Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Robert F Antrim

David B James

Mary Jo Kulp

A chemical mechanical polishing pad is suitable for polishing at least one of semiconductor, optical and magnetic substrates. The polishing pad has a high modulus component forming a continuous polymeric matrix and an impact modifier within the continuous polymeric matrix. The high modulus component has a modulus of at least 100 MPa. The impact modifier includes a low modulus component having a modulus of at least one order of magnitude less than the high modulus component that increases the impact resistance of the polishing pad.

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Chalfont, PA, United States of America

Robert F Antrim