Tyco Electronics Corporation

Littelfuse, Inc.

Robert Daniel Hilty

George Jyh-Shann Chou

Michael Fredrick Laub

George J Chou

Jeffery Walter Mason

Peter David Wapenski

Alan Robert MacDougall

Jessica Henderson Brown Hemond

Valerie Lawrence

Mary Elizabeth Sullivan

Mary Elizabeth Sullivan-Malervy

Terry P Bowen

Matthew Richard McAlonis

Jeffrey Byron McClinton

Jianhua Chen

Jason M'Cheyne Reisinger

Jerzy Gazda

Wayne Stewart Alden, Iii

Charles Randall Malstrom

Sean Patrick McCarthy

Bruce Foster Bishop

Arata Tanaka

Charles David Fry

Marjorie Kay Myers

Zhengwei Liu

David B Sinisi

Vishwa N Shukla

Jeffrey George Pennypacker

Keith James McKechnie

Henry Otto Herrmann, Jr

Rodney Ivan Martens

Weiqing Guo

Minh V Ngo

Dmitry Vladimirovich Zhmurkin

Shiraz Sameja

Min Zheng

Charles Randall Malstron

Steven Alan Jarrett

Chuan Yue

Edward MacPherson

Jessica Henderson Brown-Hemond

A thermal cut-off device includes a plastic base, two electrodes, a temperature sensing element, and a plastic cover that fits over the base. The temperature sensing element is curved downward, and may be a bimetal or a trimetal. When the device is subject to an over-temperature condition, the orientation of the curve flips such that the temperature sensing element is then curved upward. When the temperature sensing element is curved upward, it lifts an arm of one of the electrodes, which severs the electrical connection between the electrodes. In this manner the device shuts off during an over-temperature condition in order to protect the circuit in which the device is installed. To prevent corrosion of the temperature sensing element, a first moisture insulation layer is applied to the outer surface of the thermal cut-off device. The moisture insulation layer may be an epoxy adhesive or a UV/visible light-cured adhesive or light/heat cured adhesive. In some embodiments, a second moisture insulation layer is formed on the surface of the temperature sensing element.

Insulated thermal cut-off device

A composite conductor is disclosed having an elongate support with an outer surface of a whisker-forming metallic, the conductor further having a carbon nanotube yarn intertwined with the elongate support. The yarn is infiltrated by self-assembled whiskers from the whisker forming metallic.

Composite cable

A method of manufacturing an electrical conductor includes providing a substrate layer, depositing a surface layer on the substrate layer that has pores at least partially exposing the substrate layer, and forming graphene deposits in the pores. Optionally, the graphene deposits may be formed only in the pores. The graphene deposits may be formed along the exposed portions of the substrate layer. The graphene layers may be selectively deposited or may be deposited to cover an entire layer. Optionally, the forming of the graphene deposits may include processing the electrical conductor using a chemical vapor deposition process using an organic compound precursor and heat of sufficient temperature to facilitate graphene growth on the metal compound comprising the substrate layer.

Electrical conductors and methods of manufacturing electrical conductors

A contactless connector includes a first communication chip configured to at least one of transmit and receive wireless RF signals, a second communication chip configured to at least one of transmit and receive wireless RF signals, and a waveguide structure between the first and second communication chips. The waveguide structure conveys RF signals between the first and second communication chips.

Waveguide structure for a contactless connector

An electrical conductor has a metal substrate. A seal layer is provided exterior of the metal substrate. A nickel layer is provided exterior of the seal layer. The seal layer is a non-nickel based metal. Optionally, the seal layer may be tin based. Optionally, the seal layer may create intermetallic interface layers with the nickel layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.

Corrosion resistant electrical conductor

A method of manufacturing a composite assembly includes providing a fluid bath and adding a ceramic material to the fluid bath. The ceramic material comprises a plurality of ceramic particles, wherein the plurality of ceramic particles is devoid of a conductive coating. The method further includes immersing at least part of a conductive substrate in the fluid bath. The method also includes applying a voltage potential between the fluid bath and the conductive substrate, whereby the ceramic material is electrodeposited onto the conductive substrate as at least a portion of a dielectric layer.

Composite assembly for an electrical connector and method of manufacturing the composite assembly

An electrical contact includes a body having a mating segment. At least a portion of the mating segment defines a first conductive element having a three-dimensional (3D) surface. A dielectric layer is formed directly on the 3D surface of the first conductive element in engagement with the 3D surface. A second conductive element is formed on the dielectric layer such that the dielectric layer extends between the first and second conductive elements. The first and second conductive elements and the dielectric layer form a capacitor.

Capacitor

A nickel based alloy coating and a method for applying the nickel based alloy as a coating to a substrate. The nickel based alloy comprises about 0.1-15% rhenium, about 5-55% of an element selected from the group consisting of cobalt, iron and combinations thereof, sulfur included as a microalloying addition in amounts from about 100 parts per million (ppm) to about 300 ppm, the balance nickel and incidental impurities. The nickel-based alloy of the present invention is applied to a substrate, usually an electro-mechanical device such as a MEMS, by well-known plating techniques. However, the plating bath must include sufficient sulfur to result in deposition of 100-300 ppm sulfur as a microalloyed element. The coated substrate is heat treated to develop a two phase microstructure in the coating. The microalloyed sulfur-containing nickel-based alloy of the present invention includes a second phase of sulfide precipitates across the grain (intragranular) that improves the stress-relaxation resistance of the alloy.

Composition and method for alloy having improved stress relaxation resistance

An electrical conductor has a metal substrate. A seal plating layer is provided on and exterior of the metal substrate. A nickel plating layer is provided on and exterior of the seal plating layer. A gold plating layer is provided on and exterior of the nickel plating layer. The seal plating layer is a non-nickel based metal. Optionally, the seal plating layer may be tin based. Optionally, the seal plating layer may create intermetallic interface layers with the nickel plating layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.

An electrical connector is provided for mating with an electrical component. The connector includes a substrate having a mating side, and a solder column extending from the mating side of the substrate. The solder column includes a base that is engaged with the substrate. The solder column extends a length away from the mating side of the substrate to a tip. The tip includes a contact surface that is configured to engage and electrically connect to an electrical contact of the electrical component. The solder column is linearly tapered along at least a portion of the length from the base to the tip.

Electrical connector with solder columns

A nickel based alloy coating and a method for applying the nickel based alloy as a coating to a substrate. The nickel based alloy comprises about 0.1-15% rhenium, about 5-55% of an element selected from the group consisting of cobalt, iron and combinations thereof, sulfur included as a microalloying addition in amounts from about 100 parts per million (ppm) to about 300 ppm, the balance nickel and incidental impurities. The nickel-based alloy of the present invention is applied to a substrate, usually an electromechanical device such as a MEMS, by well-known plating techniques. However, the plating bath must include sufficient sulfur to result in deposition of 100-300 ppm sulfur as a microalloyed element. The coated substrate is heat treated to develop a two phase microstructure in the coating. The microalloyed sulfur-containing nickel-based alloy of the present invention includes a second phase of sulfide precipitates across the grain (intragranular) that improves the stress-relaxation resistance of the alloy.

Composition and method for applying an alloy having improved stress relaxation resistance

A composite assembly for an electrical connector includes a conductive substrate and an electrodeposited layer. The conductive substrate is configured to form a conductive path of the electrical connector. The electrodeposited layer is disposed on the conductive substrate and includes a dielectric material. A method of manufacturing a composite assembly for an electrical connector includes providing a fluid bath that includes a dielectric material and immersing at least part of a conductive substrate into the fluid bath. The method also includes applying a voltage potential between the fluid bath and the conductive substrate and electrodepositing a dielectric layer that includes the dielectric material on the conductive substrate.

A plug assembly includes a body extending between a mating end and a cable end. A sensor assembly is supported by the body that has an integrated circuit component having a first pad and a second pad. The sensor assembly also has a first sensor probe mounted to the first pad and a second sensor probe mounted to the second pad.

Plug assembly for a connectivity management system

A socket connector assembly includes a housing, signal terminals, and a power module subassembly. The housing is mounted to a circuit board and includes opposing walls having internal surfaces. The signal terminals are joined to the internal surfaces of the walls and engage conductive members disposed along side edges of an electronic package that is received into the housing between the walls. The power module subassembly is coupled to the circuit board between the walls of the housing. The power module subassembly includes a power contact configured to engage a current carrying conductor disposed on a surface of the electronic package that extends between the side edges of the electronic package.

Socket connector assembly with compressive contacts

An electrical connector is provided. The electrical connector includes a substrate and an elastomeric element extending outwardly from the substrate. The elastomeric element extends outwardly from a base portion thereof at the substrate to an end portion thereof that is opposite the base portion. An electrical contact engages an electrically conductive element of the substrate. The electrical contact has a portion extending over at least a portion of the end portion of the elastomeric element.

Growing community of inventors

Harrisburg, PA, United States of America

Robert Daniel Hilty