Visteon Global Technolgoies, Inc.

Ford Motor Company Limited

Visteon Global Tech., Inc

Robert Edward Belke

Andrew Zachary Glovatsky

Michael George Todd

Lakhi Nandlal Goenka

Thomas Bernd Krautheim

Jay DeAvis Baker

Delin Li

Vivek Amir Jairazbhoy

Myron Lemecha

Achyuta Achari

Robert Joseph Gordon

Mohan R Paruchuri

Brenda Joyce Nation

John Trublowski

Joseph M Giachino

Daniel Phillip Dailey

Richard Keith McMillan

Marc Alan Straub

Charles Frederick Schweitzer

Edward Paul McLeskey

William F Quitty, Jr

Cuong Van Pham

Theodore Charles Wingrove

Peter Joseph Sinkunas

Zhong-You Joe Shi

Paul Zoratti

James Joseph Kornacki

Prathap Amerwai Reddy

Michael Eichbrecht

Jun Ming Hu

Kyle Entsminger

Ram S Raghava

James Frederick Krier

Bethany J Walles

Stephen Fuks

Charles Still

Andrew DeScisciolo

Bertrand Robert Mohr

Michael Allen Howey

Alice Dawn Zitzmann

Hong Zhou

Diane Marie Jett

Rexanne M Coyner

Tianmin Zheng

Debra A Finkenbiner-Pepper

Anthony Nicolo Satullo

Michael S Schulke

Adam W Schubring

Raymond Eric Foster

Timothy Arthur Tiernan

Samuel G Rahaim

A lens assembly, and a method for providing a lens assembly is disclosed herein. The lens assembly includes a first frame piece with a first edge on the direction in which a viewer of the electronic display would face, the first edge forming a first angle with a second edge; a second frame piece with a third edge on the direction in which a viewer of the electronic display would face, the third edge forming a second angle with a fourth edge; a lens with a first lens edge facing the viewer, a second lens edge and third lens edge connected to the first lens edge and forming a lens angle; a first adhesive layer placed between the second edge and the second lens edge to attach the first frame piece to the lens; and a second adhesive layer placed between the fourth edge and the third lens edge to attach the second frame piece to the lens.

Glass lens assembly with an elastic adhesive

A method, system, and display assembly is disclosed herein. The aspects disclosed herein include the providing of at least two lenses covering a respective display, with the two lenses bonded together with an optical clear adhesive. The optical clear adhesive may be shaped in a predetermined manner, such as a curve. Also included herein are systems for driving electronic signals to the respective displays. The signals may undergo processing in order to provide a seamless look via the display assembly.

Display assembly with multiple flat lenses with optical adhesives to generate a non-linear surface

A multi-layer electronic circuit board designhaving selectively formed apertures or cavitieswhich have improved solder-wetting characteristics.

Electrical circuit board and a method for making the same

The present invention provides an assembly for protecting automotive electronics. The assembly includes a circuit board, a cover, and a metal housing. The metal housing is disposed over and around the circuit board. The cover and metal housing are crimped together to create a seal that protects the circuit board inside the metal housing and attaches the cover to the metal housing.

Electronic assembly packaging

A multi-layer circuit board having apertures that are selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by a polymeric material. Each of the apertures selectively receives an electrically conductive material.

Circuit board with air-bridge

A new system and method for repairing flexible circuits is disclosed. The flexible circuits conduct electrical signals to and from electronic devices. The system generally includes a flexible circuit substrate, at least one electrical conductor, and a repair patch. The flexible circuit substrate has a cut zone and a repair zone. The at least one electrical conductor is supported by the flexible circuit substrate. The electrical conductors are configured to carry electrical signals. The repair patch is used to electrically interconnect at least two repair zones.

System and method for repairing flex circuits

A sensor cover is disclosed for camouflaging a high frequency sensor, including for example, a radar sensor. The sensor cover includes a substrate having a non-planar surface with non-signal transmitting regions and signal transmitting regions. A metal layer is disposed on each of the non-signal transmitting regions. Further, each of the non-signal transmitting regions is separated by one of the signal transmitting regions. The method of constructing such a sensor cover is also disclosed.

Sensor cover and method of construction thereof

A method for making multi-layer electronic circuit boards having &ldquo;blind&rdquo; type apertures which may be selectively and electrically grounded and further having selectively formed air bridges and/or crossover circuits

Circuit board and a method for making the same

A method for making a multi-layer circuit board having apertures which may be selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by material Each of the apertures selectively receives electrically conductive material

Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material

A braking unit is provided. In one embodiment, the braking unit comprises a base member, a guide member, a flexible rod, an actuator adapted to induce deformation of the rod, and a brake pad. One end of the flexible rod is fixedly attached to the base member while another end is slideably disposed within a passageway defined by the guide member. The brake pad is positioned adjacent the flexible rod such that deformation of the rod causes lateral movement of the brake pad. The braking unit can be incorporated into disc and drum-type braking assemblies and systems.

Braking assembly and system

A method for making multi-layer electronic circuit boards having metallized apertures which may be selectively and electrically grounded or isolated from an electrical ground plane.

Method for making an electrical circuit board

A multi-layer electronic circuit board design having selectively formed apertures or cavities which have improved solder-wetting characteristics by causing a first insulating layer to separate from a portion of a first conductive layer of the multi-layer electronic circuit board which allows for communication by and between some or all of the various component containing surfaces, and portions of the formed multi-layer electrical circuit board , which selectively allows components contained within and/or upon these portions and surfaces to be interconnected.

A method for making multi-layer electronic circuit boards having aperture which may be selectively connected to an electrical ground potential.

Method for making circuit board

A vent assembly that can be concealed when in a closed configuration is provided in one embodiment, the vent assembly comprises a base member and a guide member secured to a mounting surface of a duct or other passageway. A flexible rod is fixedly attached to the base member and slideably disposed within a channel defined by the guide member. A panel is disposed on or around the flexible rod and between the base and guide members. An actuator is able to deform the rod such that the panel moves away from the terminal opening of the duct, thereby opening the vent. A fluid distribution system incorporating vent assemblies in accordance with the present invention is also provided.

Concealed air vents

Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.

Multi-layer printed circuit board and method of making same

Growing community of inventors

West Bloomfield, MI, United States of America

Robert Edward Belke