Corning Incorporated

Robert Carl Burket

Tammy Lynn Petriwsky

Samuel Odei Owusu

Alexander Mikhailovich Streltsov

Heather Debra Boek

Daniel Ralph Harvey

Uta-Barbara Goers

Benedict Yorke Johnson

A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/&#x2212;100 &#x3bc;m of the front surface of the glass piece most desirably within +/&#x2212;50 &#x3bc;m of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piecefrom the front surfaceof the glass piece, the holes having an diameter the in range of from 5 to 15 &#x3bc;m, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within +/&#x2212;30 &#x3bc;m of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.

Methods of forming high-density arrays of holes in glass

A method etching a glass material comprises providing an etchant comprising 10-30% HF, 5-15% HNO,and at least 10% HPOby volume constituted such that the ratio HF:HNOby volume is in the range of 1.7:1 to 2.3:1, providing a glass material to be etched, and contacting the glass material with the etchant. The etchant desirably has no other acid components. The method may be performed with the etchant temperature within the range of 20-30&#xb0; C. The glass material may be an aluminosilicate glass. Ultrasound energy may be applied to the etchant, to the glass material, or both.

Etch rate enhancement at low temperatures

Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

Methods for forming vias in glass substrates

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Elkland, PA, United States of America

Robert Carl Burket