Analog Devices,inc.

Robert E Sulouff, Jr

Timothy J Brosnihan

John M Sledziewski

Craig E Core

A method of forming a MEMS device provides a wafer having a base with a conductive portion. The wafer also has an intermediate conductive layer. After it provides the wafer, the method adds a diaphragm layer to the wafer. The method removes at least a portion of the intermediate conductive layer to form a cavity between the diaphragm layer and the base. At least a portion of the diaphragm layer is movable relative to the base. After it forms the cavity, the method seals the cavity.

Method of forming a device by removing a conductive layer of a wafer

A flow sensor has an inlet chamber with a first pressure sensor and an inlet port for receiving fluid, and an outlet chamber with a second pressure sensor and an outlet port. The flow sensor also has an anemometer in fluid communication with at least one of the two chambers.

Flow sensor chip

A method of forming a MEMS device provides a wafer having a base, a first conductive layer, a second conductive layer, and an intermediate conductive layer. After it provides the wafer, the method removes at least a portion of the intermediate conductive layer to form a cavity between the first and second conductive layers. At least a portion of the first conductive layer is movable relative to the base to form a diaphragm, while the second conductive layer is substantially immovable relative to the base. After it forms the cavity, the method seals the cavity.

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Chesapeake, VA, United States of America

Robert E Sulouff, Jr