Motorola Corporation

Emerson Network Power - Embedded Computing, Inc.

Artesyn Embedded Computing, Inc.

Smart Embedded Computing, Inc.

Robert Charles Tufford

Jeffrey Martin Harris

Douglas L Sandy

Martin Peter John Cornes

Suzanne Marye Wong

Mark S Lanus

Pasi Jukka Petteri Vaananen

Malcolm J Rush

Liu Jiang

A configurable electronics cabinet cooling system includes a cabinet having multiple walls including at least one universal cabinet wall. The universal cabinet wall has a planar outward facing surface and multiple apertures. A heat transfer component is releasably connected to the universal cabinet wall. The heat transfer component is selected from either a conductive cooling member or a convective cooling member each adapted to be interchangeably and releasably connected to the universal cabinet wall using fasteners extending through same ones of the apertures. Each of the conductive cooling member and the convective cooling member includes a planar surface, the planar surface adapted to directly contact the outward facing surface of the universal cabinet wall.

Configurable cooling for rugged environments

An electrical equipment cabinet cooling device includes an electrical equipment cabinet having a cabinet outer frame defining an inner perimeter wall. A planar outer cabinet wall is positioned within the inner perimeter wall. A two-phase thermal device includes spaced and opposed first and second transfer walls. An outer perimeter wall connects the first and second transfer walls and defines an interior sealed cavity between the first and second transfer walls. The outer perimeter wall is sized for slidable receipt within the inner perimeter wall. A liquid/vapor retained in the interior sealed cavity acts as a heat transfer medium between the first and second transfer walls. A convective cooling block has a planar end face in direct contact with the second transfer wall. Heat transfers to atmosphere in a path including the outer cabinet wall, the first transfer wall, the liquid/vapor, the second transfer wall, and the cooling block.

Method and device to provide uniform cooling in rugged environments

A cooling system having integrated cold plate extending member and cold plate for an electronics enclosure includes a chassis having multiple heat producing boards positioned in side-by-side parallel configuration having successive ones of the boards separated by a cavity thereby defining multiple ones of the cavities. A cold plate assembly includes a base unit of a thermally conductive material. The cold plate assembly also includes multiple cold plate extending members connected to the base unit. Successive ones of the cold plate extending members are spaced to be slidably received in one of the cavities such that the cold plate extending member received between any two successive boards is in direct contact with both of the successive ones of the boards.

Integrated thermal inserts and cold plate

A dual redundant computer safety relay box system includes first and second fail-safe computing systems (FSCs) individually mounted to first and second printed circuit boards. Each FSC includes two computing modules (CPUs) designated as a first CPU and a second CPU. The first and second FSC's are both connected to a safety relay box. The printed circuit boards are isolable from each other permitting maintenance on one of the printed circuit boards while operation of the FSC of the other printed circuit board is maintained. In each FSC a health signal generated from the first and second printed circuit boards of the first and second CPUs defines a multi-level dynamic pulse signal. Presence of the dynamic pulse signal produces an output identified as each of a first and a second healthy indication signal from each of the CPUs of one of the first or second FSCs.

Safety relay box system

A cooling system having integrated cold plate extending member and cold plate for an electronics enclosure includes a chassis having multiple heat producing boards positioned in side-by-side parallel configuration having successive ones of the boards separated by a cavity thereby defining multiple ones of the cavities. A cold plate assembly includes a base unit of a thermally conductive material. The cold plate assembly also includes multiple cold plate extending members connected to the base unit. Successive ones of the cold plate extending members are spaced to be slideably received in one of the cavities such that the cold plate extending member received between any two successive boards is in direct contact with both of the successive ones of the boards.

A method of transporting a RapidIO packet () from an initiator RapidIO domain () over an IP packet network () to a receiver RapidIO domain () can include the initiator RapidIO domain creating the RapidIO packet and reading a destination domain ID () of the RapidIO packet, where the destination domain ID corresponds to the receiver RapidIO domain. The destination domain ID is mapped to a receiver RapidIO domain IP address (). The RapidIO packet is encapsulated in an IP packet () and the IP packet is communicated to the receiver RapidIO domain over the IP packet network.

Method of transporting a RapidIO packet over an IP packet network

A multi-service platform system () includes a VXS backplane (), a switched fabric () operating on the VXS backplane, a parallel bus () operating coincident with the switched fabric on the VXS backplane, a VXS payload module () coupled to the VXS backplane, and a storage module () coupled to the VXS payload module, wherein the storage module is coupled to communicate with the switched fabric.

VXS payload module having a storage module and method

A multi-service platform system () including a VMEbus network () and a switched fabric network () wherein the VMEbus network () and the switched fabric network () operate concurrently within the multi-service platform system (). Multi-service platform system () can include a payload module () with a first switched fabric connector () in a Pmechanical envelope () that is designed to interface with a corresponding first switched fabric connector () in the Jmechanical envelope () on a backplane ().

Multi-service platform system and method

A multi-service platform system, includes a backplane (), a switched fabric () on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module () has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector () is coupled to a rear edge () of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector. A storage module () is coupled to the payload module, where the storage module is coupled to communicate with the switched fabric.

Fabric enabled storage module

A switched fabric mezzanine storage module () includes a storage module () and a switched fabric connector () coupled to the storage module. The storage module is coupled to directly communicate with a switched fabric (), where the switched fabric storage mezzanine module is coupled to a payload module () having one of a 3U form factor, a 6U form factor and a 9U form factor. The payload module can include at least one multi-gigabit connector () coupled to a rear edge () of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface with a backplane ().

Switched fabric mezzanine storage module

A multi-service platform system, includes a backplane (), a switched fabric () on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module () has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector () is coupled to a rear edge () of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.

Payload module having a switched fabric enabled mezzanine card

A payload module () includes a payload subunit () coupled to the payload module, where the payload module has one of a 3U form factor, a 6U form factor and a 9U form factor. At least one multi-gigabit connector () is coupled to a rear edge () of the payload module and to the payload subunit, where the at least one multi-gigabit connector is coupled to communicatively interface the payload subunit to a backplane (), where the backplane includes a switched fabric () coincident with at least one of a VMEbus network and a PCI network, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload subunit through the at least one multi-gigabit connector. A payload module power connector () includes a plurality of pins (), where at least one of the plurality of pins has a length different from a remaining portion of the plurality of pins such that power between a main power bus () on the backplane and a payload module power bus () on the payload module is at least one of applied and removed, in a smooth and gradually ramped fashion over a time period (), where power and any concurrent data operations on the backplane remain uninterrupted and unaffected during the at least one of applying and removing power between the main power bus and the payload module power bus.

Multi-network modules with hot-swap capability

A multi-service platform system () includes a computer chassis () having a plurality of 3U slots (), a backplane () integrated in the computer chassis, a switched fabric () on the backplane. At least one of a VMEbus network and a PCI network are coincident with the switched fabric on the backplane. A payload module () having a 3U form factor is coupled to interface with one of the plurality of 3U slots, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector () is coupled to a rear edge () of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.

3U payload module configurations

A bladed architecture, backplane-based network () having N payload slots () includes an N/2 slot switch module (), wherein the N/2 slot switch module is reconfigurable to one of a left-hand slot switch configuration () and a right-hand slot switch configuration (), and wherein the N/2 slot switch module is coupled to N/2 of the N payload slots such that the bladed architecture, backplane-based network is in a sub-optimal configuration ().

N/2 slot switch module

A switch module includes a board () having one of a 3U form factor and a 9U form factor, and a central switching resource () coupled to the board, where the central switching resource is coupled to operate a switched fabric () on a backplane (), where the switched fabric operates coincident with at least one of a VMEbus network and a PCI network on the backplane.

Growing community of inventors

Chandler, AZ, United States of America

Robert Charles Tufford