The Whitaker Corporation

Tyco Electronics Corporation

Robert D Irlbeck

Robert M Renn

Keith L Volz

Frederick R Deak

David C Johnson

Warren A Bates

Roger Lee Thrush

Soren Grinderslev

Lyle Stanley Bryan

William W Drabenstadt

Richard C Fowler

Charles Dudley Copper

Kevin John Peterson

David Allen Klein

Charles David Fry

Douglas M Walburn

Henry Otto Herrmann, Jr

Donald Robert Worthington, Jr

Rohan Narang

Ronald Louis Marion

Morgan J Bradley

Donnie B Collins

John W Jones

Robert Dumas

Charles Thomas Long

A connector assembly for mounting to a panel includes a cap connector having a cap housing, a cap terminal block held in the cap housing and holding a plurality of cap terminals and a mounting clip coupled to the cap housing to secure the cap housing to the panel. The cap housing has an inner shroud, an inner flange surrounding the inner shroud and an outer flange extending outward from the inner flange. The inner flange has panel retention features extending therefrom. The inner shroud is loaded through an opening in the panel until the panel retention features engage the panel and temporarily secure the cap housing to the panel between the panel retention features and the outer flange. The mounting clip is coupled to the cap housing to secure the cap housing to the panel between the mounting clip and the outer flange.

Panel mounted connector assembly

A module assembly includes a component housing having a plurality of walls forming a cavity. At least one of the walls includes an opening therethrough open to the cavity. The heat transfer plate is mounted within the opening of the component housing and his exposed on an exterior of the component housing. The heat transfer plate forms at least a portion of a mounting surface of the component housing.

Module assembly having heat transfer plate

A circuit for wetting relay contacts includes a relay having a relay coil, a movable contact and a stationary contact. The movable contact is movable between an open position and a closed position upon energizing of the relay coil, and the movable contact engages the stationary contact in the closed position. The movable contact is moved from the closed position to the open position when the relay coil is de-energized. A transistor is connected to the relay coil through a load, wherein the transistor loads the relay coil after the relay coil is de-energized to provide an arc between the movable contact and the stationary contact as the movable contact is moved from the closed position to the open position.

Circuit and method for wetting relay contacts

In order to reduce acoustic noise, an electromagnetic relay ( ) includes an insert or bump ( ) located between the relay armature ( ) and the relay core ( ). The insert is flexible and can be mounted on the armature. The insert ( ) reduces noise by decelerating the armature ( ) at impact with the core ( ). The armature ( ) can be tilted relative to a surface of the core ( ) so that the insert or bump ( ) can be positioned away from the primary impact between the core and the armature.

Low noise relay

An electromagnetic relay ( ) includes noise dampening means ( ), such as an elastomeric insert, a noise dampening composition or mataerial, or a resin located at the juncture between the relay armature ( ) and the spring ( ), which noise dampening means ( ) reduces noise generated by contact between the armature ( ) and the spring ( ) as the relay ( ) is energized and the armature ( ) is pulled into the core ( ) and when the relay ( ) is de-energized and the spring ( ) biases the armature ( ) away from the core ( ).

An elastomeric electrical connector (30) comprises an elastomeric core (32) having sides (48) extending in a longitudinal direction between opposite ends (46), and a flexible film (34) having circuit traces (36) thereon wrapped around the core. One of the sides (48) has a relief (50) and the flexible film has a crease (40) directed into the relief. The crease predisposes a portion of the flexible film to gather in the relief when the core is compressed in the longitudinal direction, thereby preventing circuit traces on loose flexible film from causing inadvertent electrical shorts.

Elastomeric connector with control of loose circuitry

An electrical connector comprises a dielectric housing having a slot and an elastomeric connector of uniform width disposed in the slot. The slot has a primary section with a width dimensioned such that the elastomeric connector is held relatively loosely in the primary section, and a reduced width section wherein the elastomeric connector is held relatively securely by an interference fit,

Retention of elastomeric connector in a housing

A connector (10) including a PC board (12) which is fastened to a block (30) and presses against an elastomeric electrical component (40). Electrical device (20) includes a circuit trace (23) and printed circuit board (12) includes a circuit trace (13) which both engage a flexible film circuit (42) on the elastomeric electrical connector (40). Wedge member (50) engages a bottom edge (40b) of elastomeric electrical component (40) for biasingly engaging the component (40) and urging the component (40) and flexible circuit (42) towards and against circuit traces (13,23). Additionally, good electrical contact and compliance to planar irregularities are maintained between circuit traces (13,23) and flexible film circuit (42) thereby ensuring good electrical contact therebetween.

Right angle electrical connector

This invention is directed to a socket system for the receipt of an integrated circuit 'chip', where such a chip, as known in the art, typically is a planar electronic device having plural leads extending from the periphery thereof. The system, operatively mounted to a planar electronic device, such as a motherboard, comprises a frame having a central recess defined by converging side walls and terminating in a floor, and plural slots about the periphery of the floor for receiving elastomeric connectors for electrically interconnecting the chip leads to the mother board. Overriding the frame, for mechanical engagement therewith, is a force applying member, where such member includes plural ribs extending downwardly from the member and positioned to initially contact the respective converging side walls when the force applying member is caused to mechanically engage the frame. In the engaging mode, the ribs are caused to ride along the converging walls and flex inwardly towards the floor slots into which the chip leads lie. By this action the ribs apply a lateral force to and wipe the leads, while applying a vertical force to the ends of the chip leads overlying the elastomeric connector.

Chip socket system

The invention is directed to an electronic docking connector for edge mounting an electronic device, such as a daughter board, to a mother board. The connector comprises a pair of housing members assembled to define an elongated slot planarly aligned with the edge of the mother board. Mounted therein is a pair of opposed force applying, resilient spring members operatively mounted for receiving and applying a compressive force against the electronic device. A flexible film member, containing electrical circuitry thereon, is also mounted within said housing members for electrically interconnecting corresponding circuitry on the mother board, and the electronic device. As an alternative, a dielectric insert is disposed between each spring member and its corresponding flexible film to reduce or eliminate cross talk therein.

Coplanar computer docking apparatus

This disclosure relates to testing apparatus (10), preferably an LGA burn-in test socket, for an integrated chip (28). The apparatus (10), arranged for mounting on a planar electronic device (46), such as a printed circuit board, includes a frame member (12) for mounting to the planar electronic device (46), where the frame member (12) includes a central opening (22) extending between first and second surfaces, and dimensionally sized to receive the chip (28). Recesses (35) are provided for receiving an electronic interface member (18) mounting plural flexible electrical connectors (106), such as an elastomeric connector, as known in the art, for engaging the traces or pads of the chip to the planar device during testing. Further, plural recesses (40) extend from at least the first surface, where each recess includes a compression spring (41). Positioned over and for engagement with the frame member is a floatably mounted force applying member (14) having first and second parallel surfaces. A central opening (75), concentric with the central opening ( 22) of the frame member (12) is present. Additionally, plural posts (62) extend from the second parallel surface for receipt in respective recesses (44). Finally, camming levers (16) are provided for urging the force applying member toward the frame member, along with pivotal pusher members (78) responsive to the camming levers to engage and secure the chip during testing thereof.

Integrated circuit chip testing apparatus

This invention is directed to a mechanical, robotically operated burn-in socket testing apparatus for integrated circuit 'chips', where such chips, as known in the art, are typically planar electronic devices. The apparatus, operationally mounted to a planar electronic board, such as a mother board, comprises a first frame member for mounting to the mother board, where the first frame member includes electrical means for engaging chip leads and applying electrical current thereto during the burn-in testing. A second frame member is disposed in sliding engagement with the first frame member, where the second frame member is movable from a first position to a second position. Finally, cooperative latching and camming means are provided between the first and second frame members to effect the movement between the first and second positions, and to securely hold the chip during burn-in, where the camming means includes a pivotal member movable from a remote position free of the chip to a position engaging the chip.

Burn-in socket testing apparatus

The invention relates to testing apparatus, such as the type known as a burn-in test socket for integrated circuit 'chips', where the chips are essentially planar electronic devices having a plurality of chip leads or traces, laterally projecting therefrom, for electrical interconnection to complementary traces on a planar electronic device, such as a mother board, upon which the socket may be mounted, during testing. The socket comprises a frame member for mounting to the planar electronic device, where the frame member includes electrical means for engaging chip leads and applying electrical current thereto during testing. A second element of the socket is a two-piece, adjustable cover member consisting of first and second members floatably mounted together by plural compression springs, where the first and second members are axially movable relative to one another. Specifically, the first member includes a force generating surface to apply a uniform force on the chip leads in contact with said complementary traces, while the second member, overlying the first member, includes at least a pair of latching members adapted to secure the cover member to the frame member during chip testing.

Chip socket testing apparatus with adjustable contact force

This invention is directed to a system for precisely aligning a pair of electronic devices, such as an integrated chip test socket electrically interconnected to a motherboard, where such devices are arranged in a parallel relationship. The system includes a method which comprises the steps of fixedly securing plural projections on a planar surface of each of the devices, where each projection includes a flat side or edge and that the flat side of at least two adjacent projections define a first plane or reference line. Arranging the respective planar surfaces in close proximity to one another whereby the projections from one surface contacts the other planar surface. Thereafter, shifting the respective devices relative to one another until the respective first planes or reference lines are aligned into a common plane or line. Finally the devices are fixedly secured together, whereby the electrical interconnections between the devices are precisely aligned.

Alignment system for planar electronic devices arranged in parallel

This invention is directed to a chip carrier system for mounting to a first planar electronic device, such as a motherboard or test fixture, where first planar electronic device is provided with a planar, electrical interconnection interface mounted thereto. The chip carrier system includes a frame comprising a peripheral body portion defined by upper and lower planar surfaces, a recess in the lower planar surface to receive the planar, electrical interconnection interface, a central recess terminating in a floor to receive a second planar electronic device, such as an integrated circuit chip, having leads extending therefrom, converging side walls extending from the upper planar surface down to the floor, and plural through slots for receiving the leads. Cooperating therewith is a force applying member adapted to provide a normal force to the second planar electronic device and be mechanically secured to the frame. The force applying member includes plural ribs arranged to overlie portions of the converging side walls, whereby as the force applying member is brought into engagement with the frame, the ribs, in contact with the converging side walls, are cammed inwardly into contact with the leads of the second planar electronic device to apply a normal force thereto in contact with a resilient electrical connector associated with the planar, electrical interconnection interface.

Growing community of inventors

Greensboro, NC, United States of America

Robert D Irlbeck