Rca Inc.

Robert E Harwood

Frank Z Hawrylo

Maria Harvey

Frank J Fuccello, Sr

A device header with a multilayer coating overlying its entire surface, and a method of making said header, are disclosed. The multilayer coating comprises an electrolytic nickel layer and a gold layer in the device mounting area of the header, whereas the rest of the header is coated with electroless nickel, a first gold layer, electrolytic nickel, and a second gold layer. In the fabrication, the electroless nickel layer is deposited over the entire header followed by the first gold layer. Upon removing these layers from the device mounting area, the first gold layer remaining on the rest of the header acts as a mask for the etching of the mounting area preparatory to deposition of electrolytic nickel and the second gold layer. The header has the advantage of the excellent coverage of electroless nickel over most of its surface, but with the advantage of high purity electrolytic nickel in the device mounting area.

Device header and method of making same

An apparatus and method for imparting a sharp, defect-free outside corner of a desired angle to a metal workpiece are disclosed. The apparatus comprises two separate cutting tools, each with a distinct cutting direction. The tools are juxtaposed such that their leading surfaces are adjacent to each other and that their respective cutting edges intersect at the desired angle. This provides that the cutting directions of each tool are opposite one another. In using the improved cutting apparatus, the workpiece is secured and the apparatus must be movable along the x, y and z axes. By cutting the first and second surfaces of the workpiece in sequence with the first and second cutting edges of the present apparatus respectively, a sharp defect-free corner of the desired angle can be imparted to the workpiece. A specific application for the present invention is in the fabrication of intricate copper products, such as heatsinks for semiconductor devices.

Sharp edge formation on copper heatsinks

An improved light emitting device, comprising a light emitting element affixed to a tapered quadrilateral mounting surface of a copper heatsink, is disclosed. The tapered mounting surface includes two slightly divergent mounting edges whereby the width of the mounting surface varies to accommodate light emitting elements of varying sizes. The angle of divergence between the two mounting edges should be kept small to provide accurate facet-to-edge alignment of the light emitting element to the mounting surface.

Light emitting devices

A method of forming reference flats on a plurality of styli comprises the step of placing the styli lengthwise in parallel grooves disposed adjacent the surface of a first plate, allowing the top portions of the styli to project above the surface. A coating of wax is applied to the flat surface of a second plate. The wax-coated second plate is then pressed against the surface of the first plate until the top portions of the styli are held firmly against the surface of the second plate, after which the second plate is lifted from the first plate with the styli remaining adhered to the second plate. The exposed portions of the styli are lapped to form the reference flats by moving an abrasive surface in a direction along the lengthwise orientation of the styli.

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Princeton, NJ, United States of America

Robert E Harwood