Lucent Technologies Inc.

Robert E Radke

Shiaw-Jong Steve Chen

Roger J Hooey

An integrated cooling device for use in cooling an electronic component or an integrated circuit and a method of manufacturing the same. In one embodiment, the device includes: (1) a plate couplable to and supportable by the electronic component, the plate having at least one channel therein, (2) a closed-circuit circulation pipe having a heat-receiving portion disposed in the at least one channel to place the heat-receiving portion in thermal communication with the plate, the circulation pipe further having a heat-removing portion distal from the heat receiving portion, (3) a coolant located within the circulation pipe and (4) a pump coupled to the circulation pipe, supported by the plate and operable to cause the coolant to circulate through the circulation pipe.

Integrated active cooling device for board mounted electric components

For use with a plate having a via located therethrough an electrical connector configured to transfer an electrical signal from one major surface of a plate to the other major surface, a method of manufacturing the electrical connector and a board mounted power supply utilizing the same. In one embodiment, the electrical connector comprises a dielectric layer coating a peripheral wall of the via and extending therefrom to coat portions of the opposing major surfaces of the plate adjacent the via. The electrical connector further comprises a conductive contact layer that covers a portion of the dielectric layer and extends to portions of the opposing major surfaces to form opposing contacts thereon.

Through via plate electrical connector and method of manufacture thereof

An insulated metal substrate printed wiring board includes a thermally conductive base plate. A first dielectric layer is disposed on the base plate. An electrically conductive trace is disposed on the top surface of the first dielectric layer. A second dielectric layer is disposed on the top surface of the first electrically conductive trace. A second electrically conductive trace is disposed on the top surface of the second dielectric layer. The second dielectric layer and the second electrically conductive trace include an aperture to expose the electrically conductive trace disposed on the top surface of the first dielectric layer. High power dissipating components are mounted through the aperture in the second electrically conductive layer and second dielectric layer for electrical connection to the electrically conductive trace disposed on the top surface of the first dielectric layer. Similar construction can be extended to more than two layers of electrically conductive traces and the aperture is through all the layers except the first dielectric layer and the first electrically conductive layer.

Growing community of inventors

Garland, TX, United States of America

Robert E Radke