Motorola Corporation

Robert C Taft

Perry H Pelley

James D Hayden

Arkalgud R Sitaram

Craig D Gunderson

Ravi Subrahmanyan

In one embodiment, delamination of a patterned silicon nitride anti-reflective layer (26) from an underlying patterned tungsten silicide layer (32), is prevented by forming a thin silicon layer (30) between the patterned tungsten silicide layer (32) and the overlying patterned silicon nitride anti-reflective layer (26).

Conductive interconnect structure and method of formation

An SRAM memory cell (10) is provided a boosted voltage by a charge pump (56) to reduce the soft error rate within the SRAM (10) and to improve bit cell stability. A voltage regulator (58) is coupled to the charge pump (56) to regulate the operation of the charge pump (56) and its outputted boosted voltage. The voltage regulator (58) regulates the boosted voltage over three operating states: low supply voltage, steady state operation, and burn-in.

Voltage regulator for regulating an output voltage from a charge pump

A charge pump (40) is implemented with several stages (30), including a control stage (50), in a manner integral with a ring-oscillator loop. The charge pump (40) is more efficient for producing voltage VBB to supply to a substrate well implementing circuitry such as a DRAM or SRAM (61), since there are no threshold voltage drops across any of the critical path transistors (M3) within the charge pump (40). This is accomplished by providing a boosted signal level from the proceeding stage (30). In the design, parasitic diode leakage is negligible.

Charge pump having reduced threshold voltage losses

Vertically stacked regions of n-type and p-type conductivity are formed around bipolar and field effect transistors to reduce parasitic capacitance between the semiconductor device and surrounding well regions. Under reverse bias a portion of the vertically stacked region is fully depleted and thus reduces the parasitic capacitance between the semiconductor device and the well region.

Method of formation of bipolar transistor having reduced parasitic

Semiconductor device

Method of forming conductive interconnect structure

A method for forming a first doped region (24) and a second doped region (26) within a substrate (12). A masking layer (14) overlies the substrate (12). A first region (20) of the masking layer (14) is etched to form a first plurality of openings. A second region (22) of the masking layer (14) is etched to form a single opening or a second plurality of openings different in geometry from the first plurality of openings. A single ion implant step or an equivalent doping step is used to dope exposed portions of the substrate (12). The geometric differences in the masking layer (14) between region (20) and region (22) results in the formation of the first and second doped regions (24 and 26) wherein the first and second doped regions (24 and 26) vary in doping uniformity, doping concentration, and doping junction depth.

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Austin, TX, United States of America

Robert C Taft