Ferro Corporation

Robert D Gardner

Aziz S Shaikh

Srinivasan Sridharan

Gordon J Roberts

Keith M Mason

Dineen M Hopp Kolkowski

Dineen M Hopp

Kathleen M Rhoads

Raymond F Babuder

Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35&#xb0; C. to about 90&#xb0; C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.

Hot-melt sealing glass compositions and devices using the same

Hot-melt sealing glass compositions and methods of making and using the same

Aluminum nitride (AIN), due to its high thermal conductivity, is an attractive substrate material to the power hybrid market, (i.e., users employing circuits utilizing power semiconductors resulting in a great deal of heat being produced by the electronic device). In spite of its attractive thermal, mechanical and dielectric properties, AlN substrates generally afford certain drawbacks, the primary drawback being that many conductive compositions do not readily adhere to the surface. One of the more desirable conductors to utilize in conductive compositions when producing microcircuits is copper. In accordance with the present invention, a copper containing conductive composition is provided which affords excellent adhesion to AlN substrates. The conductive composition preferably comprises copper or a copper alloy, a glass binder, and cadmium oxide.

Copper conductive composition for use on aluminum nitride substrate

A method of bonding a dielectric material to a substrate comprising the steps of:

Dielectric compositions

This invention relates to a dielectric composition comprising:

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Northfield, OH, United States of America

Robert D Gardner