Infineon Technologies Ag

Robert Christian Hagen

Holger Woerner

Jens G Pohl

Michael Bauer

Gerald Ofner

Bernd Goller

Peter Strobel

Christian Stuempfl

Rainer Steiner

Hermann Vilsmeier

Josef Thumbs

Stefan Wein

Bernhard Zuhr

Ulrich Bachmaier

A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.

Semiconductor component with plastic housing, and process for producing the same

An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.

Electronic component with a plastic package and method for production

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Sarching, Germany

Robert Christian Hagen