International Business Machines Corporation

Robert E Schwall

Ho-Ming Tong

Lawrence Shungwei Mok

Kurt R Grebe

In integrated circuit packaging, chips are bonded to one side of an intermediate wafer that is resiliently mounted at the periphery with the entire other side of the intermediate wafer being maintained in conformal thermal transfer to external heat dissipation free of any solid connection.

Method of resiliently mounting an integrated circuit chip to enable

Electronic device and heat sink assembly

The superior thermal conductivity of immersion cooling combined with the service convenience of conduction cooling is provided through the use of unitary thermal transfer replaceable units positioned beneath a refrigeration source. Each unit contains electronic devices in a thermal transfer fluid. The unit construction permits replaceability in service without exposing a central fluid reservoir or opening a refrigerator.

Apparatus for temperature control of electronic devices

A superconductive magnet has a main coil for creating a primary magnetic field and a plurality of shim coils for correcting aberrations in different gradients in the primary field. The shim coils are also connected in shunt with shim quench heaters and with superconductors which together with the shim coils form a plurality of persistent loops. A plurality of protective heaters are electrically connected to the main coil and are thermally connected to the superconductors. When quenching begins in the main coil, current is diverted through the protective heaters causing them to heat. This increases the temperature of the superconductors in the persistent loops causing them to switch from the superconductive to the resistive state and divert current into the shim quench heaters. These heaters in turn heat the shim coils and drive the shim coils resistive to safety dissipate any energy therein.

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Ridgefield, CT, United States of America

Robert E Schwall