Honeywell International Inc.

Honeywell G.m.b.h.

Quantinuum LLC

Other

Robert E Higashi

Barrett E Cole

Robert G Johnson

Jeffrey Alan Ridley

Ulrich Bonne

Karen Marie Newstrom-Peitso

Scott Edward Beck

Fouad Nusseibeh

Roland Andrew Wood

Ian Bentley

R Andrew Wood

Son Thai Lu

Philip J Bohrer

Yong-Fa Wang

Ernest Allen Satren

Subash Krishnankutty

James O Holmen

Steven D James

Elenita Malasmas Chanhvongsak

Bill Hoover

James Allen Cox

Aravind Padmanabhan

Adam Dewey McBrady

Keith Francis Edwin Pratt

Peter Tobias

Christopher J Zins

Arunkumar Subramanian

Wei Yang

Michael L Rhodes

Daniel W Youngner

Cleopatra Cabuz

Richard A Wade

Lamar Floyd Ricks

Teresa M Marta

Yue Liu

Yuandong Gu

Andy M Peczalski

James I Bartels

Thomas R Keyser

Jeff A Ridley

Tom M Rezachek

Michael James Haji-Sheikh

Thomas George Stratton

Philip C Foster

Gordon Alan Shaw

Terry Marta

Cristian Diaconu

Vijayakumar S

Khanh Q Nguyen

Cristian Vasile Diaconu

Norm Planer

Gregg Swanson

John P Sumner

Timothy L Johnson

R Wood

Philip Clayton Foster

Karen M Nwestrom-Peitso

Khah Q Nguyen

Fouad A Nusseibeh

Barrett L Cole

Example systems, apparatuses, and methods are disclosed sensing a flow of fluid using a thermopile-based flow sensing device. An example apparatus includes a flow sensing device comprising a heating structure having a centerline. The flow sensing device may further comprise a thermopile. At least a portion of the thermopile may be disposed over the heating structure. The thermopile may comprise a first thermocouple having a first thermocouple junction disposed upstream of the centerline of the heating structure. The thermopile may further comprise a second thermocouple having a second thermocouple junction disposed downstream of the centerline of the heating structure.

Thermopile-based flow sensing device

One or more embodiments are directed to establishing electrical connections through silicon wafers with low resistance and high density, while at the same time maintaining processability for further fabrication. Such connections through silicon wafers enable low resistance connections from the top side of a silicon wafer to the bottom side of the silicon wafer.

Through silicon via fabrication

Apparatus and associated methods relate to a compact gas sensor (CGS) including a housing with a central stepped cavity with one or more first lead contact(s) forming a portion of a base plane in a bottom of the cavity and one or more second lead contact(s) forming a portion of a stepped plane higher than the base plane, the cavity sized to receive a chemically based stack of material made up of a bottom diffusion electrode layer, a middle electrolyte gel layer, and a top diffusion electrode layer. The bottom diffusion electrode layer is in electrical contact with the first lead contact(s). The top diffusion electrode layer electrically couples to the second lead contact(s) via an overlaying micro electromechanical system (MEMS) element layer with conductive coating. In an illustrative example, the CGS may provide gas sensing in small spaces.

Compact gas sensor including a MEMS element having capillaries to facilitate gas diffusion

Apparatus and associated methods relate to a micro-electro-mechanical system (MEMS) based gas sensor including an electrolyte contacting one or more top electrode(s) arranged on the bottom surface of a top semiconductor substrate (TSS), and one or more bottom electrode(s) arranged on the top of a bottom semiconductor substrate (BSS), the TSS and BSS joined with an adhesive seal around the electrolyte, the sensor including one or more capillaries providing gaseous communication to the electrolyte from an external ambient environment. The electrodes may be electrically accessed by one or more vias to externally accessible bond pads. In some examples, an electrical connection may be made from an additional bond pad on top of the TSS to the electrolyte. Various embodiments may reduce the size of various gas sensors to advantageously allow their inclusion into portable electronic devices.

Electrochemical gas sensor constructed with MEMS fabrication technology

Thermophile-based flow sensing device

A sensor for sensing a flow rate of a fluid comprises an upstream resistive element having a first resistance that changes with temperature, a downstream resistive element having a second resistance that changes with temperature, at least one tail resistor configured to determine thermal conductivity of the fluid, at least one pressure sensor configured to determine a differential pressure in the flow direction of the fluid, and circuitry configured to use the differential pressure with the thermal conductivity to determine a kinematic viscosity of the fluid, and compensate an output of the bridge circuit. The downstream resistive element is situated downstream of the upstream resistive element in the flow direction of the fluid, and the upstream resistive element and the downstream resistive element are operatively connected in a bridge circuit.

Airflow sensor with gas composition correction

A gas sensor that includes a heat source and a gas sensing film. The gas sensing film includes a polycrystalline tungsten trioxide film thermally connected to the heat source and a plurality of islands of gold on a surface of the polycrystalline tungsten trioxide film. The surface of the polycrystalline tungsten trioxide film is exposed between the islands of gold to allow the polycrystalline tungsten trioxide film to sense gas. A first electrode that electrically connected to the polycrystalline tungsten trioxide film and a second electrode is electrically connected to the polycrystalline tungsten trioxide film. The resistance of the polycrystalline tungsten trioxide film between the first electrode and the second electrode changes when the polycrystalline tungsten trioxide film is exposed to a particular type of gas.

Robust sensing film for fire gases

Embodiments relate generally to a sensor for sensing a thermal property of a fluid and may comprise an upstream resistive element having a first resistance that changes with temperature; a downstream resistive element having a second resistance that changes with temperature, wherein the downstream resistive element is situated downstream of the upstream resistive element in the flow direction of the fluid; and at least one tail resistor configured to determine one or more thermal properties of the fluid, wherein the upstream resistive element and the downstream resistive element are operatively connected in a bridge circuit, wherein the at least one tail resistor is stable with temperature, and wherein the at least one tail resistor is electrically coupled to at least one of the upstream resistive element or the downstream resistive element.

Airflow sensor with thermal conductivity and diffusivity sensing

The present disclosure includes sensing device embodiments. One sensing device includes a heater layer, a resistance detector layer, constructed and arranged to indicate a temperature value based upon a correlation to a detected resistance value, an electrode layer, and a sensing layer.

Sensor temperature sensing device

Devices, methods, and systems relating to infrared imager devices, methods for providing infrared imagers, methods of operating infrared imagers, and infrared imager systems are disclosed. An infrared imager system includes a number of lenses, a beam splitter, an imager array, and a thermo-optical array, wherein the beam splitter directs light to the imaging array and to the thermo-optical array.

Infrared imager

Thermal conductivity detectors and methods of operating thermal conductivity detectors are described herein. One or more device embodiments include a single fluidic channel, wherein the single fluidic channel includes a single inlet and a single outlet, and multiple sensors configured to determine one or more properties associated with a thermal conductivity of a fluid in the single fluidic channel.

Thermal conductivity detectors

Growing community of inventors

Shorewood, MN, United States of America

Robert E Higashi