Austriamicrosystems Ag

Robert Csernicska

Manfred Brandl

Walter Draxler

The present invention describes a microsensor with a sensor element () and an integrated circuit (), containing a semiconductor body () with an intergrated circuit (), the sensor element () being positioned on a main surface () of the semiconductor body () and there being a eutectic connection () formed between the semiconductor body () and the sensor element ().

Micro-sensor

To expose a submerged bondable terminal pad in a component that includes at least two substrates which are joined with each other, it is proposed that grooves of relatively shallow depth be provided on the connecting surface of the second substrate before the two substrates are joined. After the two substrates are joined, incisions are made opposite the grooves which open the grooves from the back side. The cutouts to be removed are defined between two grooves.

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Stainz, Austria

Robert Csernicska