Applied Materials, Inc.

Other

Robert E Davenport

Fred Conrad Redeker

Nag B Patibandla

Rajeev Bajaj

Avi Tepman

Daniel Redfield

Jason Garcheung Fung

Gregory E Menk

Mahendra Christopher Orilall

Roger V Heyder

Hou Tee Ng

Ashavani Kumar

Boyi Fu

Ashwin Chockalingam

Mayu Felicia Yamamura

Kasiraman Krishnan

Mario Dagio Cornejo

Veera Raghava Reddy Kakireddy

Aniruddh Jagdish Khanna

Russell Edward Perry

Venkat Hariharan

Amritanshu Sinha

Thomas B Brezocsky

Thomas B Brezoczky

Jaim Nulman

Dennis L Young

Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

CMP pad construction with composite material properties using additive manufacturing processes

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

Polishing pads produced by an additive manufacturing process

Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

Method of reducing the cleaning requirements of a dielectric chuck surface

A semiconductor processing system having a holding chamber coupled to a mainframe processing system and at least one loadlock chamber coupled to the holding chamber in which unprocessed wafers are transferred from the loadlock chamber to the holding chamber for subsequent processing by the mainframe system.

Multiple loadlock system

A semiconductor processing system having a holding chamber coupled to a mainframe processing system and at least one loadlock chamber coupled to the holding chamber in which unprocessed wafers are transferred from the loadlock chamber to the holding chamber for subsequent processing by the mainframe system. In one embodiment, the holding chamber has a transfer robot which holds a stack of wafers for subsequent transfer to the processing chambers of the mainframe processing system.

An apparatus for removing an undesirable gas in a processing chamber includes one or more getter materials disposed between a process gas inlet and a substrate support member in the processing chamber, and one or more temperature control elements disposed in thermal communication with the one or more getter materials. Preferably, a controller is connected to the one or more temperature control elements to regulate the temperature of the one or more getter materials, and a gas analyzer is disposed within the processing chamber to provide signals to the controller and indicate the presence of undesirable gases. Another aspect of the invention provides a method for removing a gas from a processing chamber comprising pumping the gas using a getter material disposed between a process gas inlet and a substrate support member in the processing chamber, wherein the getter material is activated by a temperature control element disposed in thermal communication with the getter material. Preferably, the method further comprises detecting a presence of the gas within the processing chamber and controlling the pumping of the getter material based on detection of the presence of the gas.

In-situ getter in process cavity of processing chamber

A semiconductor processing apparatus and process is disclosed which is capable of degassing a semiconductor substrate and also orienting the substrate in the same vacuum chamber. The apparatus includes an electrostatic clamping structure for retaining the entire undersurface of a semiconductor substrate in thermal communication therewith in the vacuum chamber, a heater located within the electrostatic clamping structure for heating the electrostatically clamped substrate to degas it, a rotation mechanism for imparting rotation to the substrate in the vacuum chamber, and a detector for detecting the rotational alignment of the substrate in response to the rotation of the substrate. In a preferred embodiment, the substrate is rotated to rotationally align it as it is being heated to degas it.

Method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber

The present invention provides a vacuum chamber that reduces the amount of time required to draw a vacuum after replacing consumables or performing routine maintenance by preserving the vacuum in a portion of the chamber. More particularly, the chamber isolates a frequently replaced consumable or component in a first portion of the chamber so that only the first portion of the chamber is exposed to the surrounding environment and the volume of gas or air that must be re-evacuated is reduced. A gate valve is provided to form a seal with a valve seat that is either formed into the chamber wall or provided by a valve body. Once the second portion is sealed, a lid to the first portion may be opened for access.

Chamber design with isolation valve to preserve vacuum during maintenance

A semiconductor processing apparatus and process is capable of degassing a semiconductor substrate and also orienting the substrate in the same vacuum chamber. The apparatus includes an electrostatic clamping structure for retaining the entire undersurface of a semiconductor substrate in thermal communication therewith in the vacuum chamber, a heater located within the electrostatic clamping structure for heating the electrostatically clamped substrate to degas it, a rotation mechanism for imparting rotation to the substrate in the vacuum chamber, and a detector for detecting the rotational alignment of the substrate in response to the rotation of the substrate. In a preferred embodiment, the substrate is rotated to rotationally align it as it is being heated to degas it.

Apparatus and method for rotationally aligning and degassing

A readily removable deposition shield assembly for processing chambers such as chemical vapor deposition (CVD), ion implantation, or physical vapor deposition (PVD) or sputtering chambers, is disclosed. The shield assembly includes a shield member which is mounted to the chamber for easy removal, such as by screws, and defines a space along the periphery of the substrate support. A shield ring is inserted into the peripheral space and is thus mounted in removable fashion and is automatically centered about the substrate. The shield ring overlaps the cylindrical shield and a deposition ring. The deposition ring removably rests upon a flange extending from the outer periphery of a substrate support pedestal. Collectively, these components prevent deposition on the chamber and hardware outside the processing region.

Growing community of inventors

Los Gatos, CA, United States of America

Robert E Davenport