Applied Materials, Inc.

Wyse Technology Inc.

Mac Cal Inc.

Robert Duncan

Padmanabhan Krishnaraj

Nasreen Gazala Chopra

Alan W Collins

Joseph D'Souza

Kimberly Branshaw

Tetsuya Ishikawa

Muhammad M Rasheed

Tsutomu Tanaka

Siamak Salimian

Canfeng Lai

James Nguyen

Sudhir R Gondhalekar

Bruno Geoffrion

Harry S Whitesell

Kaveh F Niazi

Rudolf Gujer

Michael Hall

Diana E Gujer, Legal Representative

A reduced footprint collimator device to focus light beam over length of optical path for use in an optical cytometry device or other optical instrument where a focused beam of light is passed through a test medium and then sampled by a photomultiplier or multiple photomultipliers for analysis. This device provides alignment and focus of that beam and collimation along the entire beam path. In addition in order to reduce the overall footprint of the beam path this device uses a precision coated prism to redirect the optical path perpendicular to the entering optical beam. The reduced footprint collimator device to focus light beam over length of optical path generally includes a reduced footprint 90 degree collimator which allows light beam collimation, beam path alignment, selectable beam focal distance, and reduces stray light reflections all in a minimal footprint.an These features allows for a smaller overall instrument design.

Reduced footprint collimator device to focus light beam over length of optical path

Computing device deployment and configuration using a mass storage device is provided. A generic computing device is provided to a customer or end user. A mass storage device is used to distribute configuration information to the generic computing device. The configuration information includes customer-specified or ordered software applications or other features. The configuration information can also include updates to the computing device system software. The customer or end user couples the mass storage device to the generic computing device in order to load the configuration information into the computing device. After the configuration information is loaded, the computing device is configured for the customer's use. Further features, such as creating customized images, are also provided.

Computing device deployment using mass storage device

Embodiments of the present invention are directed to a gas distribution system which distributes the gas more uniformly into a process chamber. In one embodiment, a gas distribution system comprises a gas ring including an outer surface and an inner surface, and a gas inlet disposed at the outer surface of the gas ring. The gas inlet is fluidicly coupled with a first channel which is disposed between the outer surface and the inner surface of the gas ring. A plurality of gas outlets are distributed over the inner surface of the gas ring, and are fluidicly coupled with a second channel which is disposed between the outer surface and the inner surface of the gas ring. A plurality of orifices are fluidicly coupled between the first channel and the second channel. The plurality of orifices are spaced from the gas inlet by a plurality of distances, and have sizes which vary with the distances from the gas inlet as measured along the first channel, such that the size of the orifice increases with an increase in the distance between the orifice and the gas inlet as measured along the first channel.

Gas distribution system for improved transient phase deposition

Methods and apparatus of the present invention deposit fluorinated silicate glass (FSG) in such a manner that it strongly adheres to an overlying or underlying barrier layer or etch stop layer, and has a lower dielectric constant, among other benefits. In one embodiment, silicon tetrafluoride (SiF ), oxygen (O ), and argon (Ar) are used as the reactant gases, with the ratio of oxygen to silicon controlled to be at between about 2:1 to 6:1. Such O levels help reduce the amount of degradation of ceramic chamber components otherwise caused by the elimination of silane from the process recipe.

Methods and apparatus for producing stable low k FSG film for HDP-CVD

A method and apparatus for forming a layer on a substrate in a process chamber during a plasma deposition process are provided. A plasma is formed in a process chamber, a process gas with precursor gases suitable for depositing the layer are flowed into the process chamber, and a magnetic field having a strength less than about 0.5 gauss is attenuated within the process chamber. Attenuation of such a magnetic field results in an improvement in the degree of process uniformity achieved during the deposition.

High-permeability magnetic shield for improved process uniformity in nonmagnetized plasma process chambers

Growing community of inventors

San Jose, CA, United States of America

Robert Duncan