The Boeing Company

Robert Edward Silhavy

Kyle A Woolrich

Jonathan M Allison

Thomas Rust, Iii

Boon Wong

Jennifer Shinno

A system includes a carrier defining a plurality of channels. The system includes an integrated circuit (IC) die having a first side and having a second side opposite the first side. The second side of the IC die is coupled to the carrier. The system includes a die attach layer between the carrier and the second side of the IC die. The die attach layer defines one or more openings that enable a fluid to flow from the carrier to the second side of the IC die.

Systems and methods for thermal control of integrated circuits

A reliable, long-lived soldered electrical connection is made to a ceramic substrate having a thick-film metallization thereon, over which is deposited a joint-structure-stabilizing thin-film metallization. The thin-film metallization is a multilayered structure having an adhesion layer overlying and in contact with the thick-film metallization, a readily wettable base-metal layer overlying and in contact with the adhesion layer, and an oxidation-prevention layer overlying and in contact with the base-metal layer. An electrical conductor is soldered to the thin-film metallization of the ceramic substrate. The electrical conductor may be a bonding pad of a flip chip having a solder bump thereon.

Method of forming a soldered electrical connection

A chip bonding location of a microelectronic chip is joined to a substrate bonding location of a substrate using a metallic solder in the absence of a flux. Surface contamination and oxide are first removed from the chip bonding location and from the substrate bonding location. The joining is accomplished by positioning the microelectronic chip and the substrate in a facing contact with the chip bonding location and the substrate bonding location in registry in a contact region. A heating element is disposed adjacent to and below the chip bonding location and the substrate bonding location to form an assembly. There is no flux present in the assembly in the contact region. The assembly is placed into an oven having a non-oxidizing environment. The chip bonding location and the substrate bonding location are joined by heating the assembly to a preheating temperature of less than a melting temperature of the solder, and thereafter reflowing the solder by locally heating the contact region to a reflow temperature of greater than the melting temperature of the solder using the heating element, permitting the solder in the contact region to melt for a reflow period of time above the melting temperature of the solder, and then cooling the contact region to a temperature below the melting temperature of the solder. The solder is melted for a short period of time, preferably about 30-100 seconds.

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Redondo Beach, CA, United States of America

Robert Edward Silhavy