test

A micro compliant, test probe interconnect apparatus for an integrated circuit device is disclosed. In an exemplary embodiment, the apparatus includes an elongated housing and a probe pin extending from a first end of the housing. A biasing mechanism holds the probe pin in a normally extended position, wherein the biasing mechanism is formed from a portion of the elongated housing. In a preferred embodiment, the biasing mechanism is a flexible tab, formed from a generally rectangular section of the elongated housing and bent inwardly therein to form a cantilever.

Micro compliant interconnect apparatus for integrated circuit devices

A probe assembly consisting of a servo mechanism or actuator providing multi-direction motion; a probe mounting attached to the actuator; and pin probes attached to the probe mounting making an electrical connection to pins of a device or package under test. The pin probe includes a shaft terminating in an end section having a conical shaped recessed area. The conical feature contained in the probe allows the probe to contact a pin or array of pins that are less then ideally located, but within their geometrical tolerance. The probe assembly thus constructed, provides reliable test measurements. It also increases test throughout by minimizing test setup time when the DUT has misaligned or bent pins. The setup can be used on a manual probe station, or in a mass production bed of nails type tester. The assembly can also be in the form of a gang probe wherein pin probes are arranged in a bed of nails arrangement to make contact with all the pins of the DUT simultaneously. The mounting is connected via a single wire, a plurality of wires, or a wiring harness to a measurement system. The pin probe is particularly well suited for probing ends of pins of multiple diameters and different pin tip geometries during various testing and/or manufacturing operations.

Apparatus for probing ends of pins

A universal mapping tool and method for mapping workpieces, such as semiconductor devices, is disclosed and described. The tool comprises a fixed and a movable gripping means adapted to mount a wide range of workpieces, means for optically locating the physical center of the workpiece fiducials mounted on the gripping means, and means for interpreting and storing the data obtained in the mapping operation.

Universal mapping tool

Method and apparatus for illuminating a transparent material for identifying individual features in the material having similar refractive indices, without using a phase-contrast microscope, by illuminating the material by light directed at an angle to a reflective surface which directs the light through the material to a viewing device such as a microscope.

Illumination/viewing system for features in transparent materials

A reusable isolation structure features an easily cleanable shell having viewing windows formed therein, each protected by a framing ridge or a recess integrally formed in the shell provides protection of contents from contamination, impact, vibration and tampering. Framing ridges or recesses also facilitate stacking of shells. The closure member opening of the shell includes a groove formed around the periphery thereof and is preferably not more than slightly smaller than an interior cross-section of the shell. A door of the isolation structure is dimensioned to fit within the closure member opening and has a resilient seal clamped to the periphery of a backbone by front and rear plates. The front and rear plates cooperate with grooves formed in the backbone to define a preferred form of manifold for coupling pressure or a vacuum to the interior of the resilient seal whereby the resilient seal may be collapsed to allow removal of the door or allowed to expand or pressurized to provide secure closure. Filters and vapor and moisture drains are carried by the door structure. The door also provides a smooth interior surface of the isolation structure of closely controlled and accurately repeatable dimensions. A vacuum plate for handling the door simultaneously provides for evacuation and controlled collapse of the resilient seal as well as containment of contamination of the exterior thereof.

Growing community of inventors

Poughkeepsie, NY, United States of America

Robert F Florence, Jr