Johns Hopkins University

Robert E Wallis

Sheng Cheng

Seppo J Lehtonen

John Edward Penn

Jacob P Treadway

Perry M Malouf

Christopher B Haskins

Avinash Sharma

Daniel E Matlin

Matthew P Angert

A multi-chip module is provided including a multiplier configured to multiply a frequency of an input signal into a predetermined Ka-band frequency center channel, a modulator configured to modulate the center channel, and an amplifier configured to amplify a modulated signal for output.

Ka band multi-chip modulator

A high-efficiency solid state power amplifier (SSPA) for specific use in a spacecraft is provided. The SSPA has a mass of less than 850 g and includes two different X-band power amplifier sections, i.e., a lumped power amplifier with a single 11-W output and a distributed power amplifier with eight 2.75-W outputs. These two amplifier sections provide output power that is scalable from 11 to 15 watts without major design changes. Five different hybrid microcircuits, including high-efficiency Heterostructure Field Effect Transistor (HFET) amplifiers and Monolithic Microwave Integrated Circuit (MMIC) phase shifters have been developed for use within the SSPA. A highly efficient packaging approach enables the integration of a large number of hybrid circuits into the SSPA.

High-efficiency solid state power amplifier

Growing community of inventors

Ellicott City, MD, United States of America

Robert E Wallis