Motorola Corporation

Robert Douglas Mikkola

Mohammed Rabiul Islam

Matthew Thomas Herrick

Cindy Reidsema Simpson

Rina Chowdhury

Marijean E Azrak

Brett Caroline Baker

Cindy Kay Goldberg

Edward Acosta

David Moralez Pena

A method for electroplating a copper layer (,) over a wafer (,) powers a cathode of an electroplating system (,) in a manner that obtains improved copper interconnects. A control system (,) powers the cathode of the system (,) with a mix of two or more of: (i) positive low-powered DC cycles (,or,); (ii) positive high-powered DC cycles (,or,); (iii) low-powered, pulsed, positive-power cycles (,or,); (iv) high-powered, pulsed, positive-powered cycles (,or,); and/or (v) negative pulsed cycles (,or,). The collection of these cycles functions to electroplate copper or a like metal (,) onto the wafer (,). During electroplating, insitu process control and/or endpointing (,or,) is performed to further improve the resulting copper interconnect.

Method for forming a copper layer over a semiconductor wafer

Growing community of inventors

Austin, TX, United States of America

Robert Douglas Mikkola