Intel Corporation

Robert F Cheney

Suriyakala Ramalingam

Ashish Dhall

Sergio Antonio Chan Arguedas

Elah Bozorg-Grayeli

Taylor W Gaines

Frederick W Atadana

Disclosed herein are integrated circuit (IC) package lids with polymer features, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A foot or rib of the lid may include a polymer material.

Integrated circuit package lids with polymer features

A method for forming an electrical device includes attaching a semiconductor die on a carrier. The method further includes dispensing a fillet material at at least one edge of the semiconductor die arranged on the carrier. The method further includes dispensing an underfill material into a gap between the semiconductor die and the carrier after dispensing the fillet material.

Method for forming an electrical device and electrical devices

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Chandler, AZ, United States of America

Robert F Cheney