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Robert F Ehrsam

Robert Z Reath

John L Raymond

The present invention relates to a method for plating nickel onto metal substrates. The method broadly comprises the steps of passing the metal substrate to be plated through a dilute organic acid bath solution to remove contaminants and other deleterious materials, agitating the bath solution as the metal substrate passes therethrough, and thereafter electrolessly plating nickel on the surfaces of the metal substrate. The method of the present invention may be used to nickel plate substrates formed from steel, copper and aluminum.

Method for electroless nickel plating of metal substrates

A method for preparing aluminum and aluminum alloys includes the step of simultaneously honing the surface of the aluminum or aluminum alloy in a zincating solution. The honing removes the aluminum oxide layer from the surface of the aluminum or aluminum alloy work piece while the zincating solution deposits a layer of zinc on its surface. The zincate-honing may be followed by electroplating.

Method for preparing aluminum for subsequent electroplating

Method for preparing aluminum, especially large aluminum pieces or articles having a surface layer of aluminum oxide for subsequent metal plating wherein the aluminum or aluminum alloy substrate is immersed in a bath containing metal salts and acid such that the acid content relative to the metal salt is sufficient to remove the surface aluminum oxide layer without substantial attack on the underlying aluminum while enabling the permanent deposit thereon of a continuous, smooth, adherent metal or metal alloy coating directly onto the aluminum, thereby replacing the aluminum oxide layer. Subsequent, essentially blister-free electroless or electrolytic plating of nickel or a nickel alloy, copper or a copper alloy onto the metal or metal alloy coated aluminum are made possible thereby.

Method for preparing aluminum for plating

A layer of metal having a plurality of discrete particles of a finely divided solid non-metallic material uniformly dispersed throughout the metal layer is electrodeposited onto the surface of a substrate metal by first applying a tertiary amine oxide surfactant to the surface of the particles of finely divided non-metallic solid material, or by first introducing the said tertiary amine oxide surfactant into the electrolyte solution. The said particles and the said metal are then co-deposited onto the said substrate from an aqueous electrolyte solution containing metaliferous cations of the said metal in solution and the said particles in suspension therein. Specifically, the tertiary amine oxide surfactant employed is selected from the group having the chemical structure: ##STR1## Where R.sub.1 is an alkyl, alkene or alkyne radical having from 6 to 22 carbon atoms, R.sub.2 is an alkyl or hydroxyalkyl radical having from 1 to 4 carbon atoms, and R.sub.3 is alkyl or hydroxyalkyl radical having from 1 to 4 carbon atoms.

Electroplating method

A layer of metal having a plurality of discrete particles of a finely divided solid non-metallic material uniformly dispersed throughout the metal layer is electrodeposited onto the surface of a substrate metal by first applying an amphoteric surfactant having a substituted imidozolinium structure to the surface of the particles of finely divided non-metallic solid material, or by first introducing the said amphoteric surfactant into the electrolyte solution. The said particles and the said metal are then co-deposited onto the substrate metal from an aqueous acidic electrolyte solution containing metalliferous cations of the said metal in solution and the said particles in suspension therein. Specifically, the amphoteric surfactant employed is selected from the group of substituted imidozolinium derivatives having the chemical structure: ##STR1## Where R is a fatty acid radical having from 6 to 18 carbon atoms. R.sup.1 is H, Na or CH.sub.2 COOM

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Monroe, CT, United States of America

Robert F Ehrsam