Suss Microtec Lithography Gmbh

Robert Campbell

Gregory George

Etienne Hancock

An apparatus for bonding semiconductor structures includes equipment for positioning a first surface of a first semiconductor structure directly opposite and in contact with a first surface of a second semiconductor structure and equipment for forming a bond interface area between the first surfaces of the first and second semiconductor structures by pressing the first and second semiconductor structures together with a force column configured to apply uniform pressure to the entire bond interface area between the first surfaces.

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Manchester, NH, United States of America

Robert Campbell