Motorola Corporation

Robert D Colclasure

Gong Chen

A semiconductor wafer ( ) includes a first semiconductor die ( ) having a first alignment mark ( ) disposed in an alignment region ( ) to align the first semiconductor die on the wafer. A second semiconductor die ( ) has a second alignment mark ( ) disposed in the alignment region such that the second alignment mark overlaps the first alignment mark. The area occupied by the overlapping alignment marks is shared between the first and second semiconductor dice to reduce the area and the cost of each die.

Semiconductor device and alignment method

A semiconductor wafer (,) includes a first semiconductor die (,) having a first alignment mark (,) disposed in an alignment region (,) to align the first semiconductor die on the wafer. A second semiconductor die (,) has a second alignment mark (,) disposed in the alignment region such that the second alignment mark overlaps the first alignment mark. The area occupied by the overlapping alignment marks is shared between the first and second semiconductor dice to reduce the area and the cost of each die.

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Mesa, AZ, United States of America

Robert D Colclasure