Intevac, Inc.

Daidosanso K. K.

Robert E Weiss

Kevin P Fairbairn

Terry Bluck

Kenneth A Costello

Lewis M Fraas

Verle W Aebi

John L Hughes

Carl T Petersen, Iii

Robert J Kolenkow

Gary A Davis

Norman H Pond

Paul M McLeod

Craig Marion

There is described a disk processing and manufacturing equipment in which the processing chambers are stacked on top of each other and in which the disks move through the system on disk carriers which are adjustable to take disks of varying sizes. The disks enter the system through a load zone and are then installed into disk carriers. They move in the carriers sequentially through processing chambers at one level and then move to the other level in a lift or elevator. At this other level, the disks again move sequentially through the system on that level and then exit at an unload zone.

Disk coating system

A transferred-electron photocathode or other opto-electronic device having one light-receiving side and one electronic side, in which multiple photocathodes are processed concurrently on a wafer for front and back side contacts and anti-reflection layers. After the wafer-level processing, the individual cells are diced, and each is placed in a rectangular recess formed in a window body with the light-receptive part of the photocathode facing the window. The integration is aided by several novel processes including coining a chip recess into a window, selective etching of titanium over chromium, and using a single metal sheet member for electrically contacting the photocathode, forming part of the vacuum envelope, and providing an exterior electrical tab.

Integrated photocathode

A magnetron sputtering source for depositing a material onto a substrate includes a target from which the material is sputtered, a magnet assembly disposed in proximity to the target for confining a plasma at the surface of the target and a drive assembly for scanning the magnet assembly relative to the target. The sputtering source may further include an anode for maintaining substantially constant plasma characteristics as the magnet assembly is scanned relative to the target. The anode may be implemented as variable voltage stationary electrodes positioned at or near the opposite ends of the scan path followed by the magnet assembly, spaced-apart anode wires positioned between the target and the substrate or a movable anode that is scanned with the magnet assembly. The magnet elements of the magnet assembly may have different spacings from the surface of the target to enhance depositional thickness uniformity. The target may be fabricated in sections, each having a target element bonded to a backing element for reduced sensitivity to thermal variations. The target may be rotated from a first fixed position to a second fixed position relative to the magnet assembly at least once during its operating life for increased target utilization.

Methods and apparatus for linear scan magnetron sputtering

A microchannel plate (MCP) apparatus and method in which the output metalization layer or electrode is covered with a thin coating to reduce the number of spurious electron emissions striking the phosphor screen or other collection anode in an image intensifier. Microchannel plates manufactured in this way have the beneficial effect of improving yield in the manufacture of night vision devices.

Microchannel plate with coated output electrode to reduce spurious

A thermal cracking apparatus for cracking organic or inorganic gases is described. More particularly, the thermal cracker cracks inorganic gases such as arsine and phosphine for use in the growth of III-V compound semiconductor layers. The design of the apparatus minimizes the uptake of contaminants into the cracked gas stream.

Gaseous organic/inorganic thermal cracker for vacuum chemical epitaxy

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San Francisco, CA, United States of America

Robert E Weiss